BS ISO 16525-7-2014 Adhesives Test methods for isotropic electrically conductive adhesives Environmental test methods《胶粘剂 各向同性导电胶粘剂的试验方法 环境试验方法》.pdf

《BS ISO 16525-7-2014 Adhesives Test methods for isotropic electrically conductive adhesives Environmental test methods《胶粘剂 各向同性导电胶粘剂的试验方法 环境试验方法》.pdf》由会员分享，可在线阅读，更多相关《BS ISO 16525-7-2014 Adhesives Test methods for isotropic electrically conductive adhesives Environmental test methods《胶粘剂 各向同性导电胶粘剂的试验方法 环境试验方法》.pdf（14页珍藏版）》请在麦多课文档分享上搜索。

1、BSI Standards PublicationBS ISO 16525-7:2014Adhesives Test methods forisotropic electrically conductiveadhesivesPart 7: Environmental test methodsBS ISO 16525-7:2014 BRITISH STANDARDNational forewordThis British Standard is the UK implementation of ISO 16525-7:2014.The UK participation in its prepar

2、ation was entrusted to TechnicalCommittee PRI/52, Adhesives.A list of organizations represented on this committee can beobtained on request to its secretary.This publication does not purport to include all the necessaryprovisions of a contract. Users are responsible for its correctapplication. The B

3、ritish Standards Institution 2014. Published by BSI StandardsLimited 2014ISBN 978 0 580 76959 7ICS 83.180Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 May 201

4、4.Amendments issued since publicationDate Text affectedBS ISO 16525-7:2014 ISO 2014Adhesives Test methods for isotropic electrically conductive adhesives Part 7: Environmental test methodsAdhsifs Mthodes dessai pour adhsifs conductivit lectrique isotrope Partie 7: Mthodes dessai environnementalINTER

5、NATIONAL STANDARDISO16525-7First edition2014-05-15Reference numberISO 16525-7:2014(E)BS ISO 16525-7:2014ISO 16525-7:2014(E)ii ISO 2014 All rights reservedCOPYRIGHT PROTECTED DOCUMENT ISO 2014All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized ot

6、herwise in any form or by any means, electronic or mechanical, including photocopying, or posting on the internet or an intranet, without prior written permission. Permission can be requested from either ISO at the address below or ISOs member body in the country of the requester.ISO copyright offic

7、eCase postale 56 CH-1211 Geneva 20Tel. + 41 22 749 01 11Fax + 41 22 749 09 47E-mail copyrightiso.orgWeb www.iso.orgPublished in SwitzerlandBS ISO 16525-7:2014ISO 16525-7:2014(E) ISO 2014 All rights reserved iiiContents PageForeword iv1 Scope . 12 Normative references 13 Terms and definitions . 24 Ap

8、paratus and test board 25 Preparation of test circuit board . 36 Tests . 46.1 Test items and conditions 46.2 Procedure 47 Test report . 5BS ISO 16525-7:2014ISO 16525-7:2014(E)ForewordISO (the International Organization for Standardization) is a worldwide federation of national standards bodies (ISO

9、member bodies). The work of preparing International Standards is normally carried out through ISO technical committees. Each member body interested in a subject for which a technical committee has been established has the right to be represented on that committee. International organizations, govern

10、mental and non-governmental, in liaison with ISO, also take part in the work. ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization.The procedures used to develop this document and those intended for its further maintenan

11、ce are described in the ISO/IEC Directives, Part 1. In particular the different approval criteria needed for the different types of ISO documents should be noted. This document was drafted in accordance with the editorial rules of the ISO/IEC Directives, Part 2. www.iso.org/directives.Attention is d

12、rawn to the possibility that some of the elements of this document may be the subject of patent rights. ISO shall not be held responsible for identifying any or all such patent rights. Details of any patent rights identified during the development of the document will be in the Introduction and/or o

13、n the ISO list of patent declarations received. www.iso.org/patents.Any trade name used in this document is information given for the convenience of users and does not constitute an endorsement.The committee responsible for this document is ISO/TC 61, Plastics, Subcommittee SC 11, Products.ISO 16525

14、 consists of the following parts, under the general title Adhesives Test methods for isotropic electrically conductive adhesives: Part 1: General test methods Part 2: Determination of electric characteristics for use in electronic assemblies Part 3: Determination of heat-transfer properties Part 4:

15、Determination of shear strength and electrical resistance using rigid-to-rigid bonded assemblies Part 5: Determination of shear fatigue Part 6: Determination of pendulum-type shear impact Part 7: Environmental test methods Part 8: Electrochemical migration test methods Part 9: Determination of high-

