BS EN 153000-1998 Harmonized system of quality assessment for electronic components - Generic specification discrete pressure contact power semiconductor devices (qualification app.pdf

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1、BRITISH STANDARD BS EN 153000:1998 Harmonized system of quality assessment for electronic components Generic specification: Discrete pressure contact power semiconductor devices (Qualification approval) The European Standard EN 153000:1998 has the status of a British Standard ICS 31.080.01BSEN153000

2、:1998 This British Standard, having been prepared under the directionof the Electrotechnical Sector Board, was published underthe authorityof the Standards Boardand comes into effect on 15 July 1998 BSI 05-1999 ISBN 0 580 30206 7 National foreword This British Standard is the English language versio

3、n of EN153000:1998 published by the European Electronic Components Committee (CECC) of the European Committee for Electrotechnical Standardization (CENELEC). The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors, which has the responsibility to: aid enqu

4、irers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations r

5、epresented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Corresp

6、ondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not

7、of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, theEN title page, pages2to24 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be i

8、ndicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBSEN153000:1998 BSI 05-1999 i Contents Page National foreword Inside front cover Foreword 2 Text of EN 153000 3ii blankFachgrundspezifikation: Druckkontakt-Einzel- Leistungshalbleiter

9、bauelemente (Befhigungsanerkennung) EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 153000 April 1998 ICS 31.080.00 Descriptors: Quality, electronic components, discrete pressure contact power semiconductors English version Generic specification: Discrete pressure contact power semiconductor de

10、vices (Qualification approval) This European Standard was approved by CENELEC on 1995-11-28. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-

11、date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation und

12、er the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland,

13、Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stass

14、art 35, B-1050 Brussels 1998 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 153000:1998 EEN153000:1998 BSI 05-1999 2 Foreword This European Standard was prepared by CECC Working Group7 “Rectifier diodes and thyristors”. In the abse

15、nce of a current chairman or secretary of CECC Working Group 7, this specification was submitted to the CECC by the UK ONH under the Single Originator Procedure. It is based whenever possible on the publications of International Electrotechnical Commission (IEC) and in particular on those referred t

16、o under “Related Documents”. The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN153000 on1995-11-28. The following dates were fixed: Contents Page 1 General 3 2 Quality assessment procedures 5 3 Test and measurement procedures (general guidance) 8

17、 Annex A General inspection requirements for rectifier diodes and thyristors 14 Annex B Additional electrical test methods 17 Annex C Screening 20 Annex D Dimensions 23 Annex E Direction of applied forces for mechanical tests 23 Figure 1 Test arrangement for reverse-bias test of bipolar transistor 1

18、3 Figure B.1 Test set-up for verifying second breakdown current rating I SB 17 Figure B.2 Test set-up for verifying the collector-emitter sustaining voltage V CEOSUS of a transistor 19 Figure B.3 Current-voltage cycle for Method T-011 19 Figure D.1 Double-sided button device 23 Figure D.2 Stud mount

19、ed device 23 Figure E.1 Axes defining the direction of applied force: button devices 24 Figure E.2 Axes defining the direction of applied force: cylindrical devices 24 Table C.1 Screening sequences 21 latest date by which the EN has to be implemented at national level by publication of an identical

20、national standard or by endorsement (dop) 1998-11-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 1998-11-01EN153000:1998 BSI 05-1999 3 1 General 1.1 Scope This document applies to discrete pressure contact power semiconductor devices namely rectifie

21、r diodes, transistors, thyristors and their derivatives. The requirements also cover encapsulated assemblies. The document does not apply to stacks or assemblies made with these encapsulated components. 1.2 Related documents CECC 00 007, Basic specification: Sampling plans and procedures for inspect

22、ion attributes. CECC 00 111, RP 11: Specifications. EN 100114-1, Rule of procedure Quality Assessment Procedures Part 1: CECC requirements for the approval of an organization. EN 100114-2, Part 2: CECC requirements for the qualification approval, the release for delivery and the validity of release

23、of electronic components. IEC 60027, Letters symbols to be used in electrical technology (several parts). IEC 60050, International Electrotechnical Vocabulary. IEC 60068, Basic environmental testing procedures, namely. IEC 60068-1, Part 1: General. IEC 60068-2-2, Dry heat: Test Ba. IEC 60068-2-6, Vi

24、bration (sinusoidal): Test Fc. IEC 60068-2-14, Change of temperature: Tests Na, Nb and Nc. IEC 60068-2-17, Sealing: Tests Qc, Qk and Ql. IEC 60148, Letter symbols for semiconductor devices and integrated microcircuits. IEC 60191, Mechanical standardization of semiconductor devices (several parts). I

25、EC 60410, Sampling plans and procedures for inspection of attributes (see also CECC00007). IEC 60617, Graphical symbols for diagrams. IEC 60747-2, Semiconductor devices and integrated circuits Part 2: Rectifier diodes. IEC 60747-6, Semiconductor devices and integrated circuits Part 6: Thyristors. IS

26、O 497, Guide to the choice of series of preferred numbers and of series containing more rounded values of preferred numbers. ISO 1000, SI units and recommendations for the use of their multiples and of certain other units. ISO/R 2015, Numbering of weeks 1) . 1.3 Units, symbols and terminology Units,

27、 graphical symbols, letter symbols and terminology shall, whenever possible, be taken from the following documents: IEC 60027, Letter symbols to be used in electrical technology. IEC 60050, International electrotechnical vocabulary. IEC 60617, Graphical symbols for diagrams. ISO 1000, SI units and r

