DLA SMD-5962-93174 REV E-2010 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 16-BIT BUFFER DRIVER WITH NONINVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf
《DLA SMD-5962-93174 REV E-2010 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 16-BIT BUFFER DRIVER WITH NONINVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-93174 REV E-2010 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 16-BIT BUFFER DRIVER WITH NONINVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf(19页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor cage 27014 as device type 02. Add ground bounce immunity criteria. Editorial changes throughout jak. 96-11-04 Monica L. Poelking B Change CIN, COUT, and ground bounce for device type 01. Editorial changes throughout jak. 99-03-10 Monic
2、a L. Poelking C Corrections made to figure 1 jak. 99-08-17 Monica L. Poelking D Make changes to ground bounce immunity limits for device type 02. Editorial changes throughout. jak. 03-02-18 Thomas M. Hess E Update the boilerplate paragraphs to the current requirements of MIL-PRF-38535 jak. 10-04-15
3、Thomas M. Hess REV SHEET REV E E E E SHEET 15 16 17 18 REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Wanda L. Meadows DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING CHECK
4、ED BY Thomas J. Ricciuti THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT BUFFER/DRIVER WITH NONINVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, DRAWING APPROVAL DAT
5、E 93-05-03 MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-93174 SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E231-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93174 DEFENSE SUPPLY
6、CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead fi
7、nishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93174 01 M X A Federal RHA Device Device Case Lead stock class
8、designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. De
9、vice class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit fun
10、ction 01 54ABT16244 16-bit buffer/driver with noninverting three-state outputs, TTL compatible inputs. 02 54ABT16244 16-bit buffer/driver with noninverting three-state outputs, TTL compatible inputs. 1.2.3 Device class designator. The device class designator is a single letter identifying the produc
11、t assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case
12、outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDFP1-F48 48 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for dev
13、ice class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93174 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3
14、/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to +7.0 V dc 4/ DC input clamp current (IIK) (VINVCC) . -18 mA DC output clamp current (IOK) (VOUT 0.0 V) . -50 mA DC output current (IOL) (per output
15、) . +96 mA Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C Maximum power dissipation (PD): Device type 01 . 598 mW 5/ Device type 02 . 753 mW 5/ 1.4 Recommende
16、d operating conditions. 2/ 3/ 6/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT) . +0.0 V dc to VCCMinimum high level input voltage (VIH) . +2.0 V Maximum low level input voltage (VIL) +0.8 V Case operating temperature range (TC
17、) -55C to +125C Maximum input transition rise or fall rate (t / V) (outputs enabled). 10 ns/V Maximum High level output current (IOH) -24 mA Maximum Low level output current (IOL) . +48 mA 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at t
18、he maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The input and output voltage
19、 ratings may be exceeded provided that the input and output clamp-current ratings are observed. 5/ Power dissipation values are derived using the formula PD= VCCICC + nVOLIOL, where VCCand IOLare as specified in 1.4 above, ICCand VOLare as specified in table I herein, and “n“ represents the total nu
20、mber of outputs. 6/ Unused or floating inputs must be held high or low. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93174 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4
21、DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the is
22、sue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Met
23、hod Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dap
24、s.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Noth
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