DLA DSCC-VID-V62 09648-2009 MICROCIRCUIT DIGITAL ULTRA-LOW POWER PRECISION SERIES VOLTAGE REFERENCE MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Phu H. Nguyen DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing Y
2、Y MM DD CHECKED BY Phu H. Nguyen TITLE MICROCIRCUIT, DIGITAL, ULTRA-LOW POWER PRECISION SERIES VOLTAGE REFERENCE, MONOLITHIC SILICON 09-10-21 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/09648 REV PAGE 1 OF 14 AMSC N/A 5962-V004-10 Provided by IHSNot for ResaleNo reproduction
3、or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09648 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of An ultra low-power precision series voltage reference microcircuit, with
4、 an operating temperature range of -40C to +85C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/09648 - 01
5、X B Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Output voltage Circuit function 01 MAX6029 2.048 V Ultra-Low-Power precision Series Voltage Reference 02 MAX6029 2.500 V Ultra-Low-Power precision Series Voltage Refe
6、rence 03 MAX6029 3.000 V Ultra-Low-Power precision Series Voltage Reference 04 MAX6029 3.300 V Ultra-Low-Power precision Series Voltage Reference 05 MAX6029 4.096 V Ultra-Low-Power precision Series Voltage Reference 06 MAX6029 5.000 V Ultra-Low-Power precision Series Voltage Reference 1.2.2 Case out
7、line(s). The case outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 8 JEDEC MS012 Small outline Y 5 JEDEC MO178 Small outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish
8、 designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/0964
9、8 REV PAGE 3 1.3 Absolute maximum ratings. 1/ INto GND . -0.3 V to +13.0 V OUT to GND -0.3 V to the lower of +6.0 V and (VIN+ 0.3 V) Output to GND short circuit duration . Continuous Continuous power dissipation (TA= +70C) Case outline X (derate 5.9 mW/C above +70C) 470.6 mW Case outline Y (derate 7
10、.1 mW/C above +70C) 571 mW Operating temperature range -40C to +85C Storage temperature range . -65C to 150C Lead temperature (soldering , 10 sec) +300C Electro Static Discharge (ESD) Human Body Model (HBM) 1000 V Moisture Sensitivity Level (MSL) . Level 1 1.4 Thermal data table. Case outline letter
11、 X X Y Y Units PC Board Single Layer Multi-Layer 2/ Single Layer Multi-Layer 2/ Power dissipation (PD), maximum at +70C 471 606 247 313 mW Power dissipation (PD) derating above +70C 5.9 7.6 3.1 3.9 mW/C Thermal resistance, junction to case (JC) 40 38 82 81 C/W Thermal resistance, junction to ambient
12、 (JA) 170 132 324 256 C/W 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices JESD51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages (Applications for copies should be addressed to the Electronic Industries Alliance, 2500
13、 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 1/ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those
14、 indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For
15、 detailed information on package thermal considerations, refer to the manufacturer web site. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09648 REV PAGE 4 3. RE
16、QUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with
17、the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension.
18、The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. Provided by IHSNot for ResaleNo reproduction or n
19、etworking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09648 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions 2/ Device type 01 VIN= 2.5 V Limits Unit Min Max Output Output voltage V
20、OUTTA= +25C 2.0449 2.051 V Output voltage temperature coefficient TCVOUT3/ 4/ 30 ppm/C Line regulation VOUT/VINVIN= 2.5 V to 12. 6 V 200 V/V Load regulation VOUT/IOUTIOUT= 0 to 4 mA 0.7 V/A IOUT= 0 to -1 mA 5.5 Output short circuit current ISC60 TYP mA Long term stability VOUT/time 1000 hours at +25
21、C 150 TYP ppm Thermal hysteresis 5/ 140 TYP ppm Dynamic characteristics Noise voltage eOUTf = 0.1 Hz to 10 Hz 30 TYP VP-Pf = 10 Hz to 1 kHz 115 TYP VRMSRipple rejection VOUT/VINVIN = 2.5 V 200 mV, f = 120 Hz 43 TYP dB Turn ON setting time tRTo VOUT= 0.1 % of final value 450 TYP s Input Supply voltag
22、e Range VIN2.5 12.6 V Supply current IIN5.25 A Change in supply current IIN/VINVIN= 2.5 V to 12.6 V 1.5 A/V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDEN
23、T NO. 16236 DWG NO. V62/09648 REV PAGE 6 TABLE I. Electrical performance characteristics - Continued 1/ Test Symbol Conditions 2/ Device type 02 VIN= 2.7 V Limits Unit Min Max Output Output voltage VOUTTA= +25C Case outline Y 2.4963 2.5038 V Case outline X 2.495 2.505 Output voltage temperature coef
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