JEDEC JESD659C-2017 Failure-Mechanism-Driven Reliability Monitoring.pdf

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1、JEDEC STANDARD Failure-Mechanism-Driven Reliability Monitoring JESD659C (Revision of JESD659B, February 2007, Reaffirmed June 2011) JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board

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7、cuments for alternative contact information. Published by JEDEC Solid State Technology Association 2017 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the i

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9、 Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. -ii- JEDEC Standard No. 659C -i- FAILURE-MECHANISM-DRIVEN RELIABILITY MONITORING CONTENTS Page Introduction ii 1 Scope 1 2 Terms and definitions 1 3

10、 Process controls 3 4 Identifying failure mechanisms 3 5 When to establish a monitor 4 6 What a monitor includes 4 7 Control action system 5 8 Monitor optimization 6 Annex A (informative) Differences between JESD659C and JESD659B 7 -ii- FAILURE-MECHANISM-DRIVEN RELIABILITY MONITORING Introduction Th

11、is standard presents a methodology for monitoring component and subassembly reliability. It can be of use to suppliers and users interested in known reliability as an attribute of the component through the production life. Under this standard, the suite of metrics is tailored to monitor the failure

12、mechanisms which limit the reliability. This is distinguished from a stress-driven monitor approach in which a fixed suite of acceptance stresses or other testing are prescribed and applied without customization according the failure mechanisms for the component or subassembly. JEDEC Standard No. 65

13、9C Page 1 FAILURE-MECHANISM-DRIVEN RELIABILITY MONITORING (From JEDEC Board ballot JCB-07-19, formulated under the cognizance of JC-14.3 Committee on Silicon Devices Reliability Qualification and Monitoring.) 1 Scope This standard describes essential requirements for a reliability monitor for compon

14、ents and subassemblies based on the measurement of failure mechanisms which limit reliability. It applies through the post-qualification production period. Both intrinsic (wearout and systematic) and extrinsic (defect-based) sources of failure are addressed. 2 Terms and definitions For the purposes

15、of this standard, the following definitions apply. Definitions marked by a asterisk (*) are taken from JESD557, Statistical Process Control Systems. They are replicated here for completeness. characteristic*: A distinguishing feature of a process or its output on which variables or attributes data c

16、an be collected. common cause*: A source of natural variation that affects all the individual values of the process output being studied. In control chart analysis it appears as part of the random process variation. control limits*: The maximum allowable variation of a process characteristic due to

17、common causes alone. Variation beyond a control limit may be evidence that special causes affecting the process. Control limits are calculated from process data and are usually represented as a line (or lines) on a control chart. They are not to be confused with engineering specification limits. cri

18、tical failure mechanism: In semiconductor devices, any potential physical failure mechanism that exhibits one or more of the following: intermittency (e.g., bond lifts), increasing failure rate (e.g., electromigration), and inconsistent or unpredictable failure kinetics (e.g., stress-induced metal v

19、oiding) extrinsic failure mechanism: (1) A failure mechanism caused by an error occurring during the design, layout, fabrication, or assembly process or by a defect in the fabrication or assembly materials. (2) A failure mechanism that is directly attributable to a defect created during manufacturin

20、g. failure: (1) The loss of the ability of a component to meet the electrical or physical performance specifications that (by design or testing) it was intended to meet. (2) A component that has failed. failure mechanism from fabrication processes: A physical failure mechanism in which all products

21、with the same wafer fabrication process, design rules, and processing line are treated as a homogeneous population for the purpose of statistical reliability monitoring independent of package technology, material, construction, and type. JEDEC Standard No. 659C Page 2 2 Terms and definitions (contd)

22、 failure mechanism from assembly: A physical failure mechanism in which all products with the same assembly technology, including assembly material, assembly construction, and package type and built on the same assembly line are treated as a homogeneous population for the purpose of statistical reli

23、ability monitoring independent of the fabrication process and line. intrinsic failure mechanism: (1) A failure mechanism caused by a natural deterioration in the materials or the manner in which the materials are combined during fabrication or assembly processes that are within specification limits.

24、 (2) A failure mechanism attributable to natural deterioration of materials processed per specification. node*: A definable point in the process at which form, fit, or function of the product or service is altered. nonconformity*: A specific occurrence of a condition that does not conform to specifi

25、cation. Such an occurrence is sometimes called a discrepancy. parameter: A measurable characteristic. physical failure mechanism: A physical or chemical process that ultimately results in failure. process*: (1) A combination of people, procedures, methods, machines, materials, measurement equipment,

26、 and/or environment for specific work activities to produce a given product or service. (2) A repeatable sequence of activities with measurable inputs and outputs. sample:* A set of individuals taken from a population. special cause; assignable cause:* A source of variation that is intermittent, unp

27、redictable, or unstable, and affects only some of the individual values of the process output being studied. statistical reliability monitoring (SRM): A statistically based methodology for monitoring and improving reliability involving identification and classification of failure mechanisms, develop

28、ment and use of monitors, and investigation of failure kinetics, allowing prediction of failure rates at use conditions. statistical reliability monitor family (SRMF): A product or group of products whose process similarities make them a homogeneous population for the purpose of statistical reliabil

