DLA SMD-5962-91760 REV D-2007 MICROCIRCUIT MEMORY DIGITAL BICMOS ONE TIME PROGRAMMABLE LOGIC DEVICE MONOLITHIC SILICON《硅单块 一次可编程逻辑设备 双互补金属氧化物半导体 数字主储存器微型电路》.pdf

《DLA SMD-5962-91760 REV D-2007 MICROCIRCUIT MEMORY DIGITAL BICMOS ONE TIME PROGRAMMABLE LOGIC DEVICE MONOLITHIC SILICON《硅单块 一次可编程逻辑设备 双互补金属氧化物半导体 数字主储存器微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-91760 REV D-2007 MICROCIRCUIT MEMORY DIGITAL BICMOS ONE TIME PROGRAMMABLE LOGIC DEVICE MONOLITHIC SILICON《硅单块 一次可编程逻辑设备 双互补金属氧化物半导体 数字主储存器微型电路》.pdf（21页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Updated document. Added device types 07 thru 10. Added CAGE 18324. Added L package. 94-10-17 M. A. Frye B Added device types 11 thru 14. Added device class N option for some devices. Added X package, represents plastic dual-in-line. Editorial cha

2、nges throughout. 95-12-15 M. A. Frye C Updated parameter fMAX2in table I, added new test ( tCF) for devices 07, 08, 11-14, and added footnote 8/ to table I. Changed the measured value in table IIB. Removed cage 65786 as a source. 96-04-30 M. A. Frye D Boilerplate update, part of 5 year review. ksr 0

3、7-05-24 Robert M. Heber REV SHET REV D D D D D D SHEET 15 16 17 18 19 20 REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Rajesh Pithadia DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Kenneth Rice COLUMBUS, OHI

4、O 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL APPROVED BY Michael Frye DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-01-19 MICROCIRCUIT, MEMORY, DIGITAL, BICMOS, ONE TIME PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON AMSC N/A REVISION L

5、EVEL D SIZE A CAGE CODE 67268 5962-91760 SHEET 1 OF 20 DSCC FORM 2233 APR 97 5962-E315-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91760 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISIO

6、N LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents three product assurance class levels consisting of space application (device class V), high reliability (device classes M and Q), and nontraditional performance environment (device class N). A choice of case outlines

7、and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. For device class N, the user is cautioned to assure that the device is appropriate for the application environmen

8、t. 1.2 PIN. The PIN is as shown in the following example: 5962 - 91760 01 M 3 A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes

9、 N, Q, and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA

10、 device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time 01 22V10G-15 22-input 10-output and-or-logic array 15 ns 02 22V10G-12 22-input 10-output and-or-logic array 12 ns 03 22V10G-10 22-input 10-output and-or

11、-logic array 10 ns 04 22VP10G-15 22-input 10-output and-or-logic array 15 ns 05 22VP10G-12 22-input 10-output and-or-logic array 12 ns 06 22VP10G-10 22-input 10-output and-or-logic array 10 ns 07 22V10A 22-input 10-output and-or-logic array 10 ns 08 22V10B 22-input 10-output and-or-logic array 8.5 n

12、s 09 22V10G-7.5 22-input 10-output and-or-logic array 7.5 ns 10 22VP10G-7.5 22-input 10-output and-or-logic array 7.5 ns 11 22V10A 22-input 10-output and-or-logic array 10 ns 12 22V10A 22-input 10-output and-or-logic array 10 ns 13 22V10B 22-input 10-output and-or-logic array 8.5 ns 14 22V10B 22-inp

13、ut 10-output and-or-logic array 8.5 ns 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN c

14、lass level B microcircuits in accordance with MIL-PRF-38535, appendix A N Certification and qualification to MIL-PRF-38535 with a nontraditional performance environment (encapsulated in plastic) Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or n

15、etworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91760 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835, JEDEC Publication 95,

16、 and as follows: Outline letter Descriptive designator Terminals Package style Document 3 CQCC1-N28 28 Square leadless chip carrier package MIL-STD-1835 L GDIP3-T24 24 Dual-in-line package MIL-STD-1835 X MS-001 AF 24 Plastic dual-in-line package JEP 95 1.2.5 Lead finish. The lead finish is as specif

