EN 62137-4-2014 en Electronics assembly technology - Part 4 Endurance test methods for solder joint of area array type package surface mount devices (Incorporating corrigendum Febr.pdf

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1、BSI Standards PublicationElectronics assembly technologyPart 4: Endurance test methods for solder joint of area array type package surface mount devicesBS EN 62137-4:2014Incorporating corrigendum February 2015National forewordThis British Standard is the UK implementation of EN 62137-4:2014,The UK p

2、articipation in its preparation was entrusted to TechnicalCommittee EPL/501, Electronic Assembly Technology.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users a

3、re responsible for its correct application. The British Standards Institution 2015.Published by BSI Standards Limited 2015ISBN 978 0 580 89842 6ICS 31.190Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStan

4、dards Policy and Strategy Committee on 28 February 2015.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 62137-4:201430 June 2015 Implementation of CENELEC corrigendumFebruary 2015. Supersession information addedincorporating corrigendum February 2015. It is iden

5、tical toIEC 62137-4:2014. It supersedes BS EN 62137:2004, which is withdrawn.to National Foreword, EN title page and EN Foreword.EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 62137-4 December 2014 ICS 31.190 English Version Electronics assembly technology - Part 4: Endurance test methods for

6、solder joint of area array type package surface mount devices (IEC 62137-4:2014) Technique dassemblage des composants lectroniques - Partie 4: Mthodes dessais dendurance des joints brass des composants pour montage en surface botiers de type matriciel (CEI 62137-4:2014) Montageverfahren fr elektroni

7、sche Baugruppen - Teil 4: Oberflchenmontierbare Bauteilgehuse mit Flchenmatrix - (Lebens-)Dauerprfungen fr Ltverbindungen (IEC 62137-4:2014) This European Standard was approved by CENELEC on 2014-11-13. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the

8、 conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Stand

9、ard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are

10、the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Pol

11、and, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix

12、 17, B-1000 Brussels 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 62137-4:2014 E Incorporating corrigendum February 2015 Supersedes EN 62137:2004 EN 62137-4:2014 - 2 - Foreword The text of document 91/1188/FDIS, future editi

13、on 1 of IEC 62137-4, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62137-4:2014. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identi

14、cal national standard or by endorsement (dop) 2015-08-13 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2017-11-13 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/o

15、r CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 62137-4:2014 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have t

16、o be added for the standards indicated: IEC 60068-1:1988+A1:1992 NOTE Harmonized as EN 60068-1:1994 (not modified). IEC 60068-2-2 NOTE Harmonized as EN 60068-2-2. IEC 60068-2-6 NOTE Harmonized as EN 60068-2-6. IEC 60068-2-21:2006 NOTE Harmonized as EN 60068-2-21:2006 (not modified). IEC 60068-2-27 N

17、OTE Harmonized as EN 60068-2-27. IEC 60068-2-44:1995 NOTE Harmonized as EN 60068-2-44:1995 (not modified). IEC 60068-2-58:2004 NOTE Harmonized as EN 60068-2-58:2004 (not modified). IEC 60068-2-78:2001 NOTE Harmonized as EN 60068-2-78:20011)(not modified). IEC 60749-1:2002 NOTE Harmonized as EN 60749

18、-1:2003 (not modified). IEC 60749-20:2008 NOTE Harmonized as EN 60749-20:2009 (not modified). IEC 60749-20-1:2009 NOTE Harmonized as EN 60749-20-1:2009 (not modified). IEC 61188-5-8 NOTE Harmonized as EN 61188-5-8. IEC 61189-3:2007 NOTE Harmonized as EN 61189-3:2008 (not modified). IEC 61189-5 NOTE

19、Harmonized as EN 61189-5. IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1. IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2. IEC 61760-1:2006 NOTE Harmonized as EN 61760-1:2006 (not modified). IEC 62137-1-3 NOTE Harmonized as EN 62137-1-3. IEC 62137-1-4:2009 NOTE Harmonized as EN 62137-1-4:2009 (not modi

20、fied). 1)Superseded by EN 60068-2-78:2013 (IEC 60068-2-78:2012): DOW = 2015-12-03. BS EN 62137-4:2014This document supersedes EN 62137:2004.- 3 - EN 62137-4:2014 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following docum

21、ents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an Internation

22、al Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu Publication Year Title EN/HD Year IEC 60068-2-14 - Environme

23、ntal testing - Part 2-14: Tests - Test N: Change of temperature EN 60068-2-14 - IEC 60191-6-2 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm a

24、nd 1,00 mm pitch ball and column terminal packages EN 60191-6-2 - IEC 60191-6-5 - Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA

25、) EN 60191-6-5 - IEC 60194 - Printed board design, manufacture and assembly - Terms and definitions EN 60194 - IEC 61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering app

26、lications EN 61190-1-3 - IEC 61249-2-7 - Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad EN 61249-2-7 - IEC 61249-2-8 - Materi

27、als for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials, clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad EN 61249-2-8 - BS EN 62137-4:2014EN 62137-4:2014

28、- 4 - Publication Year Title EN/HD Year IEC 62137-3 2011 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints EN 62137-3 2012 BS EN 62137-4:2014IEC 62137-4:2014 IEC 2014 CONTENTS 1 Scope 9 2 Normative references 9 3 Terms definiti

29、ons and abbreviations 10 3.1 Terms and definitions 10 3.2 Abbreviations 10 4 General . 10 5 Test apparatus and materials 11 5.1 Specimen 11 5.2 Reflow soldering equipment 11 5.3 Temperature cycling chamber . 11 5.4 Electrical resistance recorder 11 5.5 Test substrate . 11 5.6 Solder paste . 12 6 Spe

