DLA DSCC-DWG-94029 REV C-2001 SEMICONDUCTOR DEVICE DIODE TRANSIENT SUPPRESSOR ARRAY BI-DIRECTIONAL《双向瞬间抑制二极管组半导电器件》.pdf

《DLA DSCC-DWG-94029 REV C-2001 SEMICONDUCTOR DEVICE DIODE TRANSIENT SUPPRESSOR ARRAY BI-DIRECTIONAL《双向瞬间抑制二极管组半导电器件》.pdf》由会员分享，可在线阅读，更多相关《DLA DSCC-DWG-94029 REV C-2001 SEMICONDUCTOR DEVICE DIODE TRANSIENT SUPPRESSOR ARRAY BI-DIRECTIONAL《双向瞬间抑制二极管组半导电器件》.pdf（10页珍藏版）》请在麦多课文档分享上搜索。

1、REVISIONSLTR DESCRIPTION DATE APPROVEDA Added PIND designator, reworkdocumentation, group C inspection14 July 2000 Monica PoelkingB Added statement to figure 1 concerningdevice construction.28 June 2001 Thomas M. HessC Added new device types -05 and -15. 25 July 2001 Thomas M. HessPREVIOUS CAGE CODE

2、 14933 SUPERSEDED BY 037Z3.THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.Prepared in accordance with MIL-STD-100 Selected item drawingREVPAGEREVPAGEREV STATUSOF PAGESREV CCCCCCCCC CPAGES 12345678910PMIC N/A PREPARED BYRobert PettyDEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHOriginal date o

3、f drawing24 February 1995CHECKED BYAlan BaroneTITLESEMICONDUCTOR DEVICE, DIODE, TRANSIENTSUPPRESSOR, ARRAY, BI-DIRECTIONALAPPROVED BYKendall A. CottongimSIZEACODE IDENT. NO.14933DWG NO.94029REV C PAGE 1 OF 10 AMSC N/A 5961-E063DISTRIBUTION STATEMENT A. Approved for public release; distribution is un

4、limited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIOSIZEACODE IDENT NO.14933DWG NO.94029REV C PAGE 21. SCOPE1.1 Scope. This drawing describes the detail requirements for a 500 Watt, bi-directional tran

5、sient voltage suppressor diode array.1.2 Part or Identifying Number (PIN). The complete PIN shall be as follows:94029 -01 TX or TXV 1/P 2/| | | | | Drawing Device type Screening level PINDnumber (see 1.2.1) (see 1.2.1) Tested1.2.1 Device types. The device types shall identify the quality assurance l

6、evel and the reverse standoff voltage of the devices asfollows:Device type 1/ Figure number Reverse standoff voltage Quality level94029-01TX, TXV, TXP, TXVP 1 8 V dc 3/94029-11TX, TXV, TXP, TXVP 1 8 V dc 4/94029-02TX, TXV, TXP, TXVP 1 13 V dc 3/94029-12TX, TXV, TXP, TXVP 1 13 V dc 4/94029-03TX, TXV,

7、 TXP, TXVP 1 19 V dc 3/94029-13TX, TXV, TXP, TXVP 1 19 V dc 4/94029-04TX, TXV, TXP, TXVP 1 30 V dc 3/94029-14TX, TXV, TXP, TXVP 1 30 V dc 4/94029-05TX, TXV, TXP, TXVP 1 8 V dc 3/94029-15TX, TXV, TXP, TXVP 1 8 V dc 4/1.3 Maximum ratings.t clamping (0 volts to BV min)less than 5 x 10-9seconds theoreti

8、cal.Peak pulse power 500 W/position at tp = 8 x 20 s at +25C.Operating and storage temperature.-55C to +150C.Repetition rate (duty cycle)0.01 percent.1.4 Primary electrical characteristics. Primary electrical characteristics at TC = +25C (unless stated otherwise).Column 1 Column 2 Column 3 Column 4

9、Column 5 Column 6 Column 7TypeVWM V(BR)IR = 1 mAVC at IPP1 = 1 A8 x 20 sVC at IPP2 = 10 A8 x 20 sIR at VRReverseleakage(maximum)CCapacitanceV(BR)V dc V dc V(pk) V(pk) A pF mV/C94029-01 8 8.5 12.2 15.0 10 440 994029-11 8 8.5 12.2 15.0 10 440 994029-02 13 14.4 20.6 25.4 4 385 1894029-12 13 14.4 20.6 2

10、5.4 4 385 1894029-03 19 21.6 31.0 38.1 4 275 2494029-13 19 21.6 31.0 38.1 4 275 2494029-04 30 33.3 47.8 58.8 4 165 3894029-14 30 33.3 47.8 58.8 4 165 3894029-05 8 8.5 13.4 16.6 10 440 994029-15 8 8.5 13.4 16.6 10 440 91/ Screening level: TX and TXV levels correspond to JANTX and JANTXV equivalent (r

