DLA SMD-5962-98632 REV A-1999 MICROCIRCUIT DIGITAL RADIATION HARDENED ADVANCED CMOS DUAL J-K FLIP-FLOP WITH SET AND RESET MONOLITHIC SILICON《微型电路 数字型 辐射加固CMOS 带设置和重置功能的双路J-K触发器 单块硅.pdf

《DLA SMD-5962-98632 REV A-1999 MICROCIRCUIT DIGITAL RADIATION HARDENED ADVANCED CMOS DUAL J-K FLIP-FLOP WITH SET AND RESET MONOLITHIC SILICON《微型电路 数字型 辐射加固CMOS 带设置和重置功能的双路J-K触发器 单块硅.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-98632 REV A-1999 MICROCIRCUIT DIGITAL RADIATION HARDENED ADVANCED CMOS DUAL J-K FLIP-FLOP WITH SET AND RESET MONOLITHIC SILICON《微型电路 数字型 辐射加固CMOS 带设置和重置功能的双路J-K触发器 单块硅.pdf（28页珍藏版）》请在麦多课文档分享上搜索。

1、NOTICE OF REVISION (NOR)THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED.1. DATE(YYMMDD)99-09-13Form ApprovedOMB No. 0704-0188Public reporting burden for this collection is estimated to average 2 hours per response, including the time for reviewinginstructions, searching exi

2、sting data sources, gathering and maintaining the data needed, and completing and reviewing thecollection of information. Send comments regarding this burden estimate or any other aspect of this collection of information,including suggestions for reducing this burden, to Department of Defense, Washi

3、ngton Headquarters Services, Directorate forInformation Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and to the Office of Management and Budget, Paperwork Reduction Project (0704-0188), Washington, DC 20503.PLEASE DO NOT RETURN YOUR COMPLETED FORM TO EI

4、THER OF THESE ADDRESSED. RETURN COMPLETEDFORM TO THE GOVERNMENT ISSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURING ACTIVITYNUMBER LISTED IN ITEM 2 OF THIS FORM.2. PROCURINGACTIVITY NO.3. DODAAC4. ORIGINATORb. ADDRESS (Street, City, State, Zip Code)Defense Supply Center, Columbus3990 East Broad

5、StreetColumbus, OH 43216-50005. CAGE CODE672686. NOR NO.5962-R 075-99a. TYPED NAME (First, Middle Initial,Last)7. CAGE CODE672688. DOCUMENT NO.5962-986329. TITLE OF DOCUMENTMICROCIRCUIT, DIGITAL, RADIATION HARDENED ADVANCED CMOS,DUAL J-K FLIP-FLOP WITH SET AND RESET, MONOLITHIC SILICON10. REVISION L

6、ETTER11. ECP NO.No users listed.a. CURRENTInitialb. NEWA12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIESAll13. DESCRIPTION OF REVISIONSheet 1: Revisions ltr column; add “A“.Revisions description column; add “Changes in accordance with NOR 5962-R075-99“.Revisions date column; add “99-09-13“.Re

7、vision level block; add “A“.Rev status of sheets; for sheets 1, 4, and 19 through 25 add “A“.Sheet 4: Add new paragraph which states; “3.1.1 Microcircuit die . For the requirements for microcircuit die, see appendix A tothis document.“Revision level block; add “A“.Sheets 19 through 25: Add attached

8、appendix A.CONTINUED ON NEXT SHEETS14. THIS SECTION FOR GOVERNMENT USE ONLYa. (X one) X (1) Existing document supplemented by the NOR may be used in manufacture.(2) Revised document must be received before manuf acturer may incorporate this change.(3) Custodian of master document shall make above re

9、vision and furnish revised document.b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FORGOVERNMENTDSCC -VACc. TYPED NAME (First, Middle Initial, Last)MONICA L. POELKINGd. TITLECHIEF, ACTIVE DEVICES TEAMe. SIGNATUREMONICA L. POELKINGf. DATE SIGNED(YYMMDD)99-09-1315a. ACTIVITY ACCOMPLISHING REVISIONDSCC -VACb

10、. REVISION COMPLETED (Signature)JOSEPH A. KERBYc. DATE SIGNED(YYMMDD)99-09-13DD Form 1695, APR 92 Previous editions are obsolete.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-98632DEFENSE SUPPLY CENTER COLUMBU

11、SCOLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 19DSCC FORM 2234APR 97Document No: 5962-98632Revision: AAPPENDIX A NOR No: 5962-R 075-99APPENDIX A FORMS A PART OF SMD 5962-98632 Sheet: 2 of 8 10. SCOPE10.1 Scope . This appendix establishes minimum requirements for microcircuit die to be supplied u

12、nder the QualifiedManufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturersapproved QM plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices usingchip and wire designs in accordance wit