29、ity monitoring. A homogeneous population of product from one SRMF shall have similar propensity towards the physical failure mechanisms being monitored when that product is stressed by accelerated tests or operated in its intended system application. Each product in an SRMF will have the same failur

30、e rate for each mechanism only when the factors affecting a failure mechanism are identical for each product type. variables data*: A measure of a characteristic where every value within a given interval is possible. JEDEC Standard No. 659C Page 3 3 Process controls The supplier shall define a Stati

31、stical Process Control (SPC) system for all critical process nodes in accordance with JESD557, Statistical Process Control Systems. This shall include establishing critical equipment capabilities, preventive maintenance, and calibration procedures. SPC metrics can intersect with those used for monit

32、oring reliability, but are not required to do so. An SPC system alone might not address all requirements for a failure-mechanism driven reliability monitor program. 4 Identifying failure mechanisms The supplier shall assess the failure mechanisms which significantly contribute to the field failure r

33、ate and institute respective monitors for those mechanisms. The identification of failure mechanisms may be based on mechanisms observed during development characterizing product sensitivities or process capabilities, mechanisms observed during qualification, mechanisms identified as part of Failure

34、 Mode and Effects Analysis (FMEA), or mechanisms observed in previous test or field experience with products using like processes, materials set, or tooling and production facilities. JEP131 provides guidance on FMEA. Stress-driven qualifications (e.g., JESD47) and evaluations in which sampling is s

35、tructured to show compliance to an acceptance criterion without generating failures will not provide an adequate basis for identifying the set of reliability-limiting failure mechanisms for a component. See section 6 regarding continuing acceptability to the original qualification criteria. The supp

36、lier shall be able to identify the rationale for the adequacy of the set of failure mechanisms identified for monitoring. The failure mechanisms requiring monitoring shall be reassessed for completeness and appropriateness when the process is changed or the product undergoes modifications which may

37、alter its sensitivity to the existing process. JEDEC Standard No. 659C Page 4 5 When to establish a monitor A monitor for each failure mechanism which contributes non-trivially to the failure rate for the component shall be established. Non-trivial contributions shall be ascribed to critical failure

38、 mechanisms and systematic process risks as well as to extrinsic (defect-based) detractors that contribute significantly to the overall failure rate. Since extrinsic (defect-based) detractors may exist at trivial non-zero levels, a threshold of significant contribution at 10% of the overall failure

39、rate expected in the field is recommended. NOTE Monitoring for non-idealities or anomalies that are not limiters to field reliability is not required by this standard. Monitors may take any of several forms. Common forms are as in-process metrics and as product-level life tests or accelerated stress

40、 tests. Some monitors may be used to address more than one failure mechanism, e.g., a functional stress on an integrated product designed to monitor multiple extrinsic failure mechanisms. The vehicle for the monitor measurement shall be the product or another vehicle which shares the risk for this f

41、ailure mechanism by similarity in process and construction (i.e., from the same SRMF). 6 What a monitor includes For mechanisms needing a monitor (See Section 5), this section identifies features that monitor shall include. Sampling for the respective monitors shall be sufficient to allow the suppli

42、er to identify an excursion to the total component failure rate (driven by the composite of failure mechanisms). Sampling for any given monitor should be scaled to yield non-zero fallout (attributes monitors) or sufficient parametric shift for extrapolation to failure (variables monitors) as an oppo

43、rtunity for learning enablement and to validate the continuing presence, abatement, or elimination of particular mechanisms. NOTE 1 To yield non-zero results at levels compatible with a component failure rate, monitors for intrinsic failure mechanisms typically will require smaller samples than thos

44、e for extrinsic failure mechanisms do. As such, sampling for extrinsic failure mechanisms may require the aggregation of monitor data across broader sampling (especially in time). The aggregation of extrinsic data should be confined to no more than an annual basis; shorter periods are encouraged. NO

45、TE 2 When a monitor is designed to measure well beyond the required minimum and no discernable failures (for attributes monitors) or shifts (for parametric monitors) are produced in a substantive sample history, it may be impractical to force non-zero data and unnecessary to do so for the purpose of

46、 measuring variations over time. Monitors shall include targets which reflect acceptable levels. Ideally, these targets directly correlate to quantified failure rate levels. Regardless of whether they have an established correlation, the supplier shall provide for the quantification of the impact wh

47、en the total component failure rate is in jeopardy for an excursion as signaled by the combined monitors. Regardless of the qualification approach used, targets for a qualified device shall be in compliance with the qualification acceptance criteria used or equivalent.JEDEC Standard No. 659C Page 5

48、6 What a monitor includes (contd) For failure mechanisms from fabrication processes that require a monitor, each wafer fabricator shall have its own monitor or SRMF. For failure mechanisms from assembly that require a monitor, each assembly site monitor or SRMF shall have its own monitor or SRMF. Fo

49、r mechanisms requiring a monitor and driven by the combined effects of wafer fabrication and assembly, each combination of fabricator and assembly site shall have its own monitor or SRMF. 7 Control action system The suppliers control system shall address situations in which characteristics reach or exceed statistical warning limits or characteristics exceed the control limits. The suppliers control action system will: Document the definition of nonconformities as well as the procedure used to identify, verify, and determine the cause of nonconformities reported. Corrective actions