DLA DSCC-DWG-94030 REV B-2001 SEMICONDUCTOR DEVICE UNIDIRECTIONAL TRANSIENT SUPPRESSOR DIODE ARRAY《无定流向瞬间抑制二极管组半导电器件》.pdf

《DLA DSCC-DWG-94030 REV B-2001 SEMICONDUCTOR DEVICE UNIDIRECTIONAL TRANSIENT SUPPRESSOR DIODE ARRAY《无定流向瞬间抑制二极管组半导电器件》.pdf》由会员分享，可在线阅读，更多相关《DLA DSCC-DWG-94030 REV B-2001 SEMICONDUCTOR DEVICE UNIDIRECTIONAL TRANSIENT SUPPRESSOR DIODE ARRAY《无定流向瞬间抑制二极管组半导电器件》.pdf（10页珍藏版）》请在麦多课文档分享上搜索。

1、REVISIONSLTR DESCRIPTION DATE APPROVEDA Added PIND designator, reworkdocumentation, group C inspection26 June 2000 Monica PoelkingB Added statement to figure 1 concerning deviceconstruction, various editorial changes.15 July 2001 Thomas M. HessPREVIOUS CAGE CODE 14933 SUPERSEDED BY 037Z3.THE ORIGINA

2、L FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.Prepared in accordance with MIL-STD-100 Selected item drawingREVPAGEREVPAGEREV STATUSOF PAGESREV BBBBBBBBB BPAGES 12345678910PMIC N/A PREPARED BYRobert PettyDEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHOriginal date of drawing24 February 1995CHECKED BYAla

3、n BaroneTITLESEMICONDUCTOR DEVICE, UNIDIRECTIONALTRANSIENT SUPPRESSOR DIODE ARRAYAPPROVED BYKendall A. CottongimSIZEACODE IDENT. NO.14933DWG NO.94030REV B PAGE 1 OF 10 AMSC N/A 5961-E059DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo r

4、eproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIOSIZEACODE IDENT NO.037Z3DWG NO.94030REV B PAGE 21. SCOPE1.1 Scope. This drawing describes the detail requirements for a 500 Watt, unidirectional transient voltage suppressor diode array.1.2

5、Part or Identifying Number (PIN). The complete PIN shall be as follows:94030 -01 TX or TXV 1/ P 2/| | | | | | | Drawing Device type Screening level PINDnumber (see 1.2.1) (see 1.2.1) Tested1.2.1 Device types. The device types shall identify the quality assurance level and the reverse standoff voltag

6、e of the devices asfollows:Device type 1/ Figure number Reverse standoff voltage Quality level94030-01TX, TXV, TXP, TXVP 1 5 V dc 3/94030-11TX, TXV, TXP, TXVP 1 5 V dc 4/94030-02TX, TXV, TXP, TXVP 1 12 V dc 3/94030-12TX, TXV, TXP, TXVP 1 12 V dc 4/94030-03TX, TXV, TXP, TXVP 1 17 V dc 3/94030-13TX, T

7、XV, TXP, TXVP 1 17 V dc 4/94030-04TX, TXV, TXP, TXVP 1 24 V dc 3/94030-14TX, TXV, TXP, TXVP 1 24 V dc 4/94030-05TX, TXV, TXP, TXVP 1 30 V dc 3/94030-15TX, TXV, TXP, TXVP 1 30 V dc 4/1.3 Maximum ratings.t clamping (0 volts to BV min)less than 1 x 10-12seconds theoretical.Peak pulse power 500 W/positi

8、on at tp = 8 x 20 s at 25C.IF 10 amps, 1/120 sec at 25C.Operating and storage temps -55C to +150C.Repetition rate (duty cycle)0.01%.1.4 Primary electrical characteristics. Primary electrical characteristics at TC = +25C (unless stated otherwise).Column 1 Column 2 Column 3 Column 4 Column 5 Column 6

9、Column 7TypeVWM V(BR)IR = 1 mAVC at IPP1 = 1 A8 x 20 sVC at IPP2 = 10 A8 x 20 sIR at VRReverseleakage(maximum)CCapacitanceV(BR)(1)94030-0194030-0294030-0394030-0494030-05V dc512172430V dc613.319.226.733.3V(pk)9.519.127.538.347.8V(pk)10.623.533.947.258.8A2002222pF880440330275220mV/C514162229(1) Elect

10、rical characteristics for 94030-1X devices are identical to their corresponding 94030-0X device.1/ Screening level: TX and TXV levels correspond to JANTX and JANTXV equivalent (respectively)screening requirements fromMIL-PRF-19500.2/ “P“ suffix for PIND tested parts.3/ Group B testing, satisfied by

11、generic group B data available from the manufacturer.4/ Group B testing as specified herein (see 4.3.2).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIOSIZEACODE IDENT NO.037Z3DWG NO.94030REV B PAGE 32. AP

