DLA MIL-PRF-31032 5 A-2012 PRINTED WIRING BOARD RIGID MULTILAYERED THERMOPLASTIC THERMOSETTING OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL WITH PLATED THROUGH HOLES FOR .pdf

《DLA MIL-PRF-31032 5 A-2012 PRINTED WIRING BOARD RIGID MULTILAYERED THERMOPLASTIC THERMOSETTING OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL WITH PLATED THROUGH HOLES FOR .pdf》由会员分享，可在线阅读，更多相关《DLA MIL-PRF-31032 5 A-2012 PRINTED WIRING BOARD RIGID MULTILAYERED THERMOPLASTIC THERMOSETTING OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL WITH PLATED THROUGH HOLES FOR .pdf（55页珍藏版）》请在麦多课文档分享上搜索。

1、METRIC The document and process conversion measures necessary to comply with this amendment shall be completed by 10 March 2013. MILPRF31032/5A 9 December 2012 SUPERSEDING MILPRF31032/5 20 August 2007 PERFORMANCE SPECIFICATION SHEET PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSET

2、TING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product described herein shall consist of t

3、his specification sheet and MILPRF31032. 1. SCOPE 1.1 Scope. This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, constructed of thermoplastic base materia

4、ls, that will use soldering for component/part mounting (see 6.1.1). Mixed base material printed boards containing both thermoplastic and thermosetting resin base materials are also covered. The printed board may contain an internal metal core or external heat sink. 1.2 Classification. Printed board

5、s covered by this specification sheet are classified by the following types and compositions, as specified (see 3.1). 1.2.1 Printed board type. Printed boards covered by this specification sheet are classified by the following types: 3 Rigid multilayer board without blind or buried vias. 4 Rigid mul

6、tilayer board with blind and/or buried vias. 5 Rigid multilayer board without blind and/or buried vias, with metal core or metal backing external heatsink. 6 Rigid multilayer with blind and/or buried vias, with metal core or metal backing external heatsink. 1.2.2 Composition. The composition designa

7、tion is defined by the resin system of the dielectric base material (see 6.7) as follows: H Homogenous thermoplastic base material printed boards. Printed board of this composition contain only thermoplastic resin base materials (see 6.7.1). M Mixed based material printed boards. Printed boards of t

8、his composition contain layers of thermoplastic and thermosetting resin base materials (see 6.7.2). S Homogenous thermosetting base material printed boards. Printed board of this composition contain only thermosetting resin base materials (see 6.7.3). Comments, suggestions, or questions on this docu

9、ment should be addressed to: DLA Land and Maritime, ATTN: VAC, P. O. Box 3990, Columbus, OH 432183990 or emailed to 5998.Documentsdla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https:/assist.dla.mil.

10、AMSC N/A FSC 5998 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MILPRF31032/5A 2 1.2.3 Wrap plating (surface and knee continuous copper plating). The wrap plating grade designation is defined by the amount of plated-through hole surface and knee co

11、ntinuous copper plating thickness remaining after surface processing. The grades are as follows: A Printed boards of this grade have 80 percent or more of the specified wrap plating thickness after surface processing. B Printed boards of this grade have 50 percent or more of the specified wrap plati

12、ng thickness after surface processing. C Printed boards of this grade have 20 percent or more of the specified wrap plating thickness after surface processing. Unless otherwise specified, the default grade of wrap copper plating is grade A for printed board designs that will not undergo planarizatio

13、n and grade B for designs that require planarization. 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additio

14、nal information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 2.2 Government docume

15、nts. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SP

16、ECIFICATIONS MILPRF31032 Printed Circuit Board/Printed Wiring Board, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MILSTD202 Electronic and Electrical Component Parts. MILSTD883 Microcircuits. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch or https:

17、/assist.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 191115094.) 2.2.2 Other Government documents, drawings, and publications. The following other Government documents, drawings, and publications form a part of this document to the extent

18、 specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (NASA) NASA 1124 Outgassing Data for Selecting Spacecraft Materials. (Hard copies of this document are no longer available from

19、the NASA Goddard Materials Branch or the Document Automation and Production Service Detachment Office (DAPS). This information is only available at http:/outgassing.nasa.gov. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MILPRF31032/5A 3 2.3 Non-Go

20、vernment publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents are those cited in the solicitation or contract. ASTM INTERNATIONAL (ASTM) ASTM B567 Standard Test Method for Measurement of Coating Thi

21、ckness by the Beta Backscatter Method. ASTM B568 Standard Test Method for Measurement of Coating Thickness by XRay Spectrometry. ASTM D3165 Standard Test Method for Strength Properties of Adhesives in Shear by Tension Loading of Single-LapJoint Laminated Assemblies. ASTM E53 Standard Test Method for

22、 Determination of Copper in Unalloyed Copper by Gravimetry. ASTM E345 Standard Test Methods of Tension Testing of Metallic Foil. ASTM E595 Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment. (Application for copies should be

23、addressed to the ASTM International, 100 Barr Harbor Drive, P. O. Box C700, West Conshohocken, PA 194282959 or http:/www.astm.org.) JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JESD22A102 Accelerated Moisture Resistance Unbiased Autoclave. (Application for copies should be addressed to JEDEC Sol

24、id State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201 or http:/www.jedec.org.) IPC ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES (IPC) IPCT50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits. IPC2141 Design Guide for HighSpeed Controlled

25、Impedance Circuit Boards. IPC2221 Generic Standard on Printed Board Design. IPC2251 Design Guide for the Packaging of High Speed Electronic Circuits. IPC2252 Design and Manufacturing Guide for RF/Microwave Circuit Boards. IPCA600 Acceptability of Printed Boards. IPCOI645 Standard for Visual Optical