13、h MIL-PRF-38534 are specified herein. Two product assurance classes consisting ofmilitary high reliability (device class Q) and space application (device Class V) are reflected in the Part or Identification Number(PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflec

14、ted in the PIN.10.2 PIN . The PIN shall be as shown in the following example:5962 F 98632 01 V 9 AFederal RHA Device Device Die DieStock class designator type class code Detailsdesignator (see 10.2.1) (see 10.2.2) designator (see 10.2.4)(see 10.2.3) Drawing Number 10.2.1 RHA designator . Device clas

15、ses Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels. Adash (-) indicates a non-RHA die.10.2.2 Device type(s) . The device type(s) shall identify the circuit function as follows:Device type Generic number Circuit function01 ACS109 Radiation Hardened, SOS, advanced CMOS,du

16、al J-K flip-flop with set and reset.10.2.3 Device class designator .Device class Device requirements documentationQ or V Certification and qualification to the die requirements of MIL-PRF-38535.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD

17、MICROCIRCUIT DRAWINGSIZEA 5962-98632DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 20DSCC FORM 2234APR 97Document No: 5962-98632Revision: AAPPENDIX A NOR No: 5962-R 075-99APPENDIX A FORMS A PART OF SMD 5962-98632 Sheet: 3 of 8 10.2.4 Die Details . The die details desi

18、gnation shall be a unique letter which designates the die s physical dimensions, bondingpad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product andvariant supplied to this appendix.10.2.4.1 Die Physical dimensions .Die Type Fi

19、gure number01 A-110.2.4.2 Die Bonding pad locations and Electrical functions .Die Type Figure number01 A-110.2.4.3 Interface Materials .Die Type Figure number01 A-110.2.4.4 Assembly related information .Die Type Figure number01 A-110.3 Absolute maximum ratings . See paragraph 1.3 within the body of

20、this drawing for details.10.4 Recommended operating conditions . See paragraph 1.4 within the body of this drawing for details.20. APPLICABLE DOCUMENTS20.1 Government specifications, standards, bulletin, and handbooks . Unless otherwise specified, the following specifications,standards, bulletin, an

21、d handbook of the issue listed in that issue of the Department of Defense Index of Specifications andStandards specified in the solicitation, form a part of this drawing to the extent specified herein.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S

22、TANDARDMICROCIRCUIT DRAWINGSIZEA 5962-98632DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 21DSCC FORM 2234APR 97Document No: 5962-98632Revision: AAPPENDIX A NOR No: 5962-R 075-99APPENDIX A FORMS A PART OF SMD 5962-98632 Sheet: 4 of 8 SPECIFICATIONDEPARTMENT OF DEFENSE

23、MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL-STD-883 - Test Methods and Procedures for Microelectronics.HANDBOOKDEPARTMENT OF DEFENSEMIL-HDBK-103 - List of Standardized Military Drawings (SMD s).(Copies of the specification, standard

24、s, bulletin, and handbook required by manufacturers in connection with specific acquisitionfunctions should be obtained from the contracting activity or as directed by the contracting activity).20.2 Order of precedence . In the event of a conflict between the text of this drawing and the references

25、cited herein, the text ofthis drawing shall take precedence.30. REQUIREMENTS30.1 Item Requirements . The individual item requirements for device classes Q and V shall be in accordance withMIL-PRF-38535 and as specified herein or as modified in the device manufacturer s Quality Management (QM) plan.

26、Themodification in the QM plan shall not effect the form, fit or function as described herein.30.2 Design, construction and physical dimensions . The design, construction and physical dimensions shall be as specified inMIL-PRF-38535 and the manufacturer s QM plan, for device classes Q and V and here

27、in.30.2.1 Die Physical dimensions . The die physical dimensions shall be as specified in 10.2.4.1 and on figure A-1.30.2.2 Die bonding pad locations and electrical functions . The die bonding pad locations and electrical functions shall be asspecified in 10.2.4.2 and on figure A-1.30.2.3 Interface m

28、aterials . The interface materials for the die shall be as specified in 10.2.4.3 and on figure A-1.30.2.4 Assembly related information . The assembly related information shall be as specified in 10.2.4.4 and figure A-1.30.2.5 Truth table . The truth table shall be as defined within paragraph 3.2.3 o

29、f the body of this document.30.2.6 Radiation exposure circuit . The radiation exposure circuit shall be as defined within paragraph 3.2.6 of the body of thisdocument.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 59

30、62-98632DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 22DSCC FORM 2234APR 97Docu ment No: 5962-98632Revision: AAPPENDIX A NOR No: 5962-R 075-99APPENDIX A FORMS A PART OF SMD 5962-98632 Sheet: 5 of 8 30.3 Electrical performance characteristics and post- irradiation pa