11、espectively) screening requirements fromMIL-PRF-19500.2/ “P” suffix for PIND tested part.3/ Group B testing, satisfied by generic group B data available from the manufacturer.4/ Group B testing as specified herein (see 4.3.2). Provided by IHSNot for ResaleNo reproduction or networking permitted with

12、out license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIOSIZEACODE IDENT NO.14933DWG NO.94029REV C PAGE 32. APPLICABLE DOCUMENTS2.1 Government documents.2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of thisdocument to

13、the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of theDepartment of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation (see 6.2).SPECIFICATIONDEPARTMENT OF DEFENSEMIL-PRF-19500

14、- Semiconductor Devices, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL-STD-750 - Test Methods for Semiconductor Devices.(Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from theDocument Automation and Production Services

15、 (DAPS), Building 4D (DPM-DODSSP), 700 Robbins Avenue, Philadelphia, PA 19111-5094.2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of thisdocument takes precedence. Nothing in this document, however, supersedes applicabl

16、e laws and regulations unless a specificexemption has been obtained.3. REQUIREMENTS3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-19500 and as specified herein.3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herei

17、n shall be as specified inMIL-PRF-19500.3.3 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-19500. Packagedimensions shall be in accordance with figure 1 of this drawing.3.3.1 Lead finish. Lead finish shall be solderable in accordance with MI

18、L-PRF-19500, MIL-STD-750, and herein. Where a choice oflead finish is desired, it shall be specified in the acquisition document.3.3.2 Terminal connections. Terminal connections shall be in accordance with figure 2.3.4 Marking. Marking shall be in accordance with MIL-PRF-19500 and as follows.a. Firs

19、t line marking: 94029-XXTX, TXV, TXP or TXVP (where XX is the device type).b. Second line marking: Manufacturers identification.c. Third line marking: Lot date code.d. Pin 1 identifier (contrasting color dot on top of package).Provided by IHSNot for ResaleNo reproduction or networking permitted with

20、out license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIOSIZEACODE IDENT NO.14933DWG NO.94029REV C PAGE 43.5 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be a suggested sourceof supply in 6.6 herein. The certificate of complia

21、nce submitted to DSCC-VAC prior to listing as an source of supply shall state that themanufacturers product meets the screening requirements of MIL-PRF-19500 and the requirements herein.3.6 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferab

22、le materialsshould be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenancerequirements, and promotes economically advantageous life cycle costs.3.7 Rework procedures and requirements. Rework is permitted. Rework procedures and requirements s

23、hall be developed anddocumented by the supplier and all rework shall be limited to these procedures and requirements. Maximum allowable frequency andcorrective actions shall be included in the rework requirements. All rework data shall be made available to all customers upon request.All rework data

24、shall be made available to all customers upon request. The rework allowances shall not change without notifyingDSCC-VAC prior to implementation3.8 General requirements of MIL-PRF-19500. Any exceptions to the general requirements of MIL-PRF-19500 shall be documentedand this documentation shall be mad

25、e available to all customers upon request. Exceptions to the general requirements ofMIL-PRF-19500 shall not change without notifying DSCC-VAC prior to implementation.3.9 Workmanship. The semiconductor shall be uniform in quality and free from any defects that will affect life, serviceability, orappe

26、arance.NOTES:1/ A Kovar lid shall be used for this package outline.FIGURE 1. Physical dimensions.Dimensions Inches MillimetersA .192 max 4.87 max A1 .025 ref 0.64 ref A2 .165 min 4.19 min b .018 .005 0.45 0.12 b1 .040 .005 1.02 0.12 D .910 .015 23.1 0.38 D1 .465 .015 11.81 0.38 E1 .300 .010 7.60 0.2

27、4 e .100 .005 2.54 0.12 1/Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIOSIZEACODE IDENT NO.14933DWG NO.94029REV C PAGE 5FIGURE 2. Terminal connections.4. VERIFICATION4.1 Sampling and inspection. Unless o

28、therwise specified, sampling and inspection procedures shall be performed in accordancewith MIL-PRF-19500 and as specified herein.4.2 Screening. All devices shall be screened in accordance with MIL-PRF-19500 (screening table, TX and TXV requirements) andas specified herein. The following measurement

29、s shall be made in accordance with table I herein. Devices that exceed the limits oftable I herein shall not be acceptable.Measurement(See Screening table ofMIL-PRF-19500)TX and TXV levels2 24 hours.3a 10 cycles, 15 minutes at extended andminimum/maximum rated temperature.(1) 7 Test condition G or H

30、, maximum leak rate= 1 x 10-8atm cc/s; test condition C, D, orK.10 Not applicable.11 Not applicable.12 See 4.4.1.14 Same as screen 7 above.16 External visual.(1) May be performed in screen 14.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SU

