DLA DSCC-DWG-11019-2011 INDUCTORS SMD CHIP THIN FILM TIGHT TOLERANCE 0805.pdf

《DLA DSCC-DWG-11019-2011 INDUCTORS SMD CHIP THIN FILM TIGHT TOLERANCE 0805.pdf》由会员分享，可在线阅读，更多相关《DLA DSCC-DWG-11019-2011 INDUCTORS SMD CHIP THIN FILM TIGHT TOLERANCE 0805.pdf（8页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.100 Source control drawingREV STATUS REV OF PAGES PAGES 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY Ken Beymer DESIGN ACTIVITY DLA LAND AND MARITIME COLUMBUS, OH 43218-5000 Original date of drawing 12 September 2011 CHECKED BY Ke

2、n Beymer TITLE INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0805 APPROVED BY Michael A. Radecki SIZE A CODE IDENT. NO. 037Z3 DWG NO. 11019 REV PAGE 1 OF 8 AMSC N/A 5950-2011-E03Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIM

3、E COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 11019 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for inductors, SMD, chip. These inductors are composed of a single or double layer dielectric thin film and are of small size and tight tolerances. 1.2 Part or Identifyin

4、g Number (PIN) The complete PIN is as follows: 11019- 100 J U * Drawing Number Inductance Value (see 1.2.1) Inductance Tolerance (see 1.2.2) Termination Finish (see 1.2.3) Additional Testing Option (see 1.2.4) 1.2.1 Inductance Value. The nominal inductance value, expressed in nanohenries (nH), is id

5、entified by a three-digit number. The first two digits represent significant figures and the last digit specifies the number of zeros to follow. When the nominal value is less than 10 nH, the letter “R” is used to indicate the decimal point. 1R2 indicates 1.2 nH; 150 indicates 15.0 nH. 1.2.2 Inducta

6、nce Tolerance. The inductance tolerance is identified by a single letter in accordance with table I. TABLE I. Inductance Tolerance. Symbol Inductance Tolerance () B 0.1 nH C 0.2 nHD 0.5 nH G 2 percent J 5 percent 1.2.3 Termination Finish. Termination finish is identified by a single letter as shown

7、in table II. TABLE II. Termination Finish. Symbol Termination FinishU Base metallization-barrier metal-solder coated (tin/lead alloy with a minimum of 4 percent lead). 1.2.4 Testing Option. To require additional group C testing, use the appropriate letter from table III. If additional testing is not

8、 desired, leave this location blank. TABLE III. Testing Options. Letter Testing Option C Full additional testing L 500 hours life test only H 500 hours steady state humidity only T 100 temperature cycles only - No additional testing Provided by IHSNot for ResaleNo reproduction or networking permitte

9、d without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 11019 REV PAGE 3 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in section 3 this specification. This section does not include documents cited in other sec

10、tions of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents in section 3 of this specification, whether or not

11、they are listed. 2.2 Government Documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation

12、 or contract. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Methods Standard Electronic and Electrical Component Parts. MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are available online at https/assist.da

13、ps.dla.mil/quicksearch or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094). 2.3 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these

14、 documents are those cited in the solicitation or contract. AGILENT TECHNOLOGIES Agilent Application Note 1369-6 - How To Accurately Evaluate Low ESR, High Q RF Chip Devices. Agilent Literature Number 5968-5162E - 8720E Family Network Analyzers Configuration Guide. (Copies of these documents are ava

15、ilable online at http:/ or from Agilent Technologies, Inc., 5301 Stevens Creek Blvd., Santa Clara CA 95051). INTERNATIONAL ELECTROTECHNICAL COMMISION (IEC) IEC 60068-2-58 - Test Methods for Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (S

16、MD). IEC 60068-2-21 - Robustness of Terminations and Integral Mounting Devices. (Copies of these documents are available online at http:/ or from Global Engineering Documents, Attn: Customer Service Department, 15 Inverness Way East, Englewood CO 80112-5776). 2.4 Order of precedence. Unless otherwis

17、e noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Pr

18、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 11019 REV PAGE 4 TW B2 LB13. REQUIREMENTS 3.1 Item Requirements. The individual item requirements shall be as specified herein. The

