BS 5131-4 1-1975 Methods of test for footwear and footwear materials - Other components - Resistance to peeling of insole board《鞋靴和鞋靴材料试验方法 第4部分 其他部件 第1节 内底纸板耐脱落性》.pdf

《BS 5131-4 1-1975 Methods of test for footwear and footwear materials - Other components - Resistance to peeling of insole board《鞋靴和鞋靴材料试验方法 第4部分 其他部件 第1节 内底纸板耐脱落性》.pdf》由会员分享，可在线阅读，更多相关《BS 5131-4 1-1975 Methods of test for footwear and footwear materials - Other components - Resistance to peeling of insole board《鞋靴和鞋靴材料试验方法 第4部分 其他部件 第1节 内底纸板耐脱落性》.pdf（8页珍藏版）》请在麦多课文档分享上搜索。

1、BRITISH STANDARD BS 5131-4.1: 1975 Methods of test for Footwear and footwear materials Part 4: Other components Section 4.1 Resistance to peeling of insole board NOTEIt is recommended that this Section should be read in conjunction with the information in the General introduction to BS5131, publishe

2、d separately. UDC 685.31:620.1:685.312.124:676.017.435.4BS5131-4.1:1975 BSI 10-1999 ISBN 0 580 08308 X A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standa

3、rd does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, pages1 to 3 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indica

4、ted in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBS5131-4.1:1975 BSI 10-1999 i Contents Page 1 Scope 1 2 Principle 1 3 Test pieces 1 4 Flexible substrate 2 5 Adhesive 2 6 Preparation of test assemblies 2 7 Apparatus 2 8 Conditioning the

5、test assemblies 2 9 Test joints 2 10 Procedure 2 11 Expression of results 2 12 Test report 3 Figure 1 Arrangement for bonding and cutting test joints 1ii blankBS5131-4.1:1975 BSI 10-1999 1 1 Scope This Section describes a method for measuring the resistance of an insole board to the peeling of the s

6、urface layer from the remainder. The method is applicable to all insole boards. NOTESection4.1 is based on SATRA 1)Method AM1, Appendix FB. 2 Principle After the board has been bonded to a flexible substrate, using an adhesive that is strong enough to ensure that separation during subsequent peeling

7、 occurs entirely within the board, the resultant joint is peeled in a tensile-testing apparatus. 3 Test pieces 3.1 Direction of sheet run 3.1.1 Some types of insole board show a directional effect in that the peeling force in the direction of sheet run can be markedly different from that against the

8、 direction of sheet run. If the presence of this effect is suspected, cut a test piece in each of the following three directions so that the peeling forces may be determined accordingly: a) in the machine direction and with the sheet run; b) in the machine direction and against the sheet run; c) in

9、the cross direction. NOTEBoards made with rubber-bonded chemical wood pulp usually exhibit this effect. 3.1.2 Provided that the board is not suspected to show the directional effect referred to by3.1.1, cut two test pieces so that the peeling load may be determined in each of the following direction

10、s: a) in the machine direction; b) in the cross direction. 3.2 Cutting of test pieces. From the board cut either two or three rectangles, as required by3.1, each approximately90mm by105mm with the direction of intended peel marked and parallel to the90mm sides (seeFigure 1). 1) Shoe and Allied Trade

11、s Research Association Figure 1 Arrangement for bonding and cutting test jointsBS5131-4.1:1975 2 BSI 10-1999 4 Flexible substrate 4.1 For the flexible substrate which is to be bonded to the insole board, use an upper leather, fabric or any other material which has been found to be suitable. If the s

12、ubstrate is to be leather, either use a full chrome side with the grain layer removed by roughing with a wire brush rougher or use a double buffed chrome split upper leather. 4.2 Cut from the flexible substrate a sufficient number of rectangles, approximately90mm by105mm, to provide one for each of

13、the test pieces. 5 Adhesive As an adhesive for bonding the test pieces and substrate, use a single-component polychloroprene sole-attaching cement with a dynamic viscosity of2Ns/m 2to10Ns/m 22)when measured at a shear rate of1s 1to100s 1 . 6 Preparation of test assemblies 6.1 Staple a paper masking

14、strip to each insole board test piece to cover an area of board approximately20mm by105mm along the105mm side of the rectangle from which the board is to be peeled (seeFigure 1). Do not give the surface of the board any preliminary treatment before bonding the test assemblies. 6.2 Apply a coat of th

15、e adhesive to the prepared face of the flexible substrate. Allow to dry for1h. Apply a second coat and allow this to dry for1h. Apply one coat of adhesive to the masked side of the insole board test pieces, ensuring a well defined edge to the coat by starting each brush stroke on the paper and conti

16、nuing on to the board. Allow to dry for1h. 6.3 Heat-activate the adhesive films on the board and the flexible substrate with radiant heat, taking care not to damage the board. The adhesive should be tacky; a surface temperature of80 C will ensure this. Align the components carefully and bond each te

17、st assembly under pressure by any suitable means. 7 Apparatus Use the following apparatus. 7.1 Conditioning cabinet or room, capable of maintaining an atmosphere at20 2 C and652% relative humidity. 7.2 Tensile-testing machine, low-inertia, continuous-recording, with a jaw separation rate of10 2 cm/m

18、in, and a suitable force range, e.g.0 to50N (0 to5kgf). 8 Conditioning the test assemblies Keep each test assembly in an atmosphere of20 2 C and65 2% relative humidity for a minimum of48h, and until immediately before completing the determination. 9 Test joints Cut from each test assembly three rect

19、angular90mm by30mm test joints, four cuts being made perpendicular to the length of the paper strip as indicated inFigure 1 by AA | , BB | , CC |and DD | . Discard the two remaining edge strips of the test assembly. 10 Procedure 10.1 Test each of the three test joints cut from each test assembly. Se

20、parate carefully the paper strip (now bonded to the flexible substrate) from the board, taking care not to disturb the edge of the adhesive bond. Clamp the free ends of the board and substrate in the jaws of the tensile-testing machine and separate the jaws at a rate of10 2cm/min while recording con

21、tinuously the peeling force and the extension. After peeling, examine the board. If failure has not occurred entirely within the board, reject the test result. 10.2 Examine the test record and obtain from it: a) the size of any initial peak force; b) the mean force for the subsequent peeling. 11 Exp

22、ression of results 11.1 Peeling forces. Calculate, for each test assembly, the arithmetic mean of the mean peeling forces for each of the three test joints (excluding any initial peak forces). Express the result, in newtons per centimetre width, as the peeling force for the corresponding direction o

23、f the board. 11.2 Initial peak forces. If peak forces are observed for each of the three test joints of a test assembly, calculate the mean and express the result, in newtons per centimetre width, as the initial peak peeling force for the corresponding direction of the board. If an initial peak forc

24、e is observed only in one or two of the three test joints, express the result as the individual value(s), in newtons per centimetre width. 2) 1 N s/m 2= 1 Pa sBS5131-4.1:1975 BSI 10-1999 3 12 Test report Include the following items in the test report: a) the peeling forces, for each direction with r

25、eference to the sheet run, expressed in accordance with11.1 (the equivalent values inkgf/cm width may be added in brackets); b) any initial peak peeling forces, expressed in accordance with11.2 (the equivalent values inkgf/cm width may be added in brackets); c) nature and full identification of the

26、sample; d) time interval between bonding and peeling; e) reference to the method of test (i.e. Section4.1 of BS5131); f) date of testing.BS 5131-4.1: 1975 BSI 389 Chiswick High Road London W4 4AL BSIBritishStandardsInstitution BSI is the independent national body responsible for preparing BritishSta

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