ARMY MIL-E-48630-1986 ELECTRONIC ASSEMBLY FOR MINES M718A1 M741A1 SYSTEM《M718A1 M741A1系统地雷用电子组件》.pdf

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1、5-23 7-Lu MIL-E-48630 13 9797906 0322523 3 m MIL-E-48630(AR) 31 July 1986 MILITARY SPECIFICATION ELECTRONICS ASSEMBLY, FOR FINES, M7 18 Al /M7 4 1Al , SYSTEM This specification is approved for use by the. U.S. Army Armament Munitions and Chemical Command, and is available for use by all Departments

2、and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification contains requirements not normally covered by drawinqs and provides Quality Assurance provisicns for the- fabrication electronic assembly used in the AT/AV Mine. 2. APPLICABLP DOCUMENTS 2.1 Government documents. 2.1.1.

3、 Specifications and s (see 6.2), the followinu sDecif f parts, assembly and packing of the M718El/M741Ei, 155MM Projectile, andards. Unless otherwise specified cations and standards of the issue - 21 listed in that issue of the Department of Defense In2ex of SDecifications and Standards (DoDISS) spe

4、cified in the solicitation, form a part of this specification to the extent specified herein. Al SPECIFICATIONS SMC DISTRI - - MILITARY MIL-S-1.9500 - Semiconductor Devices General MIL-C-39003 - Capacitor, Fixed, Electrolytic. MIL-R-39008 - Resistors, Fixed, COrtIpOSitiOn. (insulated) Specification

5、For. _- FSC 345 Approved for public release; distribution is unlimited. A JTION STATEMENT A. THIS DOCUNENT CONTAINS 5s PAGES. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-E-qb30 13 7779706 032252q 5 m MIL-E-48630 (AR) MIL-R-39008/1 - MIL-C-390

6、14 MIL-S-45743 MIL-S-46844 MIL-A-48078 MIL-R-55182 MIL-P-63238 MIL-A-63242 STANDARDS MIL I TARY MIL-STD-105 MIL-STD-202 MIL-STD-750 MIL-STD-883 MIL-STD-1169 Resistors, Fixed, Composition (Insulated) Established Reliabilitv Style RCR07. Capacitor, Fixed, Ceramic. Soldering, Manual Type, High Reliabil

7、ity, Electrical and Elect- tronic Equipment. Solder Bath Soldering of Printed Wiring Assemblies. Ammunition, Standard Quality Assur- ance Provisions, General Specifica- tions For. Resistor, Fixed, Film. Projectile, 155MM, AT M718/M741 Load- ing, Assembling and Packinq Of. Amplifier, Operation, Tripl

8、e Programmable Micropower. Sampling Procedures and Tables For Inspection by Attributers. Test Methods For Electronic and Electrical Component Parts. Test Methods For SemiGQndUCtOr Devices. Test Methods and Procedures For Microelectronics. Packaging, Packing and Marking For Shipment of Inert Ammuniti

9、on Components. 2.1.2 Other Government documents, drawings, and publications. The following other Government documents form a part of this specification to the extent herein. 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-E-tiBb30 13 O6 0322525

10、 7 m 1 MIL-E-48630(AR) DRAW IN G S u. s. ARMY ARMAMENT RESEARCH AND DEVELOPMENT COMMAND 9277745 9287096 9287115 9287126 9287185 9292220 9298512 9317646 9342551-1,-2 9342552-1,-2 9342553 9342554 9342555 9342558 9342560 9342561 9342562 9342564 9342574 9342576 9342577 9342580 Cover, Front . Capacitor,

11、Fixed Electrolytic. Potting Material. Capacitor, Fixed Electrolytic, Tantalum, Solid. Terminal. Capacitor, Tantalum, Dry Electro- lyte Polar, Reliability Requirements For. Switch Assembly. Qualification Electronic Components. Electronic Assembly (M718 ). Electronic Assembly (M741 ) . Printed Wiring

12、Board Assembly. Printed Wiring Board Assembly. Coil Assemblv. Capacitor, Fixed Plastic Dielectric. Resistor, Fixed Film. Integrated Circuit, CMOS, Comparator/op Amp. Integrated Circuit, CMOS, Quad Analog Switch . Capacitor, Fixed Ceramic, Glass Sealed, Axial Leads. Integrated Circuit, CMOS, Timing.