19、se inductors shall be capable of meeting all stated electrical, environmental, and mechanical requirements. 3.2 Pure Tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of inductor components and solder shall not exceed 96 percent, by

20、 mass. Tin shall be alloyed with a minimum of 4 percent lead or 4 percent silver, by mass (see 6.4). 3.3 Interface and Physical Dimensions. The interface and physical dimensions shall be as specified herein (see figure 1). NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for gener

21、al information only. FIGURE 1. Physical Dimensions and Configuration. 3.4 Electrical Characteristics. 3.4.1 Electrical Testing. When 100 percent electrically tested, the following conditions will apply: a. Inductance (L) (at +25C): Shall be as specified in 3.4.2. b. Quality Factor (Q) (at +25C): Sha

22、ll be as specified in 3.4.3. c. Direct Current Resistance (Rdc) (at +25C): Shall be as specified in 3.4.4. Inches mm .0039 0.100 .0051 0.130 .0059 0.150 .0098 0.250 .0358 0.910 .0590 1.500 .0831 2.110 Dimensions L .0039 W .0039 T .0051 B1 .0059 B2 .0059 .0831 .0590 .0358 .0098 .0098 Provided by IHSN

23、ot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 11019 REV PAGE 5 3.4.2 Inductance (L). When tested on Agilent RF Impedance/Material Analyzer in accordance with Agilent Tecnologies Application N

24、ote 1369-6, the Inductance shall be as shown in table IV within required tolerance as shown in table I. Test Frequency: 450 MHz 50MHz. 3.4.3 Quality Factor (Q). When tested on Agilent RF Impedance/Material Analyzer in accordance with Agilent Tecnologies Application Note 1369-6, the Quality Factor sh

25、all be as shown in table IV. Test Frequency: 450 MHz 50MHz. TABLE IV. Electrical Characteristics. Inductance (nH) 450 MHz Test Frequency 900 MHz Test Frequency 1700 MHz Test Frequency 2400 MHz Test Frequency SRF min (GHz) Rdc max (Ohm) Idc max (mA) L Q L Q L Q L Q (nH) Typical (nH) Typical (nH) Typi

26、cal (nH) Typical 1.2 1.2 60 1.2 92 1.2 122 1.2 92 10.0 0.05 1000 1.5 1.5 50 1.5 74 1.5 102 1.5 84 10.0 0.05 10001.8 1.8 50 1.8 72 1.8 88 1.9 73 10.0 0.06 1000 2.2 2.2 42 2.2 62 2.2 82 2.3 72 10.0 0.07 10002.7 2.7 42 2.7 62 2.8 80 2.9 70 10.0 0.08 1000 3.3 3.3 38 3.3 46 3.4 48 3.5 57 10.0 0.11 750 3.

27、9 3.9 27 3.9 36 4.0 38 4.1 42 10.0 0.20 750 4.7 4.7 43 4.8 62 5.3 76 5.8 60 5.5 0.10 750 5.6 5.6 50 5.7 68 6.3 73 7.6 62 4.6 0.10 750 6.8 6.8 43 7.0 62 7.7 71 9.4 50 4.5 0.11 750 8.2 8.2 43 8.5 56 10.0 55 15.2 32 3.5 0.12 750 10.0 10.0 46 10.6 60 13.4 52 - - 2.5 0.13 750 12.0 12.0 40 12.9 50 17.3 40

28、 - - 2.4 0.20 750 15.0 15.0 36 16.7 46 27.0 23 - - 2.2 0.20 750 18.0 18.0 30 21.9 27 - - - - 1.7 0.35 500 22.0 22.0 36 27.5 33 - - - - 1.4 0.40 500 3.4.4 Direct Current Resistance (Rdc). When tested in accordance with Method 303A of MIL-STD-202G, the Direct Current Resistance shall be as shown in ta

29、ble IV. 3.4.5 Self-Resonant Frequency (SRF). When tested on Agilent 8720E Family Network Analyzers according to Agilent configuration guide, literature number 5968-5162E, the Self-Resonant Frequency shall be as shown in table IV. 3.4.6 Working Current (Idc). When tested by root mean square multimete