17、ied in MIL-PRF-38535 for device classes N, Q, and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range to ground potential (VCC) -0.5 V dc to +7.0 V dc DC voltage range applied to the outputs in the high-Z state -0.5 V dc to +VCCMaximum power di

18、ssipation. 1.045 W 3/ Lead temperature (soldering, 10 seconds). +260C Thermal resistance, junction-to-case (JC): Cases 3 and L . See MIL-STD-1835 Case X. 22C/W Junction temperature (TJ). +175C Storage temperature range (TSTG) . -65C to +150C Temperature (under bias) range -55C to +125C Devices 11-14

19、. -40C to +85C 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc minimum to +5.5 V dc maximum Supply voltage range (VCC) (for devices 07,08,11,12,13,14) +4.75 V dc minimum to +5.25 V dc maximum Ground voltage (GND) . 0 V dc Input high voltage (VIH). 2.0 V dc minimum 4/ Input

20、 low voltage (VIL) 0.8 V dc maximum 4/ Case operating temperature range (TC) . -55C to +125C Case operating temperature range (TC) (for devices 11-14) -40C to +85C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks fo

21、rm a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENS

22、E STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are ava

23、ilable online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil from the Standardization Document Order Desk, 700 Robins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation

24、at the maximum levels may degrade performance and affect reliability. 2/ All voltages referenced to VSS. 3/ Must withstand the added PDdue to short circuit test; e.g., IOS. 4/ These are absolute values with respect to device ground. Overshoots due to system or tester noise are included. Provided by

25、IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91760 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 2.2 Non-Government publications. The following documents form

26、a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation. AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM Standard F1192-00 - Standard Guide for the Measurement of Single Event Phenomena from Heavy Io

27、n Irradiation of Semiconductor Devices. (Applications for copies of ASTM publications should be addressed to: ASTM International, PO Box C700, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959; http:/www.astm.org.) ELECTRONICS INDUSTRIES ALLIANCE (EIA) JEDEC Standard EIA/JESD78 - IC Latch-Up T

28、est. JEDEC Publication 95 - Registered and Standard Outlines for Semiconductor Devices (Copies of these documents are available online at www.jedec.org/ or from the Electronics Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834). (Non-Government standards and other publications are

29、 normally available from the organizations that prepare or distribute the documents. These documents also may be available in or through libraries or other informational services.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, t

30、he text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes N, Q, and V shall be in accordance with MI

31、L-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535,

32、 appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes N, Q, and V or MIL-PRF-38535, appendix A and herein for dev

33、ice class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 2. 3.2.3.1 Unprogrammed devices. The trut

34、h table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 2. When required in screening (see 4.2 herein) or quality conformance inspection, groups A, C, D, or E (see 4.4 herein), the devices shall be programmed by the manufacturer prior to test.

35、 A minimum of 50 percent of the total number of logic cells shall be programmed or at least 25 percent of the total logic cells shall be programmed for any altered item drawing pattern. 3.2.3.2 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered it

36、em drawing. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range.

37、3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRA

38、WING SIZE A 5962-91760 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 3.5 Verification of programmability. When specified, devices shall be verified as programmed (see 4.6 herein) to the specified pattern. As a minimum, verification shall cons

39、ist of performing a functional test (subgroup 7) to verify that all bits are in the proper state. Any bit that does not verify to be in the proper state shall constitute a device failure, and shall be removed from the lot. 3.6 Processing options. Since the device is capable of being programmed by ei

40、ther the manufacturer or the user to result in a wide variety of configurations; two processing options are provided for selection in the contract, using an altered item drawing. 3.6.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 3.2.

41、3.1 and table IIA. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program configuration. 3.6.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions herein, including the requirements of the al

42、tered item drawing, shall be satisfied by the manufacturer prior to delivery. 3.7 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitatio

43、ns, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes N, Q, and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-

44、38535, appendix A. 3.7.1 Certification/compliance mark. The certification mark for device classes N, Q, and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.8 Certificate of compliance. For devic

45、e classes N, Q, and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an appro

46、ved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes N, Q, and V, the requirements of MIL-PRF-38535 and herei

47、n or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.9 Certificate of conformance. A certificate of conformance as required for device classes N, Q, and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircu

48、its delivered to this drawing. 3.10 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.11 Verification and review for device cl

49、ass M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.12 Microcircuit group assignment for device class