REG NASA-LLIS-0561-1997 Lessons Learned Voyager Plated - Through Hole Failures (1976).pdf
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1、Lessons Learned Entry: 0561Lesson Info:a71 Lesson Number: 0561a71 Lesson Date: 1997-07-31a71 Submitting Organization: JPLa71 Submitted by: D. Oberhettinger/G. KunstmannSubject: Voyager Plated - Through Hole Failures (1976) Abstract: During initial testing of multi-layer circuit boards for Voyager, d
2、efective copper plating was found to have caused cracks in the barrels of plated-through holes. Recommendations involve monitoring of fabrication processes, performance of thermal cycling screening tests, and use of test coupons.Description of Driving Event: In January 1976, a problem became evident
3、 during initial testing of the earliest Command & Control Subsystem (CCS) subassemblies for Voyager. Detailed testing revealed multiple, often intermittent, functional failures. The failures were traced to the multi-layer boards (MLBs), specifically the plated-through holes (PTHs).refer to D descrip
4、tion DThe extent of the problem was determined by subjecting selected subassemblies to a detailed sequence of resistive measurements and temperature cycling. The sequence was designed to stress the PTHs without over-stressing the components installed on the MLBs. MLB fabrication documentation, test
5、history, and theoretical analyses were reviewed. Failure analysis of hard failures, PTHs that exhibited early signs of failures, and PTHs which had appeared acceptable, revealed PTH copper plating that was marginal - too thin and of insufficient ductility.This incident involved Viking board designs
6、inherited by Voyager. The Voyager boards were fabricated 3-4 months later in a follow-on contract in which the same contractor presumably used the same specification and process. However, micro-photographs of the Voyager boards showed insufficient plating, and metallurgical tests showed insufficient
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