26、Inspection Aids. IPCTM650 Test Methods Manual. IPCCC830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies. IPC9252 Requirements for Electrical Testing of Unpopulated Printed Boards. JSTD003 Solderability Tests for Printed Boards. (Application for copies sh

27、ould be addressed to the IPC Association Connecting Electronics Industry, 3000 Lakeside Drive, Suite 309 S, Bannockburn, IL 600151249 or http:/www.ipc.org.) (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These

28、documents also may be available in or through libraries or other informational services.) 2.4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedenc

29、e. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MILPRF31032/5A 4 3. REQUIREMENTS 3.1 Printed board detail requirements. Pr

30、inted boards delivered under this specification sheet shall be in accordance with the requirements as specified herein, and documented in the printed board procurement documentation. Only printed wiring boards which are verified and meet all the applicable performance requirements contained herein a

31、nd the design, construction, and material requirements of the printed board procurement documentation shall be certified as compliant and delivered. 3.1.1 Conflicting requirements. The order of precedence of conflicting requirements shall be in accordance with MILPRF31032. 3.1.2 Reference to printed

32、 board procurement documentation. For the purposes of this specification sheet, when the term “specified“ is used without additional reference to a specific location or document, the intended reference shall be to the applicable printed board procurement documentation. 3.1.3 Terms and definitions. T

33、he definitions for all terms used herein shall be as specified in IPCT50 and those contained herein. 3.2 Qualification. Printed boards furnished under this specification sheet shall be technologies that are manufactured by a manufacturer authorized by the qualifying activity for listing on the appli

34、cable qualified manufacturers list before contract award (see 4.2 and 6.3). 3.3 Design (see 3.1 and 6.2). Printed boards shall be of the design specified. Unless otherwise noted herein, if individual design parameters are not specified in the printed board procurement documentation, then the baselin

35、e design parameters shall be as specified in IPC2221, IPC2141, IPC2251, and IPC2252, performance class 3. Test coupons shall be as specified in the applicable design standards and shall reflect worstcase design conditions of the printed boards that they represent. 3.3.1 Conductors. This specificatio

36、n sheet differentiates between low frequency conductors, ground planes, and voltage planes and those conductors used for high frequency signals. The terms “signal conductor“, “signal line“, and “signal plane“ are used within this specification sheet to distinguish those conductive patterns from nonc

37、ritical low frequency conductors, ground planes, and voltage planes. 3.3.2 Criticalcontrolled conductors and spacings. Unless otherwise specified, when necessary for proper verification of criticalcontrolled widths or criticalcontrolled spacings, signal conductors or the spacing between them deemed

38、critical shall be identified as such. The terms “criticalcontrolled signal conductor“, “criticalcontrolled signal line“ and “criticalcontrolled spacing“ are used herein when addressing these type of conductive pattern features. 3.4 Printed board materials. All materials used in the construction of c

39、ompliant printed boards shall comply with the applicable specifications referenced in the printed board procurement documentation. If materials used in the production of printed boards are not specified, then it is the manufacturers responsibility to use materials which will meet the performance req

40、uirements of this specification sheet. Acceptance or approval of any printed board material shall not be construed as a guarantee of the acceptance of the completed printed board. 3.4.1 Prohibited materials (see 6.8). Unless otherwise specified, electroplated or immersion tin and electroplated silve

41、r shall not be used as a finish either externally, internally, or as an undercoat. Electroplated or immersion tin is any tin or tin alloy containing more than 97 percent tin. Tin shall be alloyed with a minimum of three percent lead. The use of tinlead (SnPb) finish is acceptable provided that the m

42、inimum lead content is three percent. Acceptance or approval of any constituent material shall not be construed as a guaranty of the acceptance of the finished product. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MILPRF31032/5A 5 3.5 External vis

43、ual and dimensional requirements. Printed board test specimens (the finished printed boards or supporting test coupons, as applicable) shall conform to the requirements specified in 3.5.1 through 3.5.5.3. After solder mask application, the printed board test specimens shall also conform to the requi

44、rements of 3.5.4. Scratches, dents, and tool marks shall not bridge or expose signal conductors, expose base metal, expose or disrupt reinforcement fibers, reduce dielectric properties, and reduce spacing below the minimum requirements herein. The figures, illustrations, and photographs contained in

45、 IPCA600 can aid in the visualization of externally observable accept/reject conditions of test specimens. 3.5.1 Base material. 3.5.1.1 Edges of base material. Base material edges include the external edge of the printed board, the edges of cutouts, and the edges of nonplatedthrough holes. Burrs, ch

46、ips, delaminations, haloing, nicks, and other penetrations along the base material edges of completed printed boards shall be acceptable provided the imperfection does not reduce the edge spacing specified by more than 50 percent. If no edge spacing requirement is specified, the imperfection penetra

47、tion shall not exceed 2.5 mm (.0984 inch). Base material edges include the external edge of the printed board, the edges of cutouts, and the edges of nonplatedthrough holes. Loose metallic burrs shall not be acceptable. 3.5.1.2 Surface imperfections. Imperfections in the surface of the base material

48、 such as blistering, burrs, cuts, dents, exposed reinforcement material fibers, foreign materials, gouges, nicks, pits, resin scorched areas, resin starved areas, scratches, tool marks, variations in color such as white spots or black spots, or other visual defects detrimental to the performance of

49、the base material shall be acceptable in localized concentrations providing the following conditions are met: a. The imperfection does not bridge conductors. b. The dielectric spacing between the imperfection and a conductor is not reduced below the specified minimum conductor spacing requirements. c. Localized concentration of t