DLA SMD-5962-85126 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL BUFFERS MONOLITHIC SILICON《硅单块 缓冲器低频率肖脱基晶体管-晶体管逻辑电路 双极数字微型电路》.pdf

《DLA SMD-5962-85126 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL BUFFERS MONOLITHIC SILICON《硅单块 缓冲器低频率肖脱基晶体管-晶体管逻辑电路 双极数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-85126 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL BUFFERS MONOLITHIC SILICON《硅单块 缓冲器低频率肖脱基晶体管-晶体管逻辑电路 双极数字微型电路》.pdf（10页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Delete CAGE 01295 from 8512601BX. Add CAGE 04713 to approved source list. Delete VOHtest; add to recommended operating conditions. Change tPLH(10, 11) in table I. Table I, prop. delays, add “A or B to Y“. Prop. delay: Change RL. Revise to militar

2、y drawing format. Delete IOLtest in table I. 87-12-31 M. A. Frye B Add device type 02. Add figure 3: Test circuit and switching waveforms. Update the boilerplate. 92-09-11 M. L. Poelking C Update to current requirements. Editorial changes throughout. - gap 05-12-15 Raymond Monnin CURRENT CAGE CODE 6

3、7268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Monica L. Grosel DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Robert P. Evans COLUMBUS, OHIO 43218-3990

4、 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, BUFFERS, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 85-10-03 MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE

5、CODE 14933 85126 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E070-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85126 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 22

6、34 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 85126 01 B X Drawing numb

7、er Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS33 Quadruple two-input positive NOR buffers with open collector outputs 02 54LS28 Quadruple t

8、wo-input positive NOR buffers 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style B GDFP4-F14 14 flat pack C GDIP1-T dual-in-line D GDFP1-F14 14 flat pack 2 CQCC1-N20 20 square chip carrier 1.2.3 L

9、ead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +7.0 V dc Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Junction

10、 temperature (TJ) . +175C Maximum power dissipation (PD) per device 1/ . 75.9 mW Thermal resistance, junction-to-case (JC) See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Maximum high level output voltage (VOH) (type 01) 5.5 V

11、dc Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.7 V dc Maximum high level output current (IOH) (type 02) . -1.2 mA Maximum low level output current (IOL) 12 mA Case operating temperature range (TC) . -55C to +125C _ 1/ Must withstand the added PDdue to sh

12、ort circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85126 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.

13、1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specif

14、ications and Standards (DoDISS) and supplement thereto, cited in the solicitation. 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these

15、 documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electroni

16、c Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the Standardizatio

17、n Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applica

18、ble laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produ

19、ced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accorda

20、nce with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certi

21、fication mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case

22、 outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 2. 3.2.4 Test circuits and switching waveforms. The test circuits and switching wavef

23、orms shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electric

24、al test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85126 DEFENSE SUPPLY CENTER COLUM

25、BUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance m

26、ark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificat

27、e of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufac

28、turers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change

29、. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be mad

30、e available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all dev

31、ices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to th

32、e preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as

33、 specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D insp

34、ections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. Provided by IHSNot fo

35、r ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85126 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditio

36、ns -55C TC +125C 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups Device type Min Max Unit High level output voltage VOHVCC= 4.5 V, VIL= 0.7 V, IOH= -1.2 mA 1, 2, 3 02 2.5 V Low level output voltage VOLVCC= 4.5 V, VIH= 2.0 V, IOL= 12 mA, VIL= 0.7 V 1, 2, 3 All 0.4 V Input clamp voltage V

37、ICVCC= 4.5 V, IIN= -18 mA, TC= +25C 1 All -1.5 V High level output current IOHVCC= 4.5 V, VIH= 2.0 V, VOUT= 5.5 V, VIL= 0.7 V 1, 2, 3 01 250 A IIH1VCC= 5.5 V, VIH= 7.0 V 1, 2, 3 100 High level input current IIH2VCC= 5.5 V, VIH= 2.7 V 1, 2, 3 All 20 A Low level input current IILVCC= 5.5 V, VIL= 0.4 V

38、 1, 2, 3 All -0.4 mA Short-circuit output current 1/ IOSVCC= 5.5 V 1, 2, 3 02 -30 -130 mA ICCHVCC= 5.5 V, VIN= 0.0 V Outputs high 1, 2, 3 3.6 Supply current ICCLVCC= 5.5 V, VIN= 4.5 V Outputs low 1, 2, 3 All 13.8 mA Functional testing See 4.3.1c 7 All 01 32 9 02 24 01 45 tPLH10, 11 02 34 01 28 9 02

39、24 01 39 Propagation delay time, A or B to Q tPHLVCC= 5.0 V, RL= 667 5%, CL= 50 pF 10% 2/ 10, 11 02 34 ns 1/ Not more than one output should be shorted at a time and the duration of the short circuit should not exceed 1 second. 2/ Propagation delay time testing may be done using either RL= 667 or RL

40、= 2 k. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85126 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 Device types 01 and 02 Case outlines B, C, and D

41、 2 Terminal number Terminal symbol 1 1Y NC 2 1A 1Y 3 1B 1A 4 2Y 1B 5 2A NC 6 2B 2Y 7 GND NC 8 3A 2A 9 3B 2B 10 3Y GND 11 4A NC 12 4B 3A 13 4Y 3B 14 VCC3Y 15 NC 16 4A 17 NC 18 4B 19 4Y 20 VCCNC = No connection FIGURE 1. Terminal connections. Device types 01 and 02 Inputs Output A B Y L L H L H L H L

42、L H H L H = High level voltage L = Low level voltage FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85126 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 D

43、SCC FORM 2234 APR 97 NOTES: 1. CLincludes probe and jig capacitance. 2. All diodes are 1N3064 or equivalent. 3. All input pulses have the following characteristics: PRR 1 MHz, ZOUT 50 , tr 15 ns, tf 6 ns. 4. The outputs are measured one at a time with one input transition per measurement. FIGURE 3.

44、Test circuits and switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85126 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electr

45、ical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9, 10*, 11* Groups C

46、 and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroup 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Ste

47、ady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify

48、 the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85126 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 5. PACKAGING 5.1 Packaging requireme