13、Performance Requirement (Supplemental) . Integrated Circuit, CMOS, Logic. Power Supply Assembly. (Copies of specifications, standards, handbooks, drawings, and publications required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or

14、 as directed by the contracting officer). AMERICAN SOCIETY FOR TESTING AND MATERIALS ASTM D2240-68 - Indentation Hardness of Rubber and Plastic by Means of a Durometer, Test For. ASTM D412-68 Tension Testing of Vulcanized Rubber, Provided by IHSNot for ResaleNo reproduction or networking permitted w

15、ithout license from IHS-,-,-MIL-E-48630 13 w 777770b 032252b MIL-E-48630 (AR) (Application for copies should be addressed to: American Society for Testing and Materials, 1916 Race Street, Philadelphia, PA., 19102). Technical society and technical association specifications and standards are generall

16、y available for reference from libraries. They are also distributed among technical groups and using Federal agencies . 2.1.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the _._ - text of this speciiication shall take preced

17、ence. 3. REQUIREMENTS 3.1 Materials. Materials shall be in accordance with-the applicable drawings and specifications. 3.2 Components and assemblies. The components and assemblies shall comply with all requirements specified on drawing 9342551-1,-2, and 9342552-1,-2, and 9342576, and associated draw

18、ings and with all requirements specified in applicable specifications and standards. 3.3 Physical characteristics. 3.3.1 Envelope and dimensions. The envelope and dimensions of the electronic assembly shall conform to the requirements on drawings 9342551 or 9342552 as applicable. requirements of dra

19、wing 9287115 and 9287148 and shall be manufactured and dispensed in accordance with the processes, procedures and controls delineated therein. assembly shall not show evidence of voids and/or bubbles or workmanship defects exceeding the following criteria: dimension are permissible. voids cannot exc

20、eed 1/8 CU. in. (1/2 X 1/2 X 1/2“ cube). In addition, no bubbles shall be in contact with any electronic component except that the power supply is allowed to trap bubbles under the lip of the battery on the contact end. (A bubble is defined to be entrapped air with no exposure to the surface.) 3.3.2

21、 Potting. Potting material shall comply with the The potted electronic a) Bubbles that are less than 1/4 inch in the maximum physical The total volume occupied by bubbles or b) Single or multiple voids less than 1/4 inch in the maximum physical dimension are permissible on the surface except as defi

22、ned in c and d. The total volume occupied by bubbles or voids cannot exceed 1/8 CU. in. (1/2 X 1/2 X 1/2“ cube) and must not expose any components or the printed circuit board. (A void is defined as an irregularity of any shape which is open to the surface.) provided no component or part of the prin

23、ted wiring board is exposed. c) Voids on the outer circumference of the lens are permissible 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-E-48b30 13 m 7799906 0322527 O m MIL-E-48630 (AR) d) Voids on the flat vertical wall of the ID Hole“ (a

24、nd associated channels) up to a maximum of 25% of the depth will be allowed. e) Sprue cutoff deviations shall be allowed to -t.OOO“ and -.040“ of the curved surface. f) Slight irregularities on the spherical surface (associated with the potting prematurely separating from the mold) within a 1“ radiu

25、s of the “Sprue“ center are permissible. 9) A potting void or hole at the bottom of the “D“ hole, exposing the battery case, of a maximum size of 1/8 inch long by 1/16 inch wide or 3/32 inch diameter is allowable provided the battery case is below bottom surface of the ID hole. Larger voids will hav

26、e potting material applied to cover the battery case and allowed to air dry. h) Delamination of potting from the printed wiring board shall not be allowed (non-destructively viewed from the top of the board only). Components and item designation (M718El/M741El shall be elearly visible through the po

27、tting material. 3.4 Environmental conditions. 3.4.1 Temperature. The electronic assembly shall perform as required herein and in drawing 9342576 over a temperature range from -250F to +1250F. 3.4.2 Ballistic test, The electroic assembly shall perform as required aftem: exposure to gun launch apid gr

28、ound impact environments of zone 8 in the Ml09A1 gun at 145OP, (See 4.5.25) 3.5 -mentS. 3.5.1 Quiescent current. Current drawing shall be less than 300 microamperes when powered by a supply voltage (VB) of 7.0 volts. 3.5.2 e and firing circuit characteristics. The electronic assembly shall provide t

29、iming control and firing signals as specified in drawing 9342576 and the following paragraphs. Unless otherwise specified VB = 7.0 volts and ambient temperature (TA) shall be 750F. 3.5.2.1 Oscillator function. The primary time base (PTB) oscillator and the test time base (TTB) oscillator circuits sh

30、all oscillate at the periods specified in drawing 9342576 over the temperatures specified. (See 4.5.2, 4.5.3) 5 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-E-48b30 13 E 7777706 0322528 2 W - - - MIL-E-48630 (AR) 3.5.2.2 Arming delay/sensor en

31、able. The electronic assembly shall not propagate a fire signal prior to the arming time specified on drawing 9342576. The sensor circuit shall attain a state of readiness (state code 1) in the time defined in 9342576 over the temperatures specified. The initial firing capacitor charge rate shall no

32、t exceed 0.5 volts per second with a supply voltage of 7.0 volts (see 4.5.4, 4.5.5, and 4.5.6). 3.5.2.3 Low voltage detection. The electronic assembly shall provide a detonator fire signal (see para. 3.5.2.8) after the above arming delay when the supply voltage is reduced to a value between 5.9 volt

33、s (maximum) and 4.6 volts (minimum). These values shall apply at ambient temperature only. Over the range -250 and +125O, the limits shall be 6.1 and 4.4 volts respectively. 3.5.2.4 Self-destruct. 3.5.2.4.1 Part number 9342551. The electronic assembly, P/N 9342551, shall provide a detonator fire siq

