GOST R IEC 61188-5-1-2012 Printed boards and printed boards assemblies Design and use Part 5-1 Attachment (land joint) considerations Generic requirements《印制板和印制板组件 设计和使用 第5-1部分 连接.pdf

《GOST R IEC 61188-5-1-2012 Printed boards and printed boards assemblies Design and use Part 5-1 Attachment (land joint) considerations Generic requirements《印制板和印制板组件 设计和使用 第5-1部分 连接.pdf》由会员分享，可在线阅读，更多相关《GOST R IEC 61188-5-1-2012 Printed boards and printed boards assemblies Design and use Part 5-1 Attachment (land joint) considerations Generic requirements《印制板和印制板组件 设计和使用 第5-1部分 连接.pdf（62页珍藏版）》请在麦多课文档分享上搜索。

1、 61188-5-12012 . 5-1 ( ) IEC 61188-5:2002Printed boards and printed board assemblies Design and use Part 5-1: Attachment (land/joint) considerations Generic requirements(IDT) 1 - ( ) 4 , / 912 420 , , , -3 3 26 2012 . 434-4 61188-5-1:2002 . . 5-1 (/). (IEC 61188-5-1:2002 Printed boards and printed b

2、oardassemblies Design and use Part 5-1: Attachment (land/joint) considerations Generic requirements). - 1.5 ( 3.5). 61188-5 . - . 5. ( ) :- 5-1. ;- 5-2. ;- 5-3. ;- 5-4. J- ;- 5-5. ;- 5-6. J- ;- 5-8. (BGA, FBGA, CGA, LGA). A . B 61188-5-1 3 ,- 1.52012 ( 8.1.2). - , 5 1.02012 ( 8). ( 1 ) , -.()- . , -

3、 (gost.ru) , 2015 , - - II 61188-5-120121 .12 13 , 23.1 .23.2 .54 .64.1 .64.2 .84.3 204.4 .214.5 224.6 355 375.1 .376 376.1 376.2 .386.3 396.4 406.5 .406.6 .416.7 417 .427.1 .447.2 467.3 467.4 .468 .478.1 .478.2 .488.3 498.4 .498.5 518.6 51 A () .54 () .57III 61188-5-12012 . 5-1 ( ) Printed boards a

4、nd printed board assemblies. Design and use.Part 5-1. Attachment (land/joint) considerations. Generic requirements 201307011 , . - , , , , .2 . - . ( ). 60097 (IEC 60097, Grid systems for printedcircuits) 60194 . , . (IEC 60194, Printed board design, manufacture and assembly Terms and definitions) 6

5、1188-1-1 1-1. (IEC 61188-1-1, Printedboards and printed board assemblies Design and use Part 1-1: Generic requirements Flatnessconsiderations for electronic assemblies) 61191-1 . 1: . (IEC 61191-1, Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and electr

6、onic assemblies using surface mount and related assemblytechnologies) 61191-2 . 2: (IEC 61191-2, Printed board assemblies Part 2: Sectional specification Requirements for surface mountsoldered assemblies) 61192-1 . 1: (IEC 61192-1,Workmanship requirements for soldered electronic assemblies Part 1: G

7、eneral) 61192-2 2: (IEC 61192-2, Workmanship requirements for soldered electronic assemblies Part 2:Surface-mount assemblies)1 61188-5-12012 61760-1 1: - () (IEC 61760-1, Surface mounting technology Part 1:Standard method for the specification of surface mounting components (SMDs) 62326 ( ) (IEC 623

8、26 (All parts), Printed boards)3 , 60194, - .3.1 3.1.1 (buried via): , - .3.1.2 (blind via): , . 601943.1.3 (assembly,double-sided): , , .3.1.4 (castellation): - , . 601943.1.5 (tented via): , , - , . - ( ), () . .3.1.6 (courtyard excess): , . - X Y.3.1.7 (integrated circuit (IC): , . 601943.1.8 (co

9、mponent): , , , (. 60194). 601943.1.9 (land): , , ,.3.1.10 (master drawing): , , - , , , . 601943.1.11 (grid): , . 601943.1.12 DIP (dual in-line package (DIP): , , - . 601943.1.13 Flat Pack (flat pack): , , . 601943.1.14 SIP (single in-line package (SIP): - .2 61188-5-120123.1.15 (chip carrier): , ,

10、 - , . .(.)3.1.16 (leadless chip carrier): , , (. ). 601943.1.17 (leaded chip carrier): , - , (. - ). 601943.1.18 () (coefficient of thermal expansion(CTE): , (. ). 601943.1.19 (primary side): , - . ( , .) 601943.1.20 (base material): , . ( , -; , .) 601943.1.21 (module): . 601943.1.22 (through-hole

11、 technology (THT): - , ( -) () .3.1.23 (courtyard manufacturing zone): , :- ;- , - ;- , , .3.1.24 (jumper wire): , - , . 601943.1.25 (thermal expansion mismatch): , (. ().3.1.26 (constraining core): , . 601943.1.27 (basic dimension): , .( , .) 601943.1.28 (nominal dimension): , ( ).3.1.29 () (courtyard): , - ( ) .3.1.30 (secondary side): , . ( .) 601943 61188-5-120123.1.31 (assembly, single-sided): ,