SAE AS 6171 4-2016 Techniques for Suspect Counterfeit EEE Parts Detection by Delid Decapsulation Physical Analysis Test Methods.pdf

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1、_SAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirely voluntary, and its applicability and suitability for any particular use, including any patent infringement arising theref

2、rom, is the sole responsibility of the user.”SAE reviews each technical report at least every five years at which time it may be revised, reaffirmed, stabilized, or cancelled. SAE invites your written comments and suggestions.Copyright 2016 SAE InternationalAll rights reserved. No part of this publi

3、cation may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of SAE.TO PLACE A DOCUMENT ORDER: Tel: 877-606-7323 (inside USA and Canada)Tel: +1 724-776-4970 (out

4、side USA)Fax: 724-776-0790Email: CustomerServicesae.orgSAE WEB ADDRESS: http:/www.sae.orgSAE values your input. To provide feedback on thisTechnical Report, please visithttp:/standards.sae.org/AS6171/4AEROSPACESTANDARDAS6171/4Issued 2016-10Techniques for Suspect/Counterfeit EEE Parts Detection by De

5、lid/DecapsulationPhysical Analysis Test MethodsRATIONALEThe purpose of this document is to provide guidelines and requirements for the use of decapsulation, delidding or disassembly of EEE parts. The document further states the requirements for physical analysis and inspection in order to document c

6、haracteristics that are consistent with suspect counterfeit parts.INTRODUCTIONInspection of the internal structure of a part, such as microelectronic die surface or metallization traces of a thin-film resistor, is a critical task in assessing whether a part may be considered counterfeit. Attributes

7、that are not normally visible during external optical examination of a production part can be examined after a decapsulation or disassembly process.This helps in determining if the attributes are consistent with a part from the original manufacturer.DISCLAIMER: The images contained herein are provid

8、ed to illustrate the application of detection methods identified in the document, and are by no means intended to imply that a manufacturer identified in an image and text is involved with the suspect product.TABLE OF CONTENTS1. SCOPE 31.1 Purpose. 32. REFERENCES 32.1 Applicable Documents 32.1.1 SAE

9、 Publications. 32.2 Related Publications . 42.3 Definitions . 42.4 Acronyms 43. DESCRIPTION OF THE METHODOLOGY/PROCEDURE - MICROCIRCUITS, HYBRIDS, DIODES, AND TRANSISTORS 44. DESCRIPTION OF THE PROCEDURE - RESISTORS, CAPACITORS, INDUCTORS, FILTERS,CONNECTORS, CABLES, FUSES, TRANSFORMERS (PASSIVE DEV

10、ICES) 95. TEST EQUIPMENT, TEST SAMPLES, AND CALIBRATION 105.1 Chemical Decapsulation Process . 105.2 Mechanical Disassembly Tools. 105.3 Decapsulation using Laser Ablation 105.4 Radiographic and/or Radiographic Tools 105.5 Metallurgical Microscopes and Photo-Documentation Equipment . 10SAE INTERNATI

11、ONAL AS6171/4 Page 2 of 365.6 Scanning Electron Microscope (SEM), Energy Dispersive Radiological (EDS) Tool . 115.7 Plasma, Reactive Ion Etching (RIE) 115.8 Summary of Package Types and Recommended Decapsulation Methods . 116. DETAILED REQUIREMENTS 116.1 Sample Submission Information . 116.2 Samplin

12、g . 116.3 Categories of Testing/Risk Levels 116.4 Physical Analysis of Devices 126.5 Interpretation of Results Post Decapsulation 156.6 Reporting Guidelines. 166.7 Training and Certifications 166.8 Decapsulation Proficiency. 176.9 Safety Equipment 186.10 Chemicals/Solvents (as needed) 196.11 Materia

13、l Handling and Storage . 197. ALTERNATE PACKAGE/MATERIAL TYPES 198. NOTES 208.1 Revision Indicator 20APPENDIX A DECAPSULATION AND PHOTO-DOCUMENTATION EXAMPLES . 21APPENDIX B VISUAL ANOMALY EXAMPLES 24APPENDIX C UNACCEPTABLE DECAPSULATION RESULTS 31APPENDIX D PROFICIENCY SAMPLE QUESTIONS (FOR INTERNA

14、L USE ONLY) 32FIGURE 1 MARKINGS “SAMSUNG K9F5608U0A” (REPRINTED WITH PERMISSION FROM NISENE TECHNOLOGY GROUP INC.) . 12FIGURE 2 INTERNAL DIE MARKINGS “SAMSUNG K9F5608U0D” MAG 200X (REPRINTED WITH PERMISSION FROM NISENE TECHNOLOGY GROUP INC.) . 12FIGURE 3 RED ARROW INDICATING BOND PAD LIFT/SHIFT (REP

