DLA SMD-5962-94527 REV E-2004 MICROCIRCUIT LINEAR CMOS QUAD SERIAL INTERFACE 8-BIT D A CONVERTER MONOLITHIC SILICON《硅单片 四重串联接口8位交流 直流转变器 氧化物半导体线性微型电路》.pdf
《DLA SMD-5962-94527 REV E-2004 MICROCIRCUIT LINEAR CMOS QUAD SERIAL INTERFACE 8-BIT D A CONVERTER MONOLITHIC SILICON《硅单片 四重串联接口8位交流 直流转变器 氧化物半导体线性微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-94527 REV E-2004 MICROCIRCUIT LINEAR CMOS QUAD SERIAL INTERFACE 8-BIT D A CONVERTER MONOLITHIC SILICON《硅单片 四重串联接口8位交流 直流转变器 氧化物半导体线性微型电路》.pdf(14页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R035-96. 96-01-11 M. A. Frye B Changes in accordance with NOR 5962-R013-99. 98-10-28 R. Monnin C Changes in accordance with NOR 5962-R015-99 98-11-25 R. Monnin D Changes to digital input capacitance and voltage
2、 output slew rate tests in table I. Update boilerplate. Redrawn. -rrp 99-03-01 R. Monnin E Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535. Drawing updated to reflect current requirements. -rrp 04-05-25 R. Monnin REV SHET REV SHET REV STATUS REV E E E E E E E E E E E E E OF SHEETS
3、SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Sandra B. Rooney DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUI
4、T, LINEAR, CMOS, QUAD, SERIAL INTERFACE, 8-BIT D/A CONVERTER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-01-06 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-94527 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E286-04 Provided by IHSNot for ResaleNo repro
5、duction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94527 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consistin
6、g of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
7、1.2 PIN. The PIN is as shown in the following example: 5962 - 94527 01 M E X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2) Device class designator Caseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q
8、and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device
9、. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Relative accuracy 01 MAX500A Quad serial 8-bit D/A converter 1/2 LSB 02 MAX500B Quad serial 8-bit D/A converter 1 LSB 1.2.3 Device class designator. The device class desig
10、nator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification
11、 and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The l
12、ead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94527 DEFENSE SUPPLY CENTER COLUMBUS COL
13、UMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ VDDto AGND . -0.3 V dc, +17 V dc VDDto DGND . -0.3 V dc, +17 V dc VSSto DGND . -7 V dc, VDD+ 0.3 V dc VDDto VSS-0.3 V dc, +24 V dc Digital input voltage to DGND . -0.3 V dc, VDD+ 0.3 V dc VREFto AG
14、ND -0.3 V dc, VDD+ 0.3 V dc VOUTto AGND 2/ . -0.3 V dc, VDD+ 0.3 V dc Power dissipation (PD), TA= +70C 3/ : Case outline E . 800 mW Case outline 2 727 mW Storage temperature range . -65C to +150C Lead temperature (soldering, 10 sec) . +300C Junction temperature (TJ) +150C Thermal resistance, junctio
15、n-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case outline E . 100C/W Case outline 2 110C/W 1.4 Recommended operating conditions. Positive supply voltage (VDD): Dual supply operation +11.4 V dc to +16.5 V dc Single supply operation . +14.25 V dc to +15.75 V dc Ambient
16、 operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these document
17、s are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Compone
18、nt Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Documen
19、t Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ The outputs may be shorted to AGND provid
20、ed that the power dissipation of the package is not exceeded. Typical short circuit current to AGND is 25 mA. 3/ Derate above TA= +70C at 10 mW/C for case outline E, 9.09 mW/C for case outline 2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDA
21、RD MICROCIRCUIT DRAWING SIZE A 5962-94527 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes prece
22、dence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or
23、as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B d
24、evices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The cas
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