12、PLICABLE DOCUMENTS2.1 Government documents.2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of thisdocument to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the

13、Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation (see 6.2).SPECIFICATIONDEPARTMENT OF DEFENSEMIL-PRF-19500 - Semiconductor Devices, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL-STD-750 - Test Methods for Semiconduct

14、or Devices.(Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from theDocument Automation and Production Services (DAPS), Building 4D (DPM-DODSSP), 700 Robbins Avenue, Philadelphia, PA 19111-5094.)2.2 Order of precedence. In the event o

15、f a conflict between the text of this document and the references cited herein, the text of thisdocument takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specificexemption has been obtained.3. REQUIREMENTS3.1 Item requirements. The individual i

16、tem requirements shall be in accordance with MIL-PRF-19500 and as specified herein.3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified inMIL-PRF-19500 and as follows:Generic data. Generic data is defined as group B data from structur

17、ally identical devices, previously tested and manufactured withinthe past six months, on the same product manufacturing line as the devices in which the group B data is meant to satisfy.3.3 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-1950

18、0. Packagedimensions shall be in accordance with figure 1 of this drawing.3.3.1 Lead finish. Lead finish shall be solderable in accordance with MIL-STD-750, MIL-PRF-19500 and herein. Where a choice oflead finish is desired, it shall be specified in the acquisition document.3.3.2 Terminal connections

19、. Terminal connections shall be in accordance with figure 2.3.4 Marking. Marking shall be in accordance with MIL-PRF-19500 and as follows. a. First line marking: 94030-XXTX, TXV, TXP or TXVP (where XX is the device type).b. Second line marking: Manufacturers identification.c. Third line marking: Lot

20、 date code.d. Pin 1 identifier (contrasting color dot on top of package).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIOSIZEACODE IDENT NO.037Z3DWG NO.94030REV B PAGE 43.5 Certificate of compliance. A cer

21、tificate of compliance shall be required from manufacturers requesting to be a suggested sourceof supply in 6.6 herein. The certificate of compliance submitted to DSCC-VAC prior to listing as an source of supply shall state that themanufacturers product meets the screening requirements of MIL-PRF-19

22、500 and the requirements herein.3.6 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materialsshould be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenancerequirements, and pro

23、motes economically advantageous life cycle costs.3.7 Rework procedures and requirements. Rework is permitted. Rework procedures and requirements shall be developed anddocumented by the supplier and all rework shall be limited to these procedures and requirements. Maximum allowable frequency andcorre

24、ctive actions shall be included in the rework requirements. All rework data shall be made available to all customers upon request.The rework allowances shall not change without notifying DSCC-VAC prior to implementation.3.8 General requirements of MIL-PRF-19500. Any exceptions to the general require

25、ments of MIL-PRF-19500 shall be documentedand this documentation shall be made available to all customers upon request. Exceptions to the general requirements ofMIL-PRF-19500 shall not change without notifying DSCC-VAC prior to implementation.3.9 Workmanship. The semiconductor shall be uniform in qu

26、ality and free from any defects that will affect life, serviceability, orappearance.NOTES:1/ A Kovar lid shall be used for this package outline.FIGURE 1. Physical dimensions.Dimensions Inches MillimetersA .192 max 4.87 max A1 .025 ref 0.64 ref A2 .165 min 4.19 min b .018 .005 0.45 0.12 b1 .040 .005

27、1.02 0.12 D .910 .015 23.1 0.38 D1 .465 .015 11.81 0.38 E1 .300 .010 7.60 0.24 e .100 .005 2.54 0.12 1/Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIOSIZEACODE IDENT NO.037Z3DWG NO.94030REV B PAGE 5FIGURE

28、 2. Terminal connections.4. VERIFICATION4.1 Sampling and inspection. Unless otherwise specified, sampling and inspection procedures shall be performed in accordancewith MIL-PRF-19500 and as specified herein.4.2 Screening. All devices shall be screened in accordance with MIL-PRF-19500 (screening tabl

29、e, TX, and TXV requirements) andas specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits oftable I herein shall not be acceptable.MeasurementScreen (see screening table ofMIL-PRF-19500)TX and TXV levels2 24 hours3a 10 cycles, 15

30、minutes at extended andminimum/maximum rated temperature(1) 7 Test condition G or H, maximum leak rate= 1 x 10-8atm cc/s; test condition C, D, or K10 Not applicable11 Not applicable12 See 4.4.114 Same as screen 7 above16 External visual(1) May be performed in screen 14.Provided by IHSNot for ResaleN

31、o reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIOSIZEACODE IDENT NO.037Z3DWG NO.94030REV B PAGE 64.3 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as specified herein.4.3.1 Group A inspecti