30、r, the root mean square Working Current shall be as shown in table IV. The following details shall apply: a. Inductors are soldered to FR-4 board. b. Idc max is measured for 15C rise at 25C ambient temperature. 3.5 Solderability. When tested in accordance with IEC 60068-2-58, the immersed metallized

31、 surface shall be at least 95 percent covered with a smooth solder coating. The remaining 5 percent of the surface may contain small pinholes or exposed termination material; however, these shall not be concentrated in one area. The following details shall apply: a. Solder temperature: 235C 5C. b. D

32、well time: 2 + 0, -0.5 seconds. c. Sample size: 20 pieces with zero defects permitted. 3.6 Resistance to Soldering Heat. When tested in accordance with IEC 60068-2-58, the following details shall apply: a. Temperature: 260 5C. b. Test duration: 10 0.5 seconds. c. Direct Current Resistance change: d.

33、 Shall change not more than +20% for Resistance values 50 m. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 11019 REV PAGE 6 e. Shall change not more than +10 m for Resistance

34、values 50 m. f. Sample size: 20 pieces with zero failures permitted. 3.7 Push-off. When tested in accordance with method Ue2 of IEC 60068-2-21, the inductor shall withstand 5 newton force applied for 10 seconds. The following details shall apply: a. Inductors are soldered to FR-4 board. b. Sample si

35、ze: 20 pieces with zero failures permitted. 3.8 Shear. When tested in accordance with method Ue3 of IEC 60068-2-21, the inductor shall withstand 5 newton force applied for 10 seconds. The following details shall apply: a. Inductors are soldered to FR-4 board. b. Sample size: 20 pieces with zero fail

36、ures permitted. 3.9 Temperature Cycling (air-to-air). When tested in accordance with Method 1010.8 of MIL-STD-883, the following details shall apply: a. Inductors are soldered to FR-4 board. b. Number of cycles: 10. c. Extreme temperatures: +85C, -40C. d. Exposure time at extreme temperatures: 30 1

37、minute. e. Direct Current Resistance change: Shall change not more than + 10%, - 20%. f. Sample size: 21 pieces with zero failures permitted. 3.10 Humidity, Steady State. When tested in accordance with Method 103 of MIL-STD-202, the following details shall apply: a. Inductors are soldered to FR-4 bo

38、ard. b. Test duration: 168 hours. c. Temperature: +85C. d. Humidity: 85% RH. e. Test current: working current Idc as specified in Table IV. f. Direct Current Resistance change: Shall change not more than + 10%, - 20%. g. Sample size: 21 pieces with zero failures permitted. 3.11 Life (at elevated amb

39、ient temperature). When tested in accordance with Method 108A of MIL-STD-202, the following details shall apply: a. Inductors are soldered to FR-4 board. b. Test duration: 4 hours. c. Temperature: +125C. d. Test current: working current Idc as specified in Table IV. e. Direct Current Resistance chan

40、ge: Shall change not more than + 10%, - 20%. f. Sample size: 21 pieces with zero failures permitted. 3.12 Marking. As a minimum, marking shall be on the package due to the small size of the chips. The package marking shall be in accordance with MIL-STD-1285, except the PIN shall be as specified in p

41、aragraph 1.2 with manufacturers name or CAGE code and date code. The manufacturer may, at their option, mark some information on the chips. 3.13 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall perform the inspections specified herein on a sa

42、mple of parts agreed upon by the manufacturer and DLA Land and Maritime - VAT. 3.14 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be an approved source of supply. 3.15 Recycled, recovered, or environmentally preferable materials. Recycled,

43、recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. Provided by IHSNot for ResaleNo reproduction or networki

44、ng permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 11019 REV PAGE 7 4. VERIFICATION 4.1 Qualification inspection. Qualification inspection is not required. 4.2 Conformance inspection (see 3). 4.2.1 Inspection of product for delivery. In

45、spection of product for delivery shall consist of all tests specified herein. PPM testing and calculation are not applicable. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of material is to be

46、 performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or wit

47、hin the military services system commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or expl

48、anatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Inductors conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM application. This drawing

49、is intended exclusively to prevent the proliferation of unnecessary duplicate specifications, drawings, and stock catalog listings. When a military specification exists and the product covered by this drawing has been qualified for listing, this drawing becomes obsolete and will not be used for new d