DLA SMD-5962-92186 REV C-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL BUFFER LINE DRIVER WITH NONINVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf
《DLA SMD-5962-92186 REV C-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL BUFFER LINE DRIVER WITH NONINVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-92186 REV C-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL BUFFER LINE DRIVER WITH NONINVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf(19页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add RHA data and limits. Editorial changes throughout. - jak 99-03-10 Monica L. Poelking B Update the boilerplate to current requirements as specified in MIL-PRF-38535. Editorial changes throughout. jak 07-03-15 Thomas M. Hess C Updated DC output
2、 current (ICC, IGND) in section 1.3, add source of supply information cage 0C7V7. Update the boilerplate paragraphs to current requirements as specified in MIL-PRF-38535. jwc 13-03-22 Thomas M. Hess REV SHEET REV C C C C SHEET 15 16 17 18 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1
3、2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Wanda L. Meadows DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas J. Ricciuti THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICRO
4、CIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL BUFFER/LINE DRIVER WITH NONINVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-03-31 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-92186 SHEET 1 OF 18 DSCC FORM 2233
5、 APR 97 5962- E261-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92186 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing docu
6、ments two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness
7、 Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 R 92186 01 V R A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Dra
8、wing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RH
9、A designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACTQ244 Octal buffer/line driver with noninverting three-state outputs, TTL compatible inputs 1.2.3 Device class de
10、signator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
11、 appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pac
12、k 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MIC
13、ROCIRCUIT DRAWING SIZE A 5962-92186 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage range (VIN) . -0.5 V dc to VCC + 0.5 V dc DC output voltage r
14、ange (VOUT) -0.5 V dc to VCC+ 0.5 V dc DC input clamp current (IIK) (VIN= -0.5 V and VCC+ 0.5 V) . 20 mA DC output clamp current (IOK) (VOUT= -0.5 V and VCC+ 0.5 V) . 20 mA DC output current (IOUT) (per output pin) . 50 mA DC VCCor GND current (ICC, IGND) (per pin) 50 mA Maximum power dissipation (P
15、D) 500 mW Storage temperature range (TSTG) -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +175C 4/ 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc
16、Input voltage range (VIN) . 0.0 V to VCC Output voltage range (VOUT) 0.0 V to VCCMaximum low level input voltage (VIL). 0.8 V Minimum high level input voltage (VIH) 2.0 V dc Case operating temperature range (TC) -55C to +125C Input rise and fall times (tr, tf) . 0 to 8 ns/V Maximum high level output
17、 current (IOH) . -24 mA Maximum low level output current (IOL) . +24 mA 1.5 Radiation features. Maximum total dose available (dose rate = 50 300 rads (Si)/s) . 1 x 105Rads(Si) 1/ Stresses above the absolute maximum rating may cause permanent damage to the device, Extended operation at the maximum le
18、vels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ Maximum junction temperature shall not be
19、 exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92186 DLA LAND AND MARITIME COLUMBUS,
20、OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of t
21、hese documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Elect
22、ronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk,
23、700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. JEDEC SOLI
24、D STATE TECHNOLOGY ASSOCIATION (JEDEC) JESD78 - IC Latch-Up Test. JESD20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10
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