DLA SMD-5962-84069 REV F-2005 MICROCIRCUIT DIGITAL CMOS BUS CONTROLLER MONOLITHIC SILICON《硅单片总线控制器 氧化物半导体数字微型电路》.pdf
《DLA SMD-5962-84069 REV F-2005 MICROCIRCUIT DIGITAL CMOS BUS CONTROLLER MONOLITHIC SILICON《硅单片总线控制器 氧化物半导体数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-84069 REV F-2005 MICROCIRCUIT DIGITAL CMOS BUS CONTROLLER MONOLITHIC SILICON《硅单片总线控制器 氧化物半导体数字微型电路》.pdf(17页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Changes to recommended operating conditions, table I, and table II. Convert to Military Drawing format. Editorial changes throughout. 87-04-17 W. Heckman C Changes to tables I and II. Editorial changes throughout. Changed code ident. number to 67
2、268. 87-10-07 W. Heckman D Convert to new boilerplate. Changes to table I. Editorial changes throughout. 90-01-10 W. Heckman E Add device type 02 to drawing. Editorial changes throughout. 94-11-15 Thomas M. Hess F Update boilerplate to MIL-PRF-38535 requirements. - CFS 05-03-17 Thomas M. Hess THE OR
3、IGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV F F SHEET 15 16 REV F F F F F F F F F F F F F F REV STATUS OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Jeffery Tunstall CHECKED BY Tim H. Noh DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/w
4、ww.dscc.dla.mil APPROVED BY William K. Heckman DRAWING APPROVAL DATE 90-10-01 MICROCIRCUIT, DIGITAL, CMOS, BUS CONTROLLER, MONOLITHIC SILICON SIZE A CAGE CODE 67268 84069 STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC
5、 N/A REVISION LEVEL F SHEET 1 OF 16 DSCC FORM 2233 APR 97 5962-E209-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 84069 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC F
6、ORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84069 01 R A Drawin
7、g number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Frequency Circuit function 01 82C88 8 MHz CMOS monolithic bus controller 02 82C88 10 MHz CMOS monolithic bus
8、 controller 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specifi
9、ed in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VCC) (referenced to ground) +8.0 V dc maximum Input, output, or I/O voltage applied . GND 0.5 V dc to VCC+ 0.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1 W Lead temperature (soldering, 1
10、0 seconds). +275C Maximum junction temperature (TJ) . +150C Thermal resistance, junction-to-case (JC): Case outlines R and 2. See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc to 5.5 V dc Frequency of operation 8 MHz maximum Case operating temperature range (
11、TC) . -55C to +125C Command disable time (tAEHCZ) 40 ns maximum 1/ _ 1/ measured at 0.5 V change in VOUT. Reference parameter 20 on figure 3 and test condition 4 on figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 84069 STANDARD MICRO
12、CIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent spec
13、ified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standa
14、rd Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/q
15、uicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing take
16、s precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices a
17、nd as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturer
18、s approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications
19、 shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MI
20、L-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Functional diagram. The functional diagram shall be as specified on figure 2. 3.2.4 Timin
21、g waveforms. The timing waveforms shall be as specified on figure 3. 3.2.5 AC test circuit and waveform. The AC test circuit and waveform shall be as specified on figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 84069 STANDARD MICROCI
22、RCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ca
23、se operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall
24、 be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced
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