DLA SMD-5962-80021 REV J-2005 MICROCIRCUITS DIGITAL LOW POWER SCHOTTKY TTL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS MONOLITHIC SILICON《硅单片三态输出的总线收发器 肖脱基小功率TTL数字微型电路》.pdf
《DLA SMD-5962-80021 REV J-2005 MICROCIRCUITS DIGITAL LOW POWER SCHOTTKY TTL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS MONOLITHIC SILICON《硅单片三态输出的总线收发器 肖脱基小功率TTL数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-80021 REV J-2005 MICROCIRCUITS DIGITAL LOW POWER SCHOTTKY TTL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS MONOLITHIC SILICON《硅单片三态输出的总线收发器 肖脱基小功率TTL数字微型电路》.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED C Delete Vendor, CAGE 18324. Revise to military drawing format. 87-04-09 N. A. Hauck D Add vendor CAGE 18324. Change drawing code ident. no. to 67268. Editorial changes throughout. 87-10-06 R. R. Evans E Changes in accordance with NOR 5962-R181-92.
2、 -tvn 92-04-29 Monica L Poelking F Changes in accordance with NOR 5962-R140-93. -ltg 93-08-17 Monica L Poelking G Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 02-09-24 Raymond Monnin H Add class “V“ to document. Add case outline R. Update to reflect
3、 latest changes in format and requirements. Editorial changes throughout. -les 04-01-07 Raymond Monnin J Update to reflect latest changes in format and requirements. Editorial changes throughout. les 05-03-24 Raymond Monnin CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REP
4、LACED. REV SHET REV SHET REV STATUS REV J J J J J J J J J J J J OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Monica Grosel DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILAB
5、LE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUITS, DIGITAL, LOW POWER SCHOTTKY TTL, BUS TRANSCEIVER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 81-07-30 WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL J SIZE A CAGE CODE 14933 80021 SHEET 1
6、OF 12 DSCC FORM 2233 APR 97 5962-E228-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80021 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 S
7、cope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choic
8、e of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 80021 01 2 A Drawing number Device type (see 1.2.2) Case outline (see 1.2.4)Lead finish (see 1.2.5) For device class V: 5962 - 80021 01 V R A Fe
9、deral stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are ma
10、rked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type. The device type identifies the circuit function as follows
11、: Device type Generic number Circuit function 01 54LS245 Octal bus transceivers with three-state outputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the o
12、riginal issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
13、accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80021 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVI
14、SION LEVEL J SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 dual-in-line S GDFP2-F20 or CDFP3-F20 20 flat 2 CQCC1-N20 20 square chip carri
15、er 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage range. -0.5 V dc to +7.0 V dc DC input voltage -0.5 V dc VCC+ 0.5 V dc Storage temperature -65C to +150C
16、Maximum power dissipation (PD) 2/ 522.5 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC): Cases R, S and 2 . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc minimum to 5.5 V dc m
17、aximum Minimum high level input voltage (VIH) . 2.0 V dc Case operating temperature range (TC) -55C to +125C High level output current (IOH) -12 mA maximum Low level output current (IOL) 12 mA maximum 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following speci
18、fication, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Sp
19、ecification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawing
20、s. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rating may cause permanen
21、t damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Must withstand the added PDdue to short circuit test e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT
22、DRAWING SIZE A 80021 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in thi
23、s document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the de
24、vice manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specifi
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