DLA DSCC-VID-V62 12620-2012 MICROCIRCUIT DIGITAL MIXED SIGNAL MICROCONTROLLER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE 18 19 20 21 REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 PMIC N/A PREPARED BY Phu H. Nguyen DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landa
2、ndmaritime.dla.mil/ Original date of drawing YY MM DD CHECKED BY Phu H. Nguyen TITLE MICROCIRCUIT, DIGITAL, MIXED SIGNAL MICROCONTROLLER, MONOLITHIC SILICON 12-12-14 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/12620 REV PAGE 1 OF 21 AMSC N/A 5962-V075-12 Provided by IHSNot fo
3、r ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12620 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance mixed signal microcontroller microcircu
4、it, with an operating temperature range of -40C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/12
5、620 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 MSP430G2230-EP Mixed signal microcontroller 1.2.2 Case outline(s). The case outlines are as specified herein. Outline letter Number of pi
6、ns JEDEC PUB 95 Package style X 8 JEDEC MS-012 Plastic small outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladi
7、um Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12620 REV PAGE 3 1.3 Absolute maximum ratings. 1/ Voltage applied at VCCto VSS. -0.3 V to 4.1 V Voltage applied to
8、 any pin -0.3 V to VCC+0.3 V 2/ Diode current at any device terminal 2 mA Storage temperature: 3/ Unprogrammed device -55C to 150C Programmed device -40C to 150C 1.4 Recommended operating conditions. Supply voltage, (VCC): During program execution . 1.8 V to 3.6 V During flash program/erase . 2.2 V
9、to 3.6 V Supply voltage, (VSS) 0 V Operating free air temperature, (TA) . -40C to 125C Processor frequency (Maximum MCLK frequency) 4/ 5/ VCC= 1.8 V, Duty cycle = 50% 10% dc to 6 MHz VCC= 2.7 V, Duty cycle = 50% 10% dc to 12 MHz VCC= 3.3 V, Duty cycle = 50% 10% dc to 16 MHz 2. APPLICABLE DOCUMENTS J
10、EDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEP95 Registered and Standard Outlines for Semiconductor Devices J-STD-020 Joint IPC/JEDEC standard for moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices. (Copies of these documents are available online at htt
11、p:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201.) 1/ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the devic
12、e at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 2/ All voltage values referenced to VSS. The JTAG fuse blow voltage, VFBis allowed to e
13、xceed the absolute maximum rating. The voltage is applied to the TEST pin when blowing the JTAG fuse 3/ Higher temperature may be applied during board soldering according to the current JEDEC J STD 020 specification with peak reflow temperatures not higher than classified on the device label on the
14、shipping boxes or reels. 4/ The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse width of the specified maximum frequency. 5/ Modules might have different maximum input clock specification. See the specification from the manufacturer data sheet.
15、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12620 REV PAGE 4 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part numb
16、er as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteris
17、tics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case ou
18、tline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Terminal function. The terminal function shall be as shown in figure 3. 3.5.4 Functional block diagram. The functional block diagram shall be as
19、shown in figure 4. 3.5.5 Safe operating area. The safe operating area shall be as shown in figure 5. 3.5.6 POR/Brownout Reset (BOR) vs Supply voltage. The POR/Brownout Reset (BOR) vs Supply voltage shall be as shown in figure 6. 3.5.7 VCC(drop) level with a Square voltage drop to gernerate a POR/Bro
20、wnout signal. The VCC(drop) level with a Square voltage drop to gernerate a POR/Brownout signal shall be as shown in figure 7. 3.5.8 VCC(drop) level with a Triangle voltage drop to gernerate a POR/Brownout signal. The VCC(drop) level with a Triangle voltage drop to gernerate a POR/Brownout signal sh
21、all be as shown in figure 8. 3.5.9 DCO wake-up time from LPM3/4 vs DCO frequency. The DCO wake-up time from LPM3/4 vs DCO frequency waveforms shall be as shown in figure 9. 3.5.10 USI low level output voltage vs output current. The USI low level output voltage vs output current shall be as shown in
22、figure 10. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12620 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions 2/ TAVCCLimits Unit Mi
23、n Max Active mode supply current into VCCexcluding external current Active mode (AM) current (1 MHz) IAM, 1MHzfDCO= fMCLK= 1 MHz, fACLK= 0 Hz, Program executes in flash, BCSCTL1 = CALBC1_1MHz, DCOCTL = CALDCO_1MHz, CPUOFF = 0, SCG0 = 0 SCG1 = 0, OSCOOFF = 0 2.2 V 220 TYP A 3 V 390 Low power mode Sup
24、ply current (into VCC) Excluding external current Low power mode 0 (LPM0) current 3/ ILPM0, 1MHzfMCLK= 0 MHz, fSMCLK= fCDO= 1 MHz, fACLK= 32,768 Hz, BCSCTL1 = CALBC1_1MHz, DCOCTL = CALDCO_1MHz, CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 25C 2.2 V 65 TYP A Low power mode 2 (LPM2) current 4/ ILPM2fMCL
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