JEDEC JESD75-4-2004 Ball Grid Array Pinout for 1- 2- and 3-Bit Logic Functions《1 2和3位逻辑功能的球状网络阵列插脚引线》.pdf
《JEDEC JESD75-4-2004 Ball Grid Array Pinout for 1- 2- and 3-Bit Logic Functions《1 2和3位逻辑功能的球状网络阵列插脚引线》.pdf》由会员分享,可在线阅读,更多相关《JEDEC JESD75-4-2004 Ball Grid Array Pinout for 1- 2- and 3-Bit Logic Functions《1 2和3位逻辑功能的球状网络阵列插脚引线》.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、JEDEC SOLID STATE TECHNOLOGY ASSOCIATIONJESD75-4MARCH 2004JEDECSTANDARDBall Grid Array Pinout for 1-, 2-, and 3-Bit Logic FunctionsNOTICEJEDEC standards and publications contain material that has been prepared, reviewed, and approvedthrough the JEDEC Council level and subsequently reviewed and appro
2、ved by the EIA General Counsel.JEDEC standards and publications are designed to serve the public interest through eliminatingmisunderstandings between manufacturers and purchasers, facilitating interchangeability andimprovement of products, and assisting the purchaser in selecting and obtaining with
3、 minimum delay theproper product for use by those other than JEDEC members, whether the standard is to be used eitherdomestically or internationally.JEDEC standards and publications are adopted without regard to whether or not their adoption mayinvolve patents or articles, materials, or processes. B
4、y such action JEDEC does not assume any liability toany patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards orpublications.The information included in JEDEC standards and publications represents a sound approach to productspecification and application, pr
5、incipally from the solid state device manufacturer viewpoint. Within theJEDEC organization there are procedures whereby a JEDEC standard or publication may be furtherprocessed and ultimately become an EIA standard.No claims to be in conformance with this standard may be made unless all requirements
6、stated in thestandard are met.Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication shouldbe addressed to JEDEC Solid State Technology Association, 2500 Wilson Boulevard, Arlington, VA22201-3834, (703)907-7559 or www.jedec.org.Published byJEDEC Solid Stat
7、e Technology Association 20042500 Wilson BoulevardArlington, VA 22201-3834This documentmay be downloaded free of charge, however JEDEC retains the copyright on this material. By downloading this file the individual agrees not to charge for or resell the resulting material.Price: Please refer to the
8、current Catalog of JEDEC Engineering Standards and Publications or call Global EngineeringDocuments, USA and Canada (1-800-854-7179), International (303-397-7956)Printed in the U.S.A.All rights reservedPLEASE! DONT VIOLATE THE LAW! This document is copyrighted by the Electronic Industries Alliance a
9、nd may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: JEDEC Solid State Technology Association 2500 Wilson Boulevard Arlington, Virginia 22201-3834 or call (703) 90
10、7-7559 JEDEC Standard No. 75-4Page 1BALL GRID ARRAY PINOUTS STANDARDIZED FOR 1-, 2-, AND 3-BIT LOGIC FUNCTIONS(Formerly JEDEC Board B allot JCB-03-65, formulated under the cognizance of the JC-40 Committee on Digital Logic.)1 ScopeThis standard defines device pinout for 1-, 2- and 3-bit wide logic f
11、unctions. This pinout specifically applies to the conversion of Dual-Inline-Packaged (DIP) 1-, 2- and 3-bit logic devices to DSBGA-packaged 1-, 2- and 3-bit logic devices. The purpose of this document is to provide a pinout standard for 1-, 2- and 3-bit logic devices offered in 5-, 6- or 8-ball Die-
12、Sized Ball Grid Array (DSBGA) packages for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.2 Terms and definitions (for the purpose of this document)DIP: Dual In-line Pin Package (gull-wing)SSOP: Shrink Small-Outline Package; 0.65-mm lead
13、pitch; 5.3-mm wide body (MO-150)TSSOP: Thin Shrink Small-Outline Package; 0.65-mm lead pitch; 4.4-mm wide body (MO-153)TVSOP: Thin Very Small-Outline Package; 0.4-mm lead pitch; 4.4-mm wide body (MO-194)DSBGA:Die-Sized Ball Grid Array; 0.5-mm ball pitch (MO-211)3 Pinout standard3.1 DescriptionThe fo
14、llowing criteria shall be used to convert existing 1-, 2- and 3-bit logic device functions offered in 5-, 6- and 8-pin DIP packages (e.g. SSOP, TSSOP, TVSOP) to 1-, 2- and 3-bit logic device functions offered in the 5-, 6- and 8-ball DSBGA packages:A. Attributes for the DSBGA package area as indicat
15、ed below:5-Ball, 0.50-mm ball pitch with 0.90-mm 1.40-mm body size and 3-row 2-column ball matrix, depopulated from 6-ball, MO-211, Variation EA.6-Ball, 0.50-mm ball pitch with 0.90-mm 1.40-mm body size and 3-row 2-column ball matrix, MO-211, Variation EA.8-Ball, 0.50-mm ball pitch with 0.90-mm 1.90
16、-mm body size and 4-row 2-column ball matrix, MO-211, Variation EA.B. The pinout conversions shall be in accordance with the diagrams shown in sections 3.2, 3.4 and 3.6. Each deviceshall be pinned out based on its present package/pinout and the pinout tables in sections 3.3, 3.5, and 3.7.3.2 5-ball
17、DSBGA (MO-211)Figure 1 Pinout configuration123BOTTOM VIEW54JEDEC Standard No. 75-4Page 23 Pinout standard (contd)3.3 Pin conversion from 5-pin DIP to 5-ball DSBGAThe pinout adopts the naming convention of logic devices in 5-pin DIP packages. The signal nomenclature used in this table is intended to
18、define the functionality of each pin and not require that a specific naming convention be followed. Each product vendor is free to name the pin according to their own conventions, provided that the functionality of the device is not altered from what is specified here. NOTE 1The function designation
19、 refers to the part designation of a series of commercial logic parts common in the industry. This number is normally preceded by a series of manufacturer-specific characters to make up a complete part designation.NOTE 2DNU means Do Not Use. This designation requires that the printed circuit landing
20、-pad for this device terminal remain unconnected to any signal or supply potential. It must remain an open circuit. This device terminal might be connected to active or inactive circuitry within the device.NOTE3.4 6-ball DSBGA (MO-211)Figure 2 Pinout configurationTable 1 5-pin pinout tableFunction(S
21、ee Note) Description Pin Numbers1 2 3 4 51G00 Single 2-input NAND gate A B GND Y VDD1G02 Single 2-input NOR gate A B GND Y VDD1G04 Single inverter DNU A GND Y VDD1GU04 Single unbuffered inverter DNU A GND Y VDD1G05 Inverter with open-drain output DNU A GND Y VDD1G06 Inverter with open-drain output D
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