34、nal (see para. 3.5.2.8) at the self-destruct time specified in drawing 9342576 after initial application of voltage (W). A total of 392,448 primary time base pulses shall have been generated at the period specified on drawing 9342576. (See 4.5.8). 3.5.2.4.2 Part number 9342552. The electronic assemb

35、ly shall provide a detonator fire signal (see para. 3.5.2.8) at the self-destruct time specified in drawinq 9342576 after initial application of voltage (VB). pulses shall have been generated at the period specified on drawing 9342576. (see 4.5.9). 3.5.2.5 PTB oscillator check function. The electron

36、ic assembly shall provide a detonator fire signal (see para. 3.5.2.8), after the arming delay, when exactly two (2) periods of the test time base oscillator occur upon termination of the primary time base oscillations (see 4.5.6) . 3.5.2.6 TTB oscillator crosscheck. The electronic assembly shall pro

37、vide a detonator fire signal when the Test Time Base is interrupted for two successive cycles. inhibited until elapse of the special delay period defined in drawing 9342576. (see 4.5.10) A total of 32000 primary time base This function shall be 3.5.2.7 Disturbance. The electronic assemblies that con

38、tain anti-disturbance switches shall provide a detonator fire siqnal. (see para. 3.5.2.8), after the special delay period defined in drawing 9342576, when the assembly is jarred, tilted, rotated or otherwise tampered with (see 4.5.11) . 6 Provided by IHSNot for ResaleNo reproduction or networking pe

39、rmitted without license from IHS-,-,- UIL-E-4b30 13 797770b 0322527 4 m MIL-E-48630 (AR) 3.5.2.8 Detonator fire siqnal output energy. The electronic assembly shall provide energy to fire the detonators when required as described in the specification. The output energy shall be such that a minimum of

40、 three (3) volts shall be measured no more than forty (40) microseconds after a fire output signal is generated and a minimum of two (2) volts is measured at a minimum time of 120 microseconds after the fire output signal is generated. Voltages shall be measured at the output terminals across a 3.9

41、ohm + 5% resistive load (see 4.5.12). - 3.5.2.9 Detonator fire signal duration from timer. 3.5.3 Tarqet sensor functioninq. The electronics assembly shall provide a fire signal (para. 3.5.3.1) when subjected to valid target signatures and not provide a fire signal when subjected to invalid signature

42、. The specific conditions and the signal limit under which this function shall occur are specified in drawing 9342576. 3.5.3.1 Lm The output from the target sensor (test point 1) shall be a minimum of 2.5 volts when the assembly is subjected to a valid signature as specified in drawing 9342576. 3.5.

43、4 Non-activated voltage. Each battery cell shall be unactivated and measured less than .O05 volts when measured bv a 107 ohm input impedance meter (see 4.5,14). comply with MIL-S-46844, MPE-S-$5943. 3,5.5 Sofderinq. A% soldered electrical connections shall 3.5.5.P Col3erabiPity. lectrnie and electri

44、c assembly parts that are to be soldered shall comply with the solderability requirements of MIE-S-45743 and MIL-S-46844 except integrated -ireuits shall. be tested for solderability using the methods and be tested for solderability using the methods and acceptance criteria of MIE-CTB-750 provided t

45、he leads are not gold plated. When gold plated leads are used, the provisions of MIL-S-45743 apply. :ceptance criteria of MIE-STB-883 and diode and transistors shall 3.5.5,% !. The contractor will generate a Quality Assurance Soldering Plan that will detail the overa%l solder%ng procedureo skis plan

46、 skabl include detailed information for handling cleaning , hand soldering, machine soldering, process controls including documentation required by 3-4.4 of MIE-C-46844 tos% maintenance, flagging procedures fQr avoiding excessive defects ad a% other pertinent QA procedures relative to so%dering. Thi

47、s plan will be generated and submitted to AMCCBMI DRCMC-QAT-M(l3) (see 4,5,%). 3.5.6 Shorting bar con ti nu it, There shall be no more than one (1) ohm resistance in the shorting bar loop when measured between th E! 81 E 12 MIL-E-4b30 23 I 7997906 0322534 A W cv mc m mm . O0 O drl rl u) U u al Cu al

48、 b LI -0 fom m al c Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-E-4Bb30 13 9779906 0322535 T W - MIL-E-48630 (AR) 4.4 ;. 4.4.1 Inspection lot formation. InsFection lots shall comply with the lot formation provision of MIL-A-48078. inspection

49、lots of Electronic Assemblies and Sub-assemblies shall con ta in: In addition, a. Batteries and/or power supply assemblies bearing the Triple operational amplifiers bearing the same lot same lot interfix number from one manufacturer. interfix number from one manufacturer. b. c. Integrated circuit, CMOS, target sensors bearing the same lot interfix number from one manufacturer. d. Integrated circuit,