16、speed signal-transmission characteristicsiv ISO 2014 All rights reservedBS ISO 16525-7:2014INTERNATIONAL STANDARD ISO 16525-7:2014(E)Adhesives Test methods for isotropic electrically conductive adhesives Part 7: Environmental test methodsSAFETY STATEMENT Persons using this part of ISO 16525 should b

17、e familiar with normal laboratory practice. This part of ISO 16525 does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user to establish appropriate safety and health practices and to ensure compliance with any regulatory condition

18、s.IMPORTANT Certain procedures specified in this part of ISO 16525 might involve the use or generation of substances, or the generation of waste, that could constitute a local environmental hazard. Reference should be made to appropriate documentation on safe handling and disposal after use.1 ScopeT

19、his part of ISO 16525 specifies the environmental test methods (cold, dry heat, damp heat and change of temperature) for isotropic electrically conductive adhesives used in the surface assembly of printed circuit boards of electronic devices.2 Normative referencesThe following documents, in whole or

20、 in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.ISO 291, Plastics Standard atmospheres for c

21、onditioning and testingISO 472, Plastics VocabularyISO 527-1, Plastics Determination of tensile properties Part 1: General principlesIEC 60068-1, Environmental testing Part 2: General and guidanceIEC 60068-2-1, Environmental testing Part 2: Tests Test A: ColdIEC 60068-2-2, Environmental testing Part

22、 2-2: Tests Test B: Dry heatIEC 60068-2-14, Environmental testing Part 2-14: Tests Test N: Change of temperatureIEC 60068-2-21, Environmental testing Part 2-21: Tests Test U: Robustness of terminations and integral mounting devicesIEC 60068-2-67, Environmental testing Part 2: Tests Test Cy: Damp hea

23、t, steady-state, accelerated test primarily intended for componentsIEC 61249-2-7, Materials for printed boards and other interconnecting structures Part 2-7: Reinforced base materials clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-cladIE

24、C 62137-1-1, Surface mounting technology Environmental and endurance test methods for surface mount solder joint Part 1-1: Pull strength test ISO 2014 All rights reserved 1BS ISO 16525-7:2014ISO 16525-7:2014(E)3 Terms and definitionsFor the purposes of this document, the terms and definitions given

25、in ISO 291, ISO 472 and IEC 60068-1 and the following apply.3.1four-probe resistance measuring methodtechnique with four probes, using two lead wires to supply an electric current to a specimen and the other two to detect voltage drop due to contact resistance in the specimen3.2daisy chainwiring sch

26、eme used to measure the durability of electrical connections between bonded portions of component terminals and copper land grid patterns on the substrateNote 1 to entry: In a daisy chain, components are connected on a circuit board in series using an isotropic electrically conductive adhesive.4 App

27、aratus and test board4.1 Chamber, capable of maintaining the specified temperature and humidity in an effective space. To maintain uniform temperature and humidity, forced air circulation may be used. For a test that involves a change in temperature, one or two baths may be used.4.2 Ohmmeter, capabl

28、e of measuring electrical resistance. A specified DC (or AC) current source and a voltmeter in the four-probe measurement circuit shown in Figure 1 shall be used in combination. When monitoring the resistance of a large number of test circuit boards in series, an ohmmeter made of current source and

29、a voltmeter, which can carry out a four-probe resistance measurement, may be combined with a scanner that switches measurement channels for each test circuit board.Key1 test circuit boards 3 voltage meter2 current sources 4 measured resistanceFigure 1 Test apparatus of four-probe measurement circuit

30、2 ISO 2014 All rights reservedBS ISO 16525-7:2014ISO 16525-7:2014(E)4.3 Tensile strength apparatus, as specified in ISO 527-1, which can apply compressive or tensile force to the specimen. The crosshead speed shall be between 5 mm/min and 30 mm/min.4.4 Shearing jig. When using a leadless component,

31、such as a chip resistor, a shearing jig with a tip diameter of 0,5 mm as specified in IEC 60068-2-21 shall be used.4.5 Pulling jig. When using a gull wing-type lead as a test component, such as QFP, a pulling jig as specified in IEC 62137-1-1 shall be used. The test circuit board shall be fixed to a

32、 block with an inclination of 45.4.6 Microscope, simple, with magnification from 50x to 250x and a light that illuminates the specimen at luminance around 2 000 lux shall be used.4.7 Test board, consisting of a glass fabric-based epoxy resin copper-clad laminate as specified in IEC 61249-2-7, unless

