KS C IEC 60455-1-2003 Resin based reactive compounds used for electrical insulation－Part 1：Definitions and general requirements《电气绝缘用树脂基电抗化合物 第1部分 定义和通用要求》.pdf

《KS C IEC 60455-1-2003 Resin based reactive compounds used for electrical insulation－Part 1：Definitions and general requirements《电气绝缘用树脂基电抗化合物 第1部分 定义和通用要求》.pdf》由会员分享，可在线阅读，更多相关《KS C IEC 60455-1-2003 Resin based reactive compounds used for electrical insulation－Part 1：Definitions and general requirements《电气绝缘用树脂基电抗化合物 第1部分 定义和通用要求》.pdf（9页珍藏版）》请在麦多课文档分享上搜索。

1、 KS C IEC 60455-1KSKSKSKSSKSKSKS KSKSKS SKSKS KSKS SKS KS 1： KS C IEC 60455-1 : 2003 (2008 ) 2003 5 26 http:/www.kats.go.kr : ( ) ( ) ( ) : (http:/www.standard.go.kr) ： : 2003 5 26 : 2008 10 29 2008-0706 ： ( 503-7949) . (http:/www.kats.go.kr) 10 5 , ICS 29.035.01 KS C IEC 1： 60455 1： 2003(2008) Resi

2、n based reactive compounds used for electrical insulation Part 1：Definitions and general requirements 1998 2 IEC 60455 1 Resin based reactive compounds used for electrical insulation Part 1： Definitions and general requirements , . 1. . . . . IEC . 1 . 1 (casting compound) (embedding compound) (pott

3、ing compound) (encapsulating compound) (impregnating compound) (for dipping procedure) (for trickling procedure) (for vacuum pressure impregnation) CC EBC PC ECC IC ICD ICT VPI . . 2. . , . . 2 . ISO 1043 1 . . . ISO 1043 2 . ISO 4597 1 . C IEC 60455 1： 2003 2 2 (acrylic) (epoxy) (polyurethane) (sil

4、icone) (unsaturated polyester) A EP PUR SI UP 3. . . KS C IEC 60455 2 2： KS M ISO 472 IEC 60050(212)： 1990 (IEV) 212： , ISO 1043 1： 1987 1： ISO 1043 2： 1988 2： ISO 4597 1： 1983 1： 4. IEC 60050(212) KS M ISO 472 . IEC 60050(212) KS M ISO 472 . 4.1 (reactive compound) , , , . . . , . 4.2 (cured compou

5、nd) . (self supporting). 4.3 (reactive component) , , , , . 4.4 (resin) , , . . 4.5 (acrylic resin：A) , (copolymer). 4.6 (epoxy resin：EP) 4.7 (polyurethane resin：PUR) 4.8 (silicone resin：SI) 4.9 (unsaturated polyester resin：UP) C IEC 60455 1： 2003 3 4.10 (reactive diluent) . 4.11 (hardener) 4.12 (a

6、ccelerator) 4.13 (inhibitor) 4.14 (filler) , , , 4.15 (cure, curing) 4.16 (polymerization) 4.17 (crosslinking) 2 4.18 (pot life) 4.19 (shelf life) 4.20 (casting compound：CC) IEC 60050(212) , . IEC 60050(212) . 4.20.1 (embedding compound：EBC) . . , . 4.20.2 (potting compound：PC) . . 4.21 (encapsulati

7、ng compound：ECC) , , , 4.22 (Impregnating compound：IC) , . (ICD), (ICT) (VPI) . 5. 3 . KS C IEC 60455 2 6.4.4.1 . KS C IEC 610061* . . . * 1 A . C IEC 60455 1： 2003 4 3 ( ) 1 2 3 4 5 160 135 125 110 100 160 135 125 110 6 7 8 9 10 75 50 25 0 20 100 75 50 25 0 11 20 6. , KSC IEC 60455 3 . 6.1 . 6.2 .

8、, , . . , ( ) ( 2 ) 1 L, 2.5 L, 5 L, 25 L 205 L 6.3 , . C IEC 60455 1： 2003 5 A() 1 KS C IEC 61006： 2002 1： 135513 7017 (02)60094567 (02)600948878 http:/ KS C IEC 60455-1： 2003KSKSKS SKSKS KSKS SKS KS SKS KSKS SKSKS KSKSKS Resin based reactive compounds used for electrical insulation Part 1：Definitions and general requirements ICS 29.035.01 Korean Agency for Technology and Standards http:/www.kats.go.kr