32、on. Group A inspection shall be conducted in accordance with the conditions specified for subgroup testingin table I.4.3.2 Group B inspection. For device types 94030-11 through 94030-15 only, group B inspection shall be conducted in accordancewith the conditions specified for the group testing in MI

33、L-PRF-19500 and as follows. Electrical measurements shall be in accordancewith table I and group A, subgroup 2 herein.Subgroup Method ConditionB2 1051 10 cycles, 15 minutes at minimum/maximum rated temperatures; sampling plan = 10, c = 0.B2 1071 Fine leak: Condition G or H 1 x 10-8atm cc/sec. Gross

34、leak: Condition C, D, or K;sampling plan: n = 10, c = 0.B3 See 4.4.1B5 Not applicable.B6 1032 TSTG= +150C for 340 hours; sampling plan = 7, c = 0.B6 4016 Reverse current (IR) at rated VR; IR= 100 percent or 20 percent of group A limit, whichever isgreater; sampling plan: n = 7, c = 0.B6 4022 Breakdo

35、wn voltage (BV) at IZ; BV = 5 percent from initial reading; sampling plan = 7, c = 0.TABLE I. Group A inspection.MIL-STD-750 Limits 2/Inspection 1/Method ConditionsSymbolMinimum MaximumUnitSubgroup 1Visual and mechanicalexamination2071Subgroup 2Reverse current leakage 4016 DC method, VR = VWM(column

36、 1, see 1.4)IR Col. 5 ABreakdown voltage tp = 100 percent of the initial reading or 20 percent of the group A limitwhichever is greater, or BV 2 percent ( 5 percent for steady-state operation life) from the initial value shall be considereddefective. Remove defective devices and record the number of

37、 failures. (For steady-state operation life, the IRmaximum limitshall be two times the group A limit.)4.4.2 Maximum peak pulse current (Ipp). The peak pulse currents specified in 1.4 herein shall be applied in the reverse directionwhile simultaneously maintaining a reverse bias voltage of not less t

38、han the applicable voltage specified in 1.4 (VWM) herein. Thepeak current shall be applied with a current versus waveform as follows (1 pulse per minute maximum).Pulse current shall reach 100 percent of IPP at t 8 s and decay to 50 percent of IPP at t 20 s for td = 20 s (see figure 3 and figure4).4.

39、4.3 Clamping voltage. The peak pulse clamping voltage shall be measured across the device in an 8 x 20 s time interval.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIOSIZEACODE IDENT NO.037Z3DWG NO.94030RE

40、V B PAGE 8FIGURE 3. Pulse waveform.FIGURE 4. Peak pulse power versus pulse time.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIOSIZEACODE IDENT NO.037Z3DWG NO.94030REV B PAGE 95. PACKAGING5.1 Packaging. Fo

41、r acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When actual packaging of materiel is to be performed by DoD personnel, these personnel need to contact the responsible packagingactivity to ascertain requisite packaging requirements. Packagi

42、ng requirements are maintained by the Inventory Control Pointspackaging activity within the Military Department or Defense Agency, or within the Military Departments System Command. Packagingdata retrieval is available from the managing Military Departments or Defense Agencys automated packaging fil

43、es, CD-ROMproducts, or by contacting the responsible packaging activity.6. NOTES(This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.)6.1 Intended use. Devices conforming to this drawing are intended for use when performance specifications

44、do not exist andqualified military devices that will perform the required function are not available for OEM application. This drawing is intendedexclusively to prevent the proliferation of unnecessary duplicate specifications, drawings, and stock catalog listings. When aperformance specification is

45、 created and the product covered by this drawing has been listed on QML-19500, this drawing will besuperseded by the QPL-19500 product and shall be the preferred item for all applications.6.2 Ordering data. The contract or purchase order should specify the following:a. Complete PIN (see 1.2).b. Requ

46、irements for delivery of one copy of the conformance inspection data or certificate of compliance that parts have passedconformance inspection with each shipment of parts by the manufacturer.c. Requirements for packaging and packing.6.3 Replaceability. Devices covered by this drawing shall replace t

47、he same generic device covered by a contractor-preparedspecification or drawing.6.4 Comments. Comments on this drawing should be directed to Defense Supply Center Columbus, ATTN: DSCC/VAC,Post Office Box 3990, Columbus, OH 43216-5000 or by telephone (614) 692-0510 or DSN 850-0510.6.5 Users of record

48、. Coordination of this document for future revisions are coordinated only with the suggested sources of supplyand the users of record of this document. Requests to be added as a recorded user of this drawing should be in writing to: DefenseSupply Center, Columbus, ATTN: DSCC/VAC, Post Office Box 3990, Columbus, OH 43216-5000 or by telephone (614) 692-0510 orDSN 850-0510.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-