33、 otherwise specified in the product specifications. When using alternative boards, materials that do not degrade with temperature should be used. Mechanical deformation and board damage should be avoided. At a temperature of 125 C or higher, ceramic (aluminia) boards should preferably be used.4.8 Te

34、st components, containing short circuits. Components and the wires of the board shall be connected alternately to make a daisy chain, which links all the bonded portions of adhesives to be tested. It is preferable that the test component be identical to the actual ones in the structure.5 Preparation

35、 of test circuit boardPreparation of a test circuit board is specified as follows.a) Isotropic electrically conductive adhesiveIn terms of general behaviour and procedure, a paste-type isotropic electrically conductive adhesive containing an organic binder (generally, a heat-curing resin) in which m

36、etal particles or flakes are dispersed shall be used.b) PreparationAn isotropic electrically conductive adhesive shall be applied to the test circuit board using screen-printing and the test components shall be placed on it. For the application and curing of the adhesives, follow the adhesive manufa

37、cturers recommendations. If the manufacturers recommendations do not refer to the cure schedule, curing should be carried out at 150 C for 30 min in the atmosphere.NOTE To make a test circuit board, place components at the centre of the test circuit to be bonded. An example is shown in Figure 2. The

38、 position of the components on the test circuit board can be altered to an extent unless the test is not affected upon agreement between the delivering and receiving parties. ISO 2014 All rights reserved 3BS ISO 16525-7:2014ISO 16525-7:2014(E)Key1 test circuit boards 3 measuring pad 2 chip resistanc

39、e 4 quad flat packageFigure 2 Example of the position of componentsc) Visual inspectionVisual inspection or microscopic inspection shall be carried out to check the appearance and finishing.6 Tests6.1 Test items and conditionsDegrees of severity are described in terms of test temperature and time an

40、d are specified in the product specifications. The recommended test conditions shall be selected from among those shown in Table 1. The test temperature should not exceed the glass transition temperature of the specimen component. Test conditions specified in IEC 60068-2 shall be used.Table 1 Test i

41、tems and conditionsItem Normative reference Test condition Test timeCold IEC 60068-2-125 3 C40 3 C55 C 3 C500 h1 000 hDry heat IEC 60068-2-2+85 2 C+100 2 C+125 2 C500 h1 000 hDamp heat, steady state IEC 60068-2-67 +85 2 C,8532+%500 h1 000 hChange of temperature IEC 60068-2-14 Na40+100C / +85+015C40+

42、100C / +100+015C40+100C / +125+015C500 cycles1 000 cycles6.2 ProcedureThe test procedure is specified as follows.a) Initial measurement4 ISO 2014 All rights reservedBS ISO 16525-7:2014ISO 16525-7:2014(E)Visual inspection of the appearance of the test circuit board and electrical and mechanical measu

43、rement shall be carried out in accordance with the specifications.b) Test ingA test circuit board shall be placed in the test bath in accordance with 6.1. The test shall be started when the temperature has stabilized.c) Intermediate measurementElectrical measurements shall be carried out during the

44、test while the test circuit board remains in the bath. The method and time interval of measurement shall be specified. The test circuit board shall not be taken out of the bath for measurement.d) Final measurementVisual inspection of the appearance of the test circuit board and electrical and mechan

45、ical measurement shall be carried out in accordance with the specifications. Degradation and failures of the bonded portions shall be evaluated after the final measurement, according to test results. Evaluation of the failures shall be made based on the results of both electrical resistance and mech

46、anical strength.7 Test reportThe test report shall contain the following items. Some items may be selected from items b) to h) upon agreement between the delivering and receiving parties:a) a reference to this part of ISO 16525, i.e. ISO 16525-7;b) the name of the isotropic electrically conductive a

47、dhesive and its data, including the kinds of resin, filler material, manufacturers code and lot number;c) requirements of the test circuit boards and bonded portions, including material, dimensions and others;d) application and bonding procedure of the isotropic electrically conductive adhesive, inc

48、luding curing time or setting time, temperature and pressure of the adhesive procedure;e) model numbers of the test chamber, ohmmeter and general testing apparatus;f) test items, temperature and time;g) results of electrical resistance and adhesive strength;h) the date, institution and atmospheric c

49、onditions of the test. ISO 2014 All rights reserved 5BS ISO 16525-7:2014ISO 16525-7:2014(E) ISO 2014 All rights reservedICS 83.180Price based on 5 pagesThis page deliberately left blankBSI is the national body responsible for preparing British Standards and other standards-related publications, information and services.BSI is incorporated by Royal Charter. British Standards and other standardization products are published by BSI St