ARMY MIL-C-48615B-1995 CIRCUIT CARD ASSEMBLY - CONTINUITY TEST CARD.pdf
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1、MIL-C- -!FI 23 June 1995 (see 6.4) MILITARY SPECIFICATION CIRCUIT CARD ASSEMBLY - CONTINUITY TEST CARD -This specification is approved for use by the U.S. Army Armament, Research, Development and Enginerring Center (ARDEC) available for use by all Departments and Agencies of the Department of Defens
2、e (see 6.1). 1. SCOPE 1.1 Scope. This specification establishes the requirements and quality assurance provisions for the Circuit Card Assembly - Continuity Test Card, 11732666 (See 6.1) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards and handbooks. The follow- ing
3、specifications, standards and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents shall be those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited
4、in the solicitation (see 6.2). SPECIFICATIONS MILITARY MIL-F-13926 - Fire Control Materiel, General Specification Governing the Manufacture and Inspection of MIL-1-45607 - Inspection Equipment; Acquisition, Maintenance, and Disposition of Beneficial comments (recommendations, additions, deletions) a
5、nd any pertinent data which may be of use to improving this document should be addressed to: Commander, U.S. Army ARDEC, ATTN: AMCTA-AR-EDE-S, Picatinny Arsenal, New Jersey 07806-5000 by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or b
6、y letter. AMSC N/A UTION STA-. Approved for public release; distribution is unlimited. FSC 1240 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I- NIL-C-48h15B - 9999906 2001196 732 - STANDARDS MILITARY MIL-STD-100 - MIL-STD-454 - MIL-STD-810 - MIL-S
7、TD-2000 - MIL-STD-2073-1 - Engineering Drawing Practices Standard General Requirements for Electronic Equipment Environmental Test Methods Standard Requirements for Soldered Electrical and Electronics Assemblies Procedures for Development and Application of Packaging Requirements (Unless otherwise i
8、ndicated, copies of federal and military specifications, standards and handbooks are available from: DODSSP - Customer service, Standardization Documents Order Desk, 700 Robbins Avenue, Bldg 4D, Philadelphia, PA 19111-5094.) 2.1.2 Other Government documents, drawings and publications. The following
9、other Government documents, drawings and publications form a part of this document to the extent specified herein. Unless otherwise specified, the issue shall be those in effect on date of the solicitation. U.S. Army Armament Research Development and Engineering Center (ARDEC) DRAW I NG S 11732666 -
10、 Circuit Card Assembly - Continuity Test Card (Copies of Government drawings required by contractors in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Order of precedence. In the event of a conflict bet
11、ween the text of this document and the references cited herein (except for related associated detail specifications, specification sheets or MS standards), the text of this document shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
12、 exemption has been obtained (see contract provisions for additional precedence criteria). 3. REQUIREMENTS 3.1 Fabrication. The continuity test circuit card assembly, herein referred to as the assembly, shall be manufactured in accordance with Drawing 11732666 and drawings pertaining thereto and, wh
13、en assembled, shall meet the requirements of this specification (see 4.5.1). 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- MIL-C-48615B(AR) 3.1.1 Function. The assembly shall provide the following functions: a. Check for the presence of various
14、system power b. Check for the proper ammunition select logic signals. sources and returns. 3.1.2 General specifications. (see 4.6.3) 3.1.2.1 Manufacture and inspection. The following provisions of MIL-F-13926 apply: a. Dimensions and tolerance b. Effect of protective coating on dimensions (Inorganic
15、 c. Part identification and marking d. Workmanship (Including applicable portions of type coating) MIL-STD-2000 and MIL-STD-454, Requirement 9) 3.1.2.2 Standards of manufacture. 3.1.2.2.1 Assembly and soldering. The requirements of MIL-STD-2000 shall apply, as a minimum. 3.1.2.2.2 Interchangeability
16、. The assembly shall be manufactured in accordance with interchangeability requirements as specified in MIL-STD-100. 3.1.3 Ambient conditions. Standard ambient conditions shall be as follows: a. Temperature 730 + 18OF b. Relative humidity 50 percent + 30 percent c. Atmospheric pressure 28.5 + 2.0/-
17、3.0 in. Hg. 3.2 First article. When specified in the contract or purchase order (see 6-21, the contractor shall furnish sample units for first article inspection and approval (see 4.4). 3.3 Performance. Unless otherwise specified, the assembly shall meet the performance requirements specified herein
18、 under standard ambient conditions of 3.1.3. 3.3.1 Terminal resistance. With no power or signals applied to the assembly, the resistance between terminals shall be as specified in Table I. (see 4.6.1.1). 3.3.2 Power sources. With the power sources (items 1.1, 1.2, and 1.3 of Table II) and interconne
19、ction (item 4.1 of Table II) applied to the assembly (see 4.6.1.2): a. The output at pin P1-B2 shall be +5.25 - + 0.15V dc, 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- MIL-C-48615B(AR) measured with respect to pin Pl-Al3. b. With pin P1-B2 int
20、erconnected with pin Pl-Al3, the output at pin P1-A2 shall be +2.53 + 0.25V dc, measured with respect to pin Pl-Al3. - TABLE I. Resistance. Measure Between Item Pin Pin Resistance in Ohms 1 2 3 4 5 6 7 8 9 10 11 13 14 15 16 17 18 19 20 21 22 23 24 12 P1-B22 P1-B24 P1-A24 Pl-A21 Pl-B20 P1-B21 P1-A22
21、P1-B3 P1-A11 Pl-Al6 Pl-Bl6 Pl-Al8 P1-B9 Pl-Bl8 Pl-Al9 Pl-Al7 P1-A20 P1-B12 Pl-A10 PI.-B19 Pl-BI1 Pl-BlO P1-A30 P1-B23 P1-A23 P1-A23 P1-A23 P1-A23 P1-A23 P1-A23 P1-A23 Pl-Bl7 P1-B17 Pl-Bl7 Pl-Bl7 Pl-Bl7 Pl-Bl7 Pl-Bl7 Pl-Bl7 Pl-Bl7 P1-B17 Pl-Bl7 P1-B17 Pl-Bl7 Pl-Bl7 Pl-Bl7 P1-B2 Pl-Al 97,600 + 976 97,
22、600 T 976 97,600 T 976 140,000 T 1,400 158,000 T 1,580 158,000 T 1,580 46,400 T 464 280,000 T 2,800 97,600 976 294,000 T 2,940 32,400 T 324 53,600 T 536 97,600 T 976 97,600 976 97,600 T 976 150,000 T 1,500 294,000 T 2,940 97,600 976 32,400 T 324 150,000 T 1,500 294,000 T 2,940 150,000 T 1,500 99,800
23、 T 998 150,000 - 1,500 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TABLE I. Loads, power and signals. Item Conditions Characteristics Pin Connector 1.0 Power Sources 1.1 5.25V dc Tolerance: + 0.15V dc Ripple: 20-mV p-p max Current: 500 ma min R
24、ipple: 20-mV p-p max Current: 500 ma min 1.2 15V dc Tolerance: +O.O3OV dc 1.3 -15V dc Tolerance: +O.O3OV dc Ripple: 20-mV p-p max Current: 500 ma min 2.0 Signal Sources 2.1 30V, 400 Hz Square wave: +15V to -15V (MR1) Tolerances: +0.150V - + 1 Hz, phase-1 2.2 30V, 400 Hz Square wave: +15V to -15V (MR
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