15、RINTED WITH PERMISSION FROM NISENE TECHNOLOGY GROUP INC.) . 13FIGURE 4 MULTIPLE BOND PADS DETACHED OR SHIFTED MAG 200X (REPRINTED WITH PERMISSION FROM NISENE TECHNOLOGY GROUP INC.) . 13FIGURE 5 SEM IMAGE TAKEN PRIOR TO WIRE PULL (REPRINTED WITH PERMISSION OF INTEGRA TECHNOLOGIES LLP) 14FIGURE 6 SEM

16、IMAGE TAKEN AFTER WIRE PULL (REPRINTED WITH PERMISSION OF INTEGRA TECHNOLOGIES LLP) 14FIGURE 7 SEM IMAGE DOCUMENTING BOND PAD CORROSION (REPRINTED WITH PERMISSION OF INTEGRA TECHNOLOGIES LLP) 15TABLE 1 RECOMMENDED DECAPSULATION METHODS FOR VARIOUS PACKAGE TYPES . 11SAE INTERNATIONAL AS6171/4 Page 3

17、of 361. SCOPEThis method standardizes inspection, test procedures and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) components or parts utilizing Delid/Decapsulation Physical Analysis. The methods described in t

18、his document are employed to either delid or remove the cover from a hermetically sealed package or to remove the encapsulation or coating of an EEE part, in order to examine the internal structure and to determine if the part is suspect counterfeit. Information obtained from this inspection and ana

19、lysis may be used to: a. prevent inclusion of counterfeit parts in the assemblyb. identify defective partsc. aid in disposition of parts that exhibit anomaliesThis test method should not be confused with Destructive Physical Analysis as defined in MIL-STD-1580. MIL-STD-1580 describes destructive phy

20、sical analysis procedures for inspection and interpretation of quality issues.Due to the destructive nature of the test method that allows access to materials, design and layout information, the method may also enable observation of trends in design and material or process changes undertaken by the

21、device manufacturer.If AS6171/4 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.1.1 Purpose The purpose of this document is to provide guidelines and requirements associated with the use of decapsulation, disassembly, and internal inspection as part of the

22、 process to verify the identity of the manufacturer of a part, and/or to discern and document characteristics that are consistent with suspect counterfeit parts. 2. REFERENCES2.1 Applicable DocumentsThe following publications form a part of this document to the extent specified herein. The latest is

23、sue of SAE publications shall apply. The applicable issue of other publications shall be the issue in effect on the date of the purchase order. In theevent of conflict between the text of this document and references cited herein, the text of this document takes precedence. Nothing in this document,

24、 however, supersedes applicable laws and regulations unless a specific exemption has been obtained.2.1.1 SAE PublicationsAvailable from SAE International, 400 Commonwealth Drive, Warrendale, PA 15096-0001, Tel: 877-606-7323 (inside USA and Canada) or +1 724-776-4970 (outside USA), www.sae.org.AS6171

25、 Test Method Standard, General Requirements, Suspect/Counterfeit, Electrical, Electronic, and Electromechanical Parts.AS6171/2 Techniques for Suspect/Counterfeit EEE Parts Detection by External Visual Inspection, Remarking and Resurfacing, and Surface Texture Analysis Test Methods.AS6171/5 Technique

26、s for Suspect/Counterfeit EEE Parts Detection by Radiological Test Methods.SAE INTERNATIONAL AS6171/4 Page 4 of 362.2 Related PublicationsThe following publications are provided for information purposes only and are not a required part of this SAE Aerospace Technical Report.2.2.1 MIL-STD-1580, Destr

27、uctive Physical Analysis for Electronic, Electromagnetic, and Electromechanical Parts2.2.2 MIL-STD-883, Test Method Standard, Microcircuits2.2.3 MIL-STD-750, Test Method Standard, Test Methods for Semiconductor Devices2.2.4 Murali, S., N. Srikanth, and Charles J. Vath III. “Effect of wire size on th

28、e formation of intermetallics and Kirkendall voids on thermal aging of thermosonic wire bonds.“ Materials letters 58.25 (2004): 3096-3101.2.2.5 Park, Jongwoo, et al., “Interfacial degradation mechanism of Au/Al and alloy/Al bonds under high temperature storage test: Contamination, epoxy molding comp

29、ound, wire and bonding strength.“ Components and Packaging Technologies, IEEE Transactions on 30.4 (2007): 731-744.2.2.6 C.J. Hang, et al., “Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging” Microelectronics Reliability48 (3): 416-424 (2008).2.

