FORD ESB-M99J344-A-2012 CHIP RESISTANT COATING ONE COMPONENT PAINTABLE NON-MASKING 38 MICROMETER MINIMUM FILM THICKNESS TO BE USED WITH FORD WSS-M99P1111-A 《单组份尿烷可涂装的不遮蔽最小膜厚度为38 .pdf

《FORD ESB-M99J344-A-2012 CHIP RESISTANT COATING ONE COMPONENT PAINTABLE NON-MASKING 38 MICROMETER MINIMUM FILM THICKNESS TO BE USED WITH FORD WSS-M99P1111-A 《单组份尿烷可涂装的不遮蔽最小膜厚度为38 .pdf》由会员分享，可在线阅读，更多相关《FORD ESB-M99J344-A-2012 CHIP RESISTANT COATING ONE COMPONENT PAINTABLE NON-MASKING 38 MICROMETER MINIMUM FILM THICKNESS TO BE USED WITH FORD WSS-M99P1111-A 《单组份尿烷可涂装的不遮蔽最小膜厚度为38 .pdf（5页珍藏版）》请在麦多课文档分享上搜索。

1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions Rev 02 2012 02 16 N Status No replacement named N. Benipal, NA 2006 03 09 Revised Inserted 3.0; Deleted 3.1, 3.8, 4 1987 07 24 Released CDR1-PR906956 Controlled document at www.MATS Copyright 2012, Ford Global Technologies, LLC Page 1 of 5 CH

2、IP RESISTANT COATING, ONE COMPONENT, ESB-M99J344-A PAINTABLE NON-MASKING, 38 MICROMETER MINIMUM FILM THICKNESS NOT TO BE USED FOR NEW DESIGN 1. SCOPE The material defined by this specification is a heat curing one-component urethane coating which can be sprayed to a 38 - 50 micrometer film on cathod

3、ic electrocoated CRS and conductive primed plastic. The material shall provide a paintable corrosion resistant film which will withstand stone chipping. 2. APPLICATION This specification was released originally for a one-component urethane coating that provides stone chipping protection on the vehic

4、les front end. This area of a vehicle can receive moderate to severe stone chipping abuse. This material shall not require masking and must have a smooth, even appearance because of its front end location. 3. REQUIREMENTS Material specification requirements are to be used for initial qualification o

5、f materials. The material shall meet all requirements detailed in this section. Approved production material applied and tested under identical conditions shall be used as the control. In the event that both the sample under test and the control material fail any requirements, that test shall be rep

6、eated. These requirements apply to both laboratory-prepared and production batches of the coating. 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.2 COMPOSITION 3.

7、2.1 Non-Volatile, min 50% (FLTM BI 102-01) 3.3 PHYSICAL PROPERTIES 3.3.1 Weight Per Volume at 23 +/- 2 C 1.05 - 1.15 kg/L 3.3.2 Viscosity 400 - 650 cps (ASTM D 2196) ENGINEERING MATERIAL SPECIFICATION ESB-M99J344-A Copyright 2012, Ford Global Technologies, LLC Page 2 of 5 3.4 PREPARATION OF TEST PAN

8、ELS 3.4.1 System Components 3.4.1.1 Plastic Substrate System . Substrate: ESF-M4D432, 40% glass/mineral reinforced polybutylene teraphthalate. . Primer: ESB-M6J106 primer surfacer for plastics, 21 - 30 micrometer followed by a 30 minute at 150 C oven conditions bake. . Stone Chip Material: 38 - 50 m

9、icrometer dry film thickness. Within 3 min after the stone chip material application, make a wet-on-wet application of guidecoat. . Guidecoat: ESB-M6J141, 19 - 25 micrometer co-bake the stone chip material and the guidecoat as specified in para 3.4.2. . Topcoat: Prepare two sets of topcoated panels.

10、 Set I: ESB-M33J100 - Quality high solids acrylic enamel, 38 - 50 micrometer followed by the specified bake cycle. Set II: ESB-M33J3 - High solids basecoat/clearcoat; dry film thicknesses - basecoat: 15 - 20 micrometer, and clearcoat: 40 50 micrometer, followed by the specified bake cycle. 3.4.1.2 C

11、old Rolled Steel Substrate System . Substrate: Unpolished cold rolled steel. . Pretreatment: ESB-M3P1 zinc phosphate. . Primer: ESB-M64J23 high build cathodic electrocoat primer, 30 - 33 micrometer followed by the specified bake cycle. . Stone Chip Material: 38 - 50 micrometer Within 3 min after the

12、 stone chip material application, make a wet-on-wet application of guidecoat. . Guidecoat: ESB-M6J141, 19 - 25 micrometer; co-bake the stone chip material and the guidecoat as specified in para 3.4.2. . Topcoat: Prepare two sets of topcoated panels. Set I: ESB-M33J100 - Quality high solids acrylic e

