ASTM F487-1988(2006) Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding《纯铝-半导体引线连接用1%硅细丝》.pdf
《ASTM F487-1988(2006) Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding《纯铝-半导体引线连接用1%硅细丝》.pdf》由会员分享,可在线阅读,更多相关《ASTM F487-1988(2006) Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding《纯铝-半导体引线连接用1%硅细丝》.pdf(4页珍藏版)》请在麦多课文档分享上搜索。
1、Designation: F 487 88 (Reapproved 2006)Standard Specification forFine Aluminum1 % Silicon Wire for Semiconductor Lead-Bonding1This standard is issued under the fixed designation F 487; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision
2、, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.1. Scope1.1 This specification covers aluminum1 % silicon alloywire for internal connections in semiconductor devic
3、es and islimited to wire of diameter up to and including 0.0020 in.(0.051 mm). For diameters larger than 0.0020 in. (0.051 mm),the specifications are to be agreed upon between the purchaserand the supplier.1.2 The values stated in inch-pound units are to be regardedas the standard. The values given
4、in parentheses are forinformation only.2. Referenced Documents2.1 ASTM Standards:2F16 Test Methods for Measuring Diameter or Thickness ofWire and Ribbon for Electronic Devices and LampsF72 Specification for Gold Wire for Semiconductor LeadBondingF 205 Test Method for Measuring Diameter of Fine Wire
5、byWeighingF 219 Test Methods of Testing Fine Round and Flat Wirefor Electron Devices and LampsF 584 Practice for Visual Inspection of SemiconductorLead-Bonding Wire2.2 Military Standard:3MIL-STD-105 Sampling Procedures and Tables for Inspec-tion by Attributes3. Ordering Information3.1 Orders for mat
6、erial under this specification shall includethe following information:3.1.1 Quantity,3.1.2 Size (see Section 5),3.1.3 Breaking load and elongation (see Section 4),3.1.4 Packaging and marking (see Section 11), and3.1.5 Special requirements, such as for certificate of com-pliance (see Section 10).4. P
7、hysical Requirements4.1 Elongation and breaking-load ranges for the wire shallbe specified by the purchaser. The maximum ranges of thesemechanical properties are listed in Table 1.4.2 Mechanical property requirements in ranges smallerthan those listed in Table 1 may be specified upon agreementbetwee
8、n the purchaser and the supplier.NOTE 1The nature of aluminum1 % silicon alloy is such that themechanical properties of both as-drawn and annealed wires overlapconsiderably. It is also possible to alter the properties of hard wire byvarying the manufacturing parameters and procedures. For these reas
9、ons,no distinction is made between the two types of wire in this specification.5. Dimensions, Weights, and Permissible Variations5.1 Wire size shall be expressed in terms of wire diameter indecimal fractions of an inch (or millimetre) or in weight perunit length. Tolerances for various size ranges a
10、re specified inTable 2.5.2 When wire size is expressed in terms of weight, thefollowing values shall be used:5.2.1 Density of Aluminum1 % Silicon2.7 g/cm3.5.2.2 Weight of a 200-mm Length of Wire 0.0254 mm inDiameter0.274 mg.6. Surface Finish6.1 The wire surface shall be clean and free of finger oils
11、,lubricant residues, stains, and particulate matter.6.2 Mechanical damage to the wire surface, such as nicks,scratches, and kinks, shall be held to a minimum.6.3 The inspection shall be carried out under conditionsprescribed in Practice F 584 unless some other inspectionmethod is agreed upon between
12、 the purchaser and the supplier.1This specification is under the jurisdiction of ASTM Committee F01 onElectronics and is the direct responsibility of Subcommittee F01.07 on Intercon-nection Bonding Carrier Bonding.Current edition approved Jan. 1, 2006. Published January 2006. Originallyapproved in 1
13、977. Last previous edition approved in 2001 as F 487 88 (2001).2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM websit
14、e.3Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.The nature and extent of defects permitted to be pre
15、sent on thesurface of the wire shall be agreed upon between the purchaserand the supplier.7. Chemical Requirements7.1 The alloy composition shall be 1.00 6 0.15 % silicon,and between 98.84 and 99.15 % aluminum. All other elementsare considered impurities.7.2 No single impurity shall exceed 0.0050 %
16、and the totalof all detectable impurities shall not exceed 0.01 %.7.3 Any lower or higher impurity content shall be as agreedupon between the purchaser and the supplier as part of thepurchase contract.8. Sampling8.1 Unless otherwise agreed upon by the purchaser and thesupplier, conformance with Sect
17、ion 4 shall be determined byMIL-STD-105.9. Test Methods9.1 Elongation and Breaking LoadDetermine elongationand breaking load in accordance with Test Methods F 219.9.2 Dimensional MeasurementDetermine the wire diam-eter by one of the following methods:9.2.1 Measure the diameter directly in accordance
18、 with TestMethods F16.9.2.2 Measure the diameter indirectly (by weighing) inaccordance with Test Method F 205.9.2.3 Measure the diameter by optical means agreed uponbetween the purchaser and the supplier.NOTE 2Optical methods for measuring wire diameter are underdevelopment by Committee F-1 on Elect
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