31、PPLY CENTER, COLUMBUSCOLUMBUS, OHIOSIZEACODE IDENT NO.14933DWG NO.94029REV C PAGE 64.3 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as specified herein.4.3.1 Group A inspection. Group A inspection shall be conducted in accordance with the conditions sp

32、ecified for subgroup testingin table I.4.3.2 Group B inspection. For device types 94029-11 through 94029-15 only, group B inspection shall be conducted in accordancewith the conditions specified for the group B testing MIL-PRF-19500 and as follows. Electrical measurements shall be in accordancewith

33、table I and group A, subgroup 2 herein.Subgroup Method ConditionB2 1051 10 cycles, 15 minutes at minimum/maximum rated temperatures; sampling plan = 10, c = 0.B2 1071 Fine leak: Condition G or H 1 x 10-8atm cc/sec. Gross leak: Condition C, D, or K;sampling plan = 10, c = 0.B3 See 4.4.1.B5 Not applic

34、able.B6 1032 Tstg= +150C for 340 hours; sampling plan = 7, c = 0.B6 4016 Reverse current (IR) at rated VR; IR= 100 percent or 20 percent of group A limit, whichever isgreater; sampling plan = 7, c = 0.B6 4022 Breakdown voltage (BV) at IZ; BV = 5 percent from initial reading; sampling plan = 7, c = 0

35、.TABLE I. Group A inspection.MIL-STD-750 Limits 3/Inspection 1/ 2/Method ConditionsSymbolMinimum MaximumUnitSubgroup 1Visual and mechanicalexaminationSubgroup 2Reverse current leakageBreakdown voltageSubgroup 3Not applicableSubgroup 4Clamping voltageClamping voltageCapacitance207140164022Figure 4Fig

36、ure 44001DC method, VR = VWM(column 1, see 1.4)tp = 100 percent of the initial reading or 20 percent of the group A limitwhichever is greater, shall be considered defective. Remove defective devices and record the number of failures. (For steady-state operation life, the IRmaximum limit shall be two

37、 times the group A limit.)f. Apply the working peak reverse voltage (VWM) in polarity B at an ambient temperature of +125C as follows:(1) Eighty hours for the screening test.(2) One hundred and seventy hours for the group B steady-state operation life test.(3) Five hundred hours for the group C life

38、 test.g. Read and record IRin polarity B at +25C. Devices with IR 100 percent of the initial reading or 20 percent of the group A limitwhichever is greater, shall be considered defective. Remove defective devices and record the number of failures. (For steady-state operation life, the IRmaximum limi

39、t shall be two times the group A limit.)h. Read and record V(BR) in both polarities at +25C. Devices with V(BR) 2 percent (5 percent for steady-state operation life)from the initial value shall be considered defective. Remove defective devices and record the number of failures.4.4.2 Maximum peak pul

40、se current (IPP). The peak pulse currents specified in 1.4 herein shall be applied in the reverse directionwhile simultaneously maintaining a reverse bias voltage of not less than the applicable voltage specified in 1.4 (VWM) herein. Thepeak current shall be applied with a current versus waveform as

41、 follows (1 pulse per minute maximum).Pulse current shall reach 100 percent of IPP at t 8 s and decay to 50 percent of IPP at t 20 s for td = 20 s (see figure 3 and figure4).4.4.3 Clamping voltage. The peak pulse clamping voltage shall be measured across the device in an 8 x 20 s time interval.Provi

42、ded by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIOSIZEACODE IDENT NO.14933DWG NO.94029REV C PAGE 8FIGURE 3. Peak pulse power versus pulse time.FIGURE 4. Pulse waveform.Provided by IHSNot for ResaleNo reproduction

43、 or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIOSIZEACODE IDENT NO.14933DWG NO.94029REV C PAGE 95. PACKAGING5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When actual pac

44、kaging of materiel is to be performed by DoD personnel, these personnel need to contact the responsible packagingactivity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Pointspackaging activity within the Military Department or Defense A

45、gency, or within the Military Departments System Command. Packagingdata retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROMproducts, or by contacting the responsible packaging activity.6. NOTES(This section contains information of a gene

46、ral or explanatory nature which may be helpful, but is not mandatory.)6.1 Intended use. Devices conforming to this drawing are intended for use when performance specifications do not exist andqualified military devices that will perform the required function are not available for OEM application. Th

47、is drawing is intendedexclusively to prevent the proliferation of unnecessary duplicate specifications, drawings, and stock catalog listings. When aperformance specification is created and the product covered by this drawing has been listed on QML-19500, this drawing will besuperseded by the QML-195

48、00 product and shall be the preferred item for all applications.6.2 Ordering data. The contract or purchase order should specify the following:a. Complete PIN (see 1.2).b. Requirements for delivery of one copy of the conformance inspection data or certificate of compliance that parts have passedconformance inspection with each shipment of parts by the manufacturer.c. Requirements for packaging and packing.6.3 Replaceability. Devices covered by this drawin