IEC 60917-2-3-2006 Modular order for the development of mechanical structures for electronic equipment practices - Part 2-3 Sectional specification - Interface coordination dimensi.pdf

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1、 IEC 60917-2-3 Edition 1.0 2006-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Modular order for the development of mechanical structures for electronic equipment practices Part 2-3: Sectional specification Interface co-ordination dimensions for the 25 mm equipment practice Extended detail specifica

2、tion Dimensions for subracks, chassis, backplanes, front panels and plug-in units Ordre modulaire pour le dveloppement des structures mcaniques pour les infrastructures lectroniques Partie 2-3: Spcification intermdiaire Dimensions de coordination pour les interfaces des infrastructures au pas de 25

3、mm Spcification particulire tendue Dimensions pour bacs, chssis, fonds de paniers, faces avant et units enfichables IEC 60917-2-3:2006 colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2006 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this public

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17、 commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 60917-2-3 Edition 1.0 2006-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Modular order for the development of mechanical structures for electronic equipment practices Part 2-3: Sectional specification I

18、nterface co-ordination dimensions for the 25 mm equipment practice Extended detail specification Dimensions for subracks, chassis, backplanes, front panels and plug-in units Ordre modulaire pour le dveloppement des structures mcaniques pour les infrastructures lectroniques Partie 2-3: Spcification i

19、ntermdiaire Dimensions de coordination pour les interfaces des infrastructures au pas de 25 mm Spcification particulire tendue Dimensions pour bacs, chssis, fonds de paniers, faces avant et units enfichables INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE V ICS 3

20、1.240 PRICE CODE CODE PRIX ISBN 978-2-83220-885-4 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer

21、 que vous avez obtenu cette publication via un distributeur agr. colour inside 2 60917-2-3 IEC:2006 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope and object 8 2 Normative references . 8 3 Terms and definitions . 9 4 Arrangement overview 9 5 Subrack dimensions for injector/extractor handle of plug-i

22、n units 10 5.1 Subrack interface dimensions 10 6 Dimensions of injector/extractor handle for plug-in units . 12 6.1 Injector/extractor handle interface dimensions . 12 6.2 Handle-locking function . 14 7 Subrack and plug-in units with electromagnetic shielding provision 14 7.1 Subrack interface dimen

23、sions for electromagnetic shielding provision . 14 7.2 Front panel/plug-in unit interface dimensions 17 8 Key/coding system for subrack and plug-in units 18 8.1 General . 18 8.2 Subrack interface dimensions Key/coding system on the plug-in unit guides 19 8.3 Key dimensions Key/coding system on the p

24、lug-in unit guides 20 8.4 Programming of key Key/coding system on the plug-in guides 22 8.5 Keying chamber inspection dimensions . 22 9 Alignment pin and/or electrical contact for front panels and plug-in units 23 9.1 General . 23 9.2 Alignment pins and receptacle plates on the subrack horizontal me

25、mbers . 24 9.3 Alignment and/or electrical contact pins and receptacles on the subrack plug-in unit guides . 25 10 Electrostatic discharge provision for plug-in units and subracks 27 10.1 General . 27 10.2 ESD contact interface dimensions . 28 10.3 ESD strip interface dimensions 28 10.4 Dimensions o

26、f subracks and plug-in units based on IEC 60917-2-2 . 30 11 Subrack dimensions for rear-mounted plug-in units 32 Annex A (informative) Subrack, plug-in unit and backplane dimensions for using metric connectors . 33 Figure 1 Typical example of large subracks in a wide cabinet, equipped mass volume of

27、 copper/optical cables installation 7 Figure 2 Subject for development of extended connector application packaging and key elements of interconnection between functional plug-in modules via backplane in the future packaging system . 7 Figure 3 Arrangement overview . 9 Figure 4 Subrack interface dime

28、nsions, injector/extractor handles for plug-in units 11 Figure 5 Detail X and detail Y, subrack interface dimensions, injection/extraction handles for plug-in units 12 Figure 6 Plug-in units interface dimensions, injection/extraction handle for plug-in units . 13 60917-2-3 IEC:2006 3 Figure 7 Detail

29、 X and detail Y, plug-in interface dimensions, injector/extractor handles for plug-in units 14 Figure 8 Subrack interface dimensions, electromagnetic shielding provisions 15 Figure 9 Detail X and detail Y, subrack interface dimensions, electromagnetic shielding provisions 16 Figure 10 Front panel/pl

30、ug-in unit interface dimensions, electromagnetic shielding provisions . 17 Figure 11 Arrangement of key/coding system for plug-in units 18 Figure 12 Subrack interface dimensions Key/coding system on the plug-in unit guides . 19 Figure 13 Plug-in unit interface dimensions Key/coding system on the plu

31、g-in unit guides . 20 Figure 14 Key dimensions and rotated key positions Key/coding system on the plug-in unit guides 21 Figure 15 Programming of keys . 22 Figure 16 Arrangement of alignment pin system for subracks and plug-in units 23 Figure 17 Subrack interface dimensions, alignment pins and recep

32、tacle plates on the horizontal members 24 Figure 18 Plug-in unit interface dimensions, alignment pins and receptacle plates on the horizontal members 25 Figure 19 Subrack interface dimensions, alignment and/or electrical contact pin receptacles on the plug-in unit guides . 26 Figure 20 Plug-in unit

33、interface dimensions, alignment and/or electrical contact pin receptacles on the plug-in unit guides . 27 Figure 21 Subrack interface dimensions, ESD contacts on the plug-in guides 28 Figure 22 Plug-in unit interface dimensions, ESD strips on the plug-in boards . 29 Figure 23 Subrack dimensions for

34、rear mounted plug-in units 32 Figure A.1 Subrack, plug-in unit and backplane dimensions for using 2,5 mm metric connectors in accordance with IEC 61076-4-100 . 33 Figure A.2 Subrack, plug-in unit and backplane dimensions for using 2 mm metric connectors in accordance with IEC 61076-4-101 . 34 Figure

35、 A.3 Subrack, plug-in unit and backplane dimensions for using 2 mm metric connectors in accordance with IEC 61076-4-104 . 35 Table 1 Inspection dimensions of subrack and plug-in unit keying chambers 22 Table 2 Dimensions of subracks and plug-in units based on IEC 60917-2-2 . 30 Table 3 Dimensions of

36、 subracks and boards for rear-mounted plug-in units . 32 4 60917-2-3 IEC:2006 INTERNATIONAL ELECTROTECHNICAL COMMISION _ MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES Part 2-3: Sectional specification Interface co-ordination dimensions for the 25 mm eq

37、uipment practice Extended detail specification Dimensions for subracks, chassis, backplanes, front panels and plug-in units FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC Nationa

38、l Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly

39、 Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmen

40、tal organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on te

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44、) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directo

45、rs, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising o

46、ut of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn

47、 to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60917-2-3 has been prepared by subcommittee 48D: Mechanical structures for electronic

48、 equipment, of IEC technical committee 48: Electromechanical components and mechanical structures for electronic equipment. This bilingual version (2013-06) corresponds to the monolingual English version, published in 2006-05. 60917-2-3 IEC:2006 5 The text of this standard is based on following docu

49、ments: FDIS Report on voting 48D/338/FDIS 48D/342/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of this standard has not been voted upon. IEC 60917 consists of the following parts, under the general title Modular order for the development of mechanica