30、3 DefinitionsSee AS6171 General Requirements, Section 2.2.2.4 AcronymsSee AS6171 General Requirements, Section 2.3.3. DESCRIPTION OF THE METHODOLOGY/PROCEDURE - MICROCIRCUITS, HYBRIDS, DIODES, AND TRANSISTORS The steps described in the subsequent sub-sections outline the methodology for conducting d

31、ecapsulation and delidding. The procedure starts with the least destructive methods such as optical inspection and radiological inspection. Destructive steps such as manual and automated decapsulation, laser ablation and delidding are then described. At the end, a summary of inspection criteria is p

32、rovided. Appendix A provides a step-by-step photo-documentation of the steps described in sub-sections below.3.1 External Optical ExaminationExamine the part for any anomalous conditions that may affect the decapsulation process (cracks in the case, uneven surfaces, etc.). See AS6171/2 for detailed

33、external visual inspection (EVI) requirements.3.2 Radiological 3.2.1 Radiological images shall be obtained in a top-down and side view orientation.3.2.2 Information shall be obtained regarding the internal structure and alignment in order to minimize the potential damage that can occur from the deca

34、psulation or delidding process. For plastic encapsulated parts, determine the side of the part which needs to be chemically etched in order to expose the die face. Note that while most die face opposite the direction that the leads are mounted, in some instances, the die face may be oriented towards

35、 the mounting side of the device (reference Example 2 in Appendix A).3.2.3 Radiological image shall be obtained at the proper magnification which will help in the location of the die within the case, and will also help with the gasket selection when using an automated decapsulator.SAE INTERNATIONAL

36、AS6171/4 Page 5 of 363.2.4 For full details on radiological inspection refer to AS6171/5 (Techniques for Suspect/Counterfeit EEE Parts Detection by Radiological Test Methods).3.3 Decapsulation of Plastic Parts and Delidding of Cavity Devices3.3.1 Plastic PartsThe case material shall be removed to ex

37、pose the die through one or more of the following methods. Decapsulation exposes the die circuitry, and interconnections for subsequent inspection using optical and electron microscopy. It also allows for wire pull and ball shear, over etching can cause the die attach material to be removed or the l

38、ead fingers to be separated from the wire bonds. Caution should be used when decapsulating devices using laser ablation. Certain laser types, wavelengths and parameters can damage the die surface, the wire bonds or other features within the device. It is advisable to supplant laser ablation with eit

39、her automated or manual decapsulation.CAUTION: The decapsulation process involves the use of hazardous chemicals, including nitric acid and sulfuric acid.Hazardous materials should only be handled by personnel trained in the proper usage and disposal of said materials. Use of proper Personal Protect

40、ion Equipment (PPE) for the chemicals being used should be a requirement.3.3.1.1 Automated Decapsulation ToolFollow the automated decapsulator manufacturers instructions to remove the case material from over the die, using the information obtained from the radiological examination to determine the l

41、ocation of the die, size of the die, mounting orientation, and optimal gasket size. All decapsulation parameters shall be recorded for each device to determine repeatability or aberrations in the process.Note that this process may require practice and experience with the tool to obtain the expertise

42、 required to expose the die without damaging the other internal structures (bond pads, bond wires, lead frame, die attach material, substrate, etc.). If requested, a process guide may be provided by the manufacturer of the decapsulator tool.3.3.1.2 Manual Decapsulation of a DeviceThe case material o

43、ver a die shall be removed by using laboratory equipment that has the ability to safely heat and dispense discrete amounts of acids in a controlled manner.In the manual decapsulation process, it is advisable to start with milling a shallow well/hole over the center of the die approximately one-third

44、 of the package thickness, and away from the loop of the bond wires. (It is advisable not to use a regular drill bit because the conical hole is undesirable, use a milling bit instead.) Place the drilled package on a scrap metal plate and heat it on a hot plate to about 80 C (for red fuming nitric a

45、cid). Start with 80 C but the temperature may need to be changed depending on the reaction of the molding compound to the acid. Also depending on the size/shape of the device, the method of application and volume of acid may change. Small devices may need a shallower well milled away to preserve the

46、 bond wires and other desirable structures. While the package is being heated, prepare a squeeze bottle of acetone and a small amount (approximately 5 ml) of red fuming nitric acid in a small glass beaker. Using a Pasteur pipette, drop 1 to 2 drops of red fuming nitric acid in the hole of the heated

47、 package. Rinse away the reacted molding compound material with acetone into a waste glass beaker after the fumes subside. Repeat the acid exposure until the microcircuit die is exposed. Note: a final, neutralizing rinse can be performed in order to neutralize any remaining traces of acid on the par

48、t. Common neutralizing agents include a mild solution of sodium bicarbonate. A low pressure air brush can also be used to remove traces of solvents or reaction products from the exposed cavity. Caution should be exercised when directing the air flow towards the cavity so the bond wires and leads are

49、 not damaged. Nitric acid is most commonly used for decapsulating plastic parts, however, depending on the materials used for constructing the part, the amount of inert filler and bond wires, other acid types or mixtures of acids can be used. Common examples are low concentration (approximately 20%) sulfuric acid, low temperature (sub ambient) nitric acid or mixes of nitric and sulfuric acid.Note that this method can be hazardous, and s