ANSI BICSI NECA-607-2011 Standard for Telecommunications Bonding and Grounding Planning and Installation Methods for Commercial Buildings.pdf
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1、 TStandard forTelecommunications Bonding andGrounding Planning and InstallationMethods for Commercial BuildingsNECA/BICSI 607-2011An AmericanNational StandardPublished byNational ElectricalContractors AssociationDeveloped jointly withBICSIiii Table of Contents Foreword . v 1. Scope 1 2. Normative Re
2、ferences . 2 3. Definitions, Abbreviations and Acronyms, Units of Measurement 3 3.1 General 3 3.2 Definitions 3 3.3 Abbreviations and acronyms . 4 3.4 Units of measurement . 4 4. Regulatory 5 4.1 National requirements . 5 4.2 Local code requirements 5 5. Components . 6 5.1 Conductor . 6 5.2 Busbar .
3、 6 5.2.1 Telecommunications main grounding busbar (TMGB) 6 5.2.2 Telecommunications grounding busbar (TGB) 6 5.3 Bonding connector 6 5.3.1 Compression . 6 5.3.2 Mechanical 6 5.3.3 Exothermic 7 6. Planning 8 6.1 General 8 6.1.1 Bonding to the electrical power system 8 6.1.2 Primary protector 8 6.2 Bo
4、nding conductor 8 6.2.1 General 8 6.2.2 Size . 8 6.2.3 Usage 8 6.3 Busbar . 9 6.3.1 Telecommunications main grounding busbar (TMGB) 9 6.3.2 Telecommunications grounding busbar (TGB) 9 6.4 Bonding connections . 9 6.5 Connections to the TMGB/TGB . 10 6.5.1 Electrical distribution panel (EDP) . 10 6.5.
5、2 Building steel 10 6.5.3 Conduit . 10 6.5.4 Telecommunications equipment bonding conductor (TEBC) . 10 iv NECA/BICSI 607 Telecommunications Bonding and Grounding Planning and Installation Methods for Commercial Buildings 6.6 Bonding equipment, racks and cabinets 10 6.6.1 General 10 6.6.2 Example A
6、11 6.6.3 Example B . 11 6.6.4 Example C . 11 6.6.5 Rack isolation 12 7. Installation Requirements . 13 7.1 General 13 7.1.1 Safety 13 7.1.2 Bonding to the electrical power system 13 7.1.3 Primary protector 13 7.1.4 Equipment room (ER) . 13 7.1.5 Telecommunication room (TR) 13 7.1.6 Backbone cables w
7、ith shields . 13 7.2 Bonding conductors 13 7.3 Bonding connections . 14 7.4 Telecommunications main grounding busbar/telecommunications grounding bus- bar TMGB/TGB 14 7.4.1 Installation of the TMGB/TGB . 14 7.4.2 Connections between a TMGB/TGB and an EDP 14 7.5 Bonding the TBB, GE, TEBC, UBC, or RBC
8、 to the TMGB or the TGB . 14 7.5.1 General 14 7.5.2 Installation 15 7.6 Routing the TEBC from the TMGB/TGB to the rack/cabinet 18 7.6.1 General 18 7.6.2 Bends 19 7.6.3 Separation . 19 7.7 Bonding equipment cabinets/ equipment racks to the TEBC . 19 7.7.1 Structural bonding of equipment cabinets/equi
9、pment racks . 20 7.8 Bonding equipment to the rack bonding conductor or rack grounding busbars 20 7.9 Bonding cable runways and cable trays 20 7.9.1 General 20 7.9.2 Installation 22 7.10 Ancillary bonding . 22 7.11 Two-point ground/continuity testing . 22 7.12 Inspection 23 Annex A: Bibliography and
10、 references (informative) . 24 v (This foreword is not a part of the standard) Foreword Introduction National Electrical Installation Standards(NEIS) are designed to improve communication among speci- fiers, purchasers, and suppliers of electrical construc- tion services. They define a minimum basel
11、ine of quality and workmanship for installing electrical prod- ucts and systems. NEIS are intended to be referenced in contract documents for electrical construction pro- jects. The following language is recommended: Telecommunications bonding and grounding planning and installations shall be instal
12、led in accordance with NECA/BICSI 607-2011, Standard for Bonding and Grounding Planning and Installation Methods for Commercial Buildings. The National Electrical Contractors Association (NECA) asked BICSI, a Telecommunications Association, together undertook the task of develop- ing this grounding
13、and bonding standard for telecommunications systems and equipment. NECA-BICSI standards are developed within the Technical Committees of BICSI and NECA. Members of the respective committees serve voluntarily and without compensation. The companies they repre- sent are not necessarily members of BICS
14、I or NECA. The standards developed by these committees repre- sent a consensus of the broad expertise from within BICSI and NECA as well as from those outside that have an expressed interest. The viewpoint expressed at the time this standard was approved was from the contributors experience and the
15、state of the industry at that time. Users are encouraged to confirm that they have the latest edition of this standard. NECA- BICSI reviews its standards, at the minimum, every 5 years. At that time standards are reaffirmed, rescinded or revised accordingly. Any suggested revisions to be included in
16、 the next edition should be sent to NECA or BICSI. This standard has been prepared by BICSI/NECA under the joint jurisdiction of BICSI and NECA and approved by consensus ballot in accordance with the requirements of the American National Standards Association (ANSI). Use of NEIS is voluntary, and ne
17、ither NECA nor BICSI assume any obligation or liability to users of this publication. Existence of a standard shall not preclude any member or non- member of either organization from specifying or using alternate construction methods permitted by applicable regulations. This publication is intended
18、to comply with the edition of the National Electrical Code(NEC) in effect at the time of publication. Because they are quality standards, NEIS may exceed the minimum safety requirements of the NEC. It is the responsibility of users of this publication to com- ply with state and local regulations whe
19、n installing electrical products and systems. Suggestions for revisions and improvements to this standard should be addressed to: NECA Standards either discharging directly to the ground itself or to structures in contact with ground. vi NECA/BICSI 607 Telecommunications Bonding and Grounding Planni
20、ng and Installation Methods for Commercial Buildings Electrical transients must return to their source, many times following similar ground paths. In either event, proper bonding reduces the harmful effects associated with these electrical events. Metallic components for power distribution systems a
21、re bonded together to provide an effective ground- fault current path to allow proper operation of over- current devices. For telecommunications systems, metallic components are bonded to provide a low impedance path for electrical surges and transient voltages to return to their power source. The e
22、arth is also involved as a path for grounded (earthed) power systems and for lightning events. Lightning, fault cur- rents, circuit switching (motors starting and stop- ping), and electrostatic discharge (ESD) are common causes of surges and transient voltages. An effective bonding and grounding sys
23、tem helps to minimize the damaging effects of electrical surges. Proper bonding and grounding of electrical and information transport systems (ITS) infrastructure facilitates their intended operation. Improperly bonded and grounded electrical systems are a prima- ry cause of power quality issues, wh
24、ich may affect information technology (IT) systems operation. Other performance items related to bonding and grounding for telecommunications within a building involve power systems, surge protective devices, and electromagnetic compatibility (EMC). IEEE 1100- 2005 contains recommended practices on
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