31、rameter limits . Unless otherwise specified herein, theelectrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this document.30.4 Electrical test requirements . The wafer probe test requirements shall include functional and parametric t

32、esting sufficient tomake the packaged die capable of meeting the electrical performance requirements in table I.30.5 Marking . As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer,shall be identified with the wafer lot number, the certifica

33、tion mark, the manufacturer s identification and the PIN listed in 10.2herein. The certification mark shall be a “QML ” or “Q ” as required by MIL-PRF-38535.30.6 Certification of compliance . For device classes Q and V, a certificate of compliance shall be required from aQML-38535 listed manufacture

34、r in order to supply to the requirements of this drawing (see 60.4 herein). The certificate ofcompliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that themanufacturer s product meets, for device classes Q and V, the requirements of MIL-PRF-

35、38535 and the requirements herein.30.7 Certificate of conformance . A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shallbe provided with each lot of microcircuit die delivered to this drawing.40. QUALITY ASSURANCE PROVISIONS40.1 Sampling and inspection . For dev

36、ice classes Q and V, die sampling and inspection procedures shall be in accordancewith MIL-PRF-38535 or as modified in the device manufacturer s Quality Management (QM) plan. The modifications in the QM planshall not effect the form, fit or function as described herein.40.2 Screening . For device cl

37、asses Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in themanufacturer s QM plan. As a minimum it shall consist of:a) Wafer Lot acceptance for C lass V product using the criteria defined within MIL-STD-883 TM 5007.b) 100% wafer probe (see paragraph 30.4).c) 100% intern

38、al visual inspection to the applicable class Q or V criteria defined within MIL-STD-883 TM2010or the alternate procedures allowed within MIL-STD-883 TM5004.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-98632DE

39、FENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 23DSCC FORM 2234APR 97Document No: 5962-98632Revision: AAPPENDIX A NOR No: 5962-R 075-99APPENDIX A FORMS A PART OF SMD 5962-98632 Sheet: 6 of 8 40.3 Conformance inspection .40.3.1 Group E inspection . Group E inspection is

40、required only for parts intended to be identified as radiation assured (see30.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing ofpackaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified

41、within paragraphs 4.4.4.1,4.4.4.1.1, 4.4.4.2, 4.4.4.3 and 4.4.4.4.50. DIE CARRIER50.1 Die carrier requirements . The requirements for the die carrier shall be in accordance with the manufacturer s QM plan oras specified in the purchase order by the acquiring activity. The die carrier shall provide a

42、dequate physical, mechanical andelectrostatic protection.60. NOTES60.1 Intended use . Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance withMIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applica

43、tions and logisticspurposes.60.2 Comments . Comments on this appendix should be directed to DSCC-VA, Columbus, Ohio, 43216-5000 or telephone(614)-692-0674.60.3 Abbreviations, symbols and definitions . The abbreviations, symbols, and definitions used herein are defined withMIL-PRF-38535 and MIL-HDBK-

44、1331.60.4 Sources of Supply for device classes Q and V . Sources of supply for device classes Q and V are listed in QML-38535.The vendors listed within QML-38535 have submitted a certificate of compliance (see 30.6 herein) to DSCC-VA and have agreedto this drawing.Provided by IHSNot for ResaleNo rep

45、roduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-98632DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 24DSCC FORM 2234APR 97Document No: 5962-98632Revision: AAPPENDIX A NOR No: 5962-R 075-99APPENDIX A FORMS A PART OF

46、 SMD 5962-98632 Sheet: 7 of 8 FIGURE A-1o DIE PHYSICAL DIMENSIONSDie Size: 2390 x 2390 microns.Die Thickness: 21 +/-2 mils.o DIE BONDING PAD LOCATIONS AND ELECTRICAL FUNCTIONSThe following metallization diagram supplies the locations and electrical functions of the bonding pads. The internal metalli

47、zationlayout and alphanumeric information contained within this diagram may or may not represent the actual circuit defined by this SMD.NOTE: Pad numbers reflect terminal numbers when placed in Case Outlines E, X (see Figure 1).Provided by IHSNot for ResaleNo reproduction or networking permitted wit

48、hout license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-98632DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 25DSCC FORM 2234APR 97Document No: 5962-98632Revision: AAPPENDIX A NOR No: 5962-R 075-99APPENDIX A FORMS A PART OF SMD 5962-98632 Sheet: 8 of 8 o INTERFACE MATERIALSMetal 1: AlSi 7.0kA +/- 1.0kAMetal 2 (Top) : AlSi 10.0kA +/- 1.0kABackside Metallization NoneGlassivationType: PSGThickness 13kA +/ - 1.5kASubstrate: Silicon on Sapphire (SOS)o ASSEMBLY RELATED INFORMATIONSubstrate Potential: Insulator.Special assemblyinstruct