13、namel, 38 - 50 micrometer followed by the specified bake cycle. Set II: ESB-M33J3 - High solids basecoat/clearcoat; dry film thicknesses - basecoat: 15 - 20 micrometer, and clearcoat: 40 50 micrometer, followed by the specified bake cycle. ENGINEERING MATERIAL SPECIFICATION ESB-M99J344-A Copyright 2

14、012, Ford Global Technologies, LLC Page 3 of 5 3.4.2 Bake Cycle for the Stone Chip Material . Bake, min; 10 min at 149 +/- 2 C metal temperature. . Bake, max; 30 min at 163 +/- 2 C metal temperature. 3.4.3 Panel Aging Age panel 72 h at room temperature or 16 h at 43 +/- 2 C oven temperature before i

15、nitiating a test program. 3.5 APPEARANCE 3.5.1 Color Gray 3.5.2 Leveling The chip coating film shall level with a minimum of orange peel. The surface of the material under test shall be equal to or better than the approved master sample for smoothness when applied and cured under identical condition

16、s. 3.6 FILM PROPERTIES 3.6.1 Sagging and Solvent Popping No sagging or solvent popping is allowable at 1 - 75 micrometer dry film thickness. 3.6.2 Dry Sanding Characteristics The chip coating plus ESB-M6J141 spray primer shall dry sand (using a new sheet of 280 grit stearate filled paper for each pa

17、nel) smoothly without clogging the paper and with a minimum of sand scratches. The material shall be equivalent in all respects to current approved production coating applied and tested under identical conditions. 3.6.3 Paintability No significant color shift, difference in orientation of metallic f

18、lakes (metallic paints) or other objectionable appearance defects in the topcoat over the chip coating. 3.7 RESISTANCE PROPERTIES With the exception of para 3.7.1, prepare the test panels as stated in para 3.4. For 3.7.1, prepare the panels as described therein. 3.7.1 Adhesion (FLTM BI 103-01 and FL

19、TM BI 106-01, Part B) Test Requirements: FLTM BI 103-01: Less than 3 mm creepback from the scribe. FLTM BI 106-01 Part B: No loss of topcoat or primer adhesion. ENGINEERING MATERIAL SPECIFICATION ESB-M99J344-A Copyright 2012, Ford Global Technologies, LLC Page 4 of 5 Test Method: . Prepare panels pe

20、r para 3.4 with the following exception: Apply the chip coating as a film wedge, ranging from 1 - 50 micrometer. . Scribe the entire length of the panels and salt spray test for 500 h. 3.7.2 Chip Resistance at Room Temperature Followed by Salt Spray (SAE J400 and FLTM BI 103-01) After tape adhesion,

21、 there shall be a SAE chip rating of 7B max, less than 3 mm creepback from the scribe, and no face blistering. Test Method: . Strike the test specimen with 0.47 L of gravel per SAE J400. . Scribe an “X“ to the substrate on the lower 75 mm of the test specimen. . Expose to salt spray for 500 h per FL

22、TM BI 103-01. . Within 30 min after the completion of salt spray testing, apply ESF-M3G48 tape, with firm thumb pressure, to the entire surface of the part. Remove the tape by pulling one end at a 90 angle with moderate speed. 3.7.3 Condensing Humidity, min 240 h (FLTM BI 104-02, Procedure A) No bli

23、stering or loss of gloss. 3.7.4 Accelerated Weathering Resistance Panels shall show no more than a minimum degree of fading, chalking or dulling. No increase of brittleness or loss of adhesion is permitted and panels shall be completely free from evidence of cracking, checking, blistering, or peelin

24、g when exposed to the following cycle for 500 h: . 4 h at 60 C with ultraviolet light exposure. . 4 h at 50 C condensing water exposure. 3.7.5 Florida Exposure Panels shall be prepared as in para 3.7.1, scribed with an “X“ to bare metal and exposed in the Miami, Florida area at 5 facing south for 12

25、 months. There shall be no blistering, peeling or visible rusting along the scribe marks more than 3 mm total width. 3.7.6 Cold Checking Resistance (FLTM BI 107-02) Shall withstand a minimum of 10 cold test cycles without cracking or noticeable dulling when cured at the minimum baking temperature. E

26、NGINEERING MATERIAL SPECIFICATION ESB-M99J344-A Copyright 2012, Ford Global Technologies, LLC Page 5 of 5 3.7.7 Storage Stability The chip coating shall be stored at ambient room temperature below 38 C, away from all sources of heat. Heat greatly accelerates aging. Under these storage conditions, the minimum shelf life of the material shall be 3 months. When this material is stored at temperatures below 23 C, it shall be conditioned at room temperature prior to application. Adequate conditioning permits the material to obtain its maximum application properties.