28、ecommendations for the use of their multiples and of certain other units. Any other units, symbols and terminology peculiar to one of the components covered by a generic specification, shall be taken from the relevant IEC or ISO documents, listed under “Related documents”. 1.4 Standard and preferred

29、 values Ratings and characteristics shall be chosen from IEC60747-2 and IEC60747-6 at the time of producing the Detail Specification in conjunction with the customer requirements. 1) superseded by ISO8601:1988: Data elements and interchange formats information interchange Representation of dates and

30、 timesEN153000:1998 4 BSI 05-1999 1.5 Marking of component and package The following shall be marked on the device, in the following order of precedence, as space permits. All the information, except the terminal marking, shall appear on the primary pack used as initial protection or wrapping for de

31、livery: In addition, the primary pack shall be marked with the detail specification reference, followed by the letter defining the level of quality assessment (Annex A) and, if applicable, by the letter identifying the screening sequence (Annex C). Example: EN153002-000 F-C. The detail specification

32、 shall prescribe the information actually marked on the device. 1.5.1 Terminal identification The terminals shall be identified in at least one of the following ways: in accordance with the specified outline or base drawing; in accordance with one of the methods given in2.5.1.1, 2.5.1.2 or 2.5.1.3;

33、as specified in the detail specification. 1.5.1.1 Diodes Polarity of diodes shall be clearly indicated by one or more of the following methods: the rectifier arrow graphical symbol pointing towards the cathode; a colour code as follows: Red shall be used for the cathode. Black shall be used for the

34、anode. 1.5.1.2 Transistors When so specified in the detail specification, transistor terminals shall be identified by the following colour code: Fourth terminal if present: if connected to collector, emitter or base: the relevant colour of this electrode; if connected to anything else (for instance

35、a shield): uncoded. When it is appropriate to identify only one terminal, the collector shall be marked. 1.5.1.3 Thyristors The thyristors terminals shall be indicated by one of the following methods: The thyristor graphical symbol with the arrow directed towards the cathode terminal. A colour code

36、as follows: 1.5.2 Type designation The type designation shall be given in letters and figures. a) Terminal identification (1.5.1) b) Type designation (1.5.2) c) Date code (1.5.4) and/or: factory identification code or manufacturers name or trade-mark (1.5.3) d) Mark of Conformity unless a Certificat

37、e of Conformity is used Collector terminal Red Emitter terminal Blue Base terminal Yellow Cathode terminal(s) Red; and/or Anode terminal(s) Blue (or black) Gate terminal(s) Yellow (or white).EN153000:1998 BSI 05-1999 5 1.5.3 Manufacturers name or trade-name Where the certificate of conformity enable

38、s traceability to a manufacturers factory, the manufacturers name or trade-name is sufficient. In all other cases, the factory identification code shall be used. 1.5.4 Date code system The date code system is as ISO/R2015 for the week, preceded by the last two digits of the year (example: 9245 45th

39、week of1992). 1.6 Subcontracting Subcontracting within the rules of EN100114-2. subclause 1.2 is not permitted. 1.7 Validity of release Release is valid for a period of2years. See 2.3.5 for the requirements for subsequent delivery. 2 Quality assessment procedures 2.1 General The quality assessment t

40、ests are subdivided into Group A, Group B tests which are performed on each lot. Group C tests which are performed periodically and Group D tests which are performed for design proving only. The following CECC ongoing product assessment procedure is designed to produce consistent high reliability po

41、wer semiconductor devices and enable a manufacturer once approved (see EN100114-1) to claim “Qualification Approval”. 2.1.1 Manufacturing and system control The company shall be audited to ensure that quality and manufacturing control systems are in place, based on EN100114-1, which incorporates the

42、 requirements of EN ISO9000. 2.1.2 Primary stage of manufacture The primary stage for bipolar semiconductor devices is the first process which changes the monocrystalline semiconductor material from being wholly P-type or wholly N-type. 2.1.3 Definition of a production lot Unless otherwise stated, a

43、 production or inspection lot (hereinafter referred to as “lot”) shall consist of devices having structurally similar design, manufactured on the same production line, and normally assembled during a maximum of6weeks. (Maximum lot size500pieces). 2.1.4 Structurally similar components The crucial cri

44、terion for grouping of types of devices as structurally similar is that the differences between the various types have no influence on the results of the test for which the group has been formed. Rotation within the group shall be performed to ensure all types are tested. 2.2 Qualification approval

45、procedures New product ranges shall be subject to groups A, B, C and D testing prior to approval being given. Approval shall consist of a review of the test data by the Chief Inspector and subsequent authorisation by him of approved status for that product range. Potential customers shall have this

46、information made available to them on request as a Test Report. The Test Report shall consist of a listing of tests performed, conditions of testing, sample sizes and results of individual measurements before and after each test.EN153000:1998 6 BSI 05-1999 2.3 Quality conformance inspection requirem

47、ents Quality conformance inspection shall be based on samples taken from each lot of structurally similar product (see2.1.4). Where no product has failed assessment, device release to the customer shall be on a continual basis. Where a failure has occurred that is attributed to faulty manufacturing,

48、 corrective action shall be taken and a hold put on the product until that or subsequent lots have been proven to meet the full requirements of the subgroup in which the failure occurred. Lots shall continue to be held for that subgroup until 3 batches have passed without failure, when sampling and

49、continual release shall be re-introduced. In the most serious instances of failure, product may be required to be withdrawn from stock and the customer shall be notified accordingly. 2.3.1 Division into groups and sub-groups Group A inspection (production lot) This group prescribes the visual inspection and the electrical measurements to be made on the lot to assess the principal properties of a device. Group A inspection is divided into appropriate sub-groups as follows:- Sub-group A1: This sub-group compri