30、cimen preparation 12 7 Temperature cycling test . 14 7.1 Pre-conditioning 14 7.2 Initial measurement 14 7.3 Test procedure 14 7.4 End of test criteria. 16 7.5 Recovery 16 7.6 Final measurement . 16 8 Temperature cycling life 16 9 Items to be specified in the relevant product specification . 16 Annex

31、 A (informative) Acceleration of the temperature cycling test for solder joints . 18A.1 General . 18 A.2 Acceleration of the temperature cycling test for an Sn-Pb solder joint . 18 A.3 Temperature cycling life prediction method for an Sn-Ag-Cu solder joint . 19 A.4 Factor that affects the temperatur

32、e cycling life of the solder joint 23 Annex B (informative) Electrical continuity test for solder joints of the package 24B.1 General . 24 B.2 Package and daisy chain circuit 24 B.3 Mounting condition and materials 24 B.4 Test method 24 B.5 Temperature cycling test using the continuous electric resi

33、stance monitoring system 24 (informative) Reflow solderability test method for package and test substrate Annex Cland 26 C.1 General . 26 C.2 Test equipment . 26 C.2.1 Test substrate 26 C.2.2 Pre-conditioning oven 26 C.2.3 Solder paste 26 C.2.4 Metal mask for screen printing . 26 C.2.5 Screen printi

34、ng equipment . 26 BS EN 62137-4:2014 5 IEC 62137-4:2014 IEC 2014 C.2.6 Package mounting equipment 26 C.2.7 Reflow soldering equipment . 26 C.2.8 X-ray inspection equipment . 27 C.3 Standard mounting process 27 C.3.1 Initial measurement . 27 C.3.2 Pre-conditioning 27 C.3.3 Package mounting on test su

35、bstrate 27 C.3.4 Recovery . 28 C.3.5 Final measurement 28 C.4 Examples of faulty soldering of area array type packages . 28 C.4.1 Repelled solder by contamination on the ball surface of the BGA package . 28 C.4.2 Defective solder ball wetting caused by a crack in the package . 28 C.5 Items to be giv

36、en in the product specification 29 Annex D (informative) Test substrate design guideline . 30D.1 General . 30 D.2 Design standard 30 D.2.1 General . 30 D.2.2 Classification of substrate specifications 30 D.2.3 Material of the test substrate . 32 D.2.4 Configuration of layers of the test substrate .

37、32 D.2.5 Land shape of test substrate 32 D.2.6 Land dimensions of the test substrate 32 D.3 Items to be given in the product specification 33 Annex E (informative) Heat resistance to reflow soldering for test substrate 34E.1 General . 34 E.2 Test apparatus 34 E.2.1 Pre-conditioning oven 34 E.2.2 Ref

38、low soldering equipment . 34 E.3 Test procedure 34 E.3.1 General . 34 E.3.2 Pre-conditioning 34 E.3.3 Initial measurement . 34 E.3.4 Moistening process (1) 35 E.3.5 Reflow heating (1) . 35 E.3.6 Moistening process (2) 35 E.3.7 Reflow heating process (2) 35 E.3.8 Final measurement 35 E.4 Items to be

39、given in the product specification 35 Annex F (informative) Pull strength measurement method for the test substrate land 36F.1 General . 36 F.2 Test apparatus and materials 36 F.2.1 Pull strength measuring equipment 36 F.2.2 Reflow soldering equipment . 36 F.2.3 Test substrate 36 F.2.4 Solder ball .

40、 36 F.2.5 Solder paste 36 F.2.6 Flux . 36 F.3 Measurement procedure . 37 BS EN 62137-4:2014 6 IEC 62137-4:2014 IEC 2014 F.3.1 Pre-conditioning 37 F.3.2 Solder paste printing 37 F.3.3 Solder ball placement 37 F.3.4 Reflow heating process . 37 F.3.5 Pull strength measurement 37 F.3.6 Final measurement

41、 38 F.4 Items to be given in the product specification 38 Annex G (informative) Standard mounting process for the packages 39G.1 General . 39 G.2 Test apparatus and materials 39 G.2.1 Test substrate 39 G.2.2 Solder paste 39 G.2.3 Metal mask for screen printing . 39 G.2.4 Screen printing equipment .

42、39 G.2.5 Package mounting equipment 39 G.2.6 Reflow soldering equipment . 39 G.3 Standard mounting process 40 G.3.1 Initial measurement . 40 G.3.2 Solder paste printing 40 G.3.3 Package mounting . 40 G.3.4 Reflow heating process . 40 G.3.5 Recovery . 41 G.3.6 Final measurement 41 G.4 Items to be giv

43、en in the product specification 41 Annex H (informative) Mechanical stresses to the packages 42H.1 General . 42 H.2 Mechanical stresses . 42 Bibliography 43 Figure 1 Region for evaluation of the endurance test . 11 Figure 2 Typical reflow soldering profile for Sn63Pb37 solder alloy 13 Figure 3 Typic

44、al reflow soldering profile for Sn96,5Ag3Cu,5 solder alloy 14 Figure 4 Test conditions of temperature cycling test. 15 Figure A.1 FBGA package device and FEA model for calculation of acceleration factors AF . 21 Figure A.2 Example of acceleration factors AF with an FBGA package device using Sn96,5Ag

45、3Cu,5 solder alloy 22 Figure A.3 Fatigue characteristics of Sn96,5Ag3Cu,5 an alloy micro solder joint (Nf= 20 % load drop from initial load) . 23 Figure B.1 Example of a test circuit for the electrical continuity test of a solder joint . 24 Figure B.2 Measurement example of continuously monitored re

46、sistance in the temperature cycling test 25 Figure C.1 Temperature measurement of specimen using thermocouples 27 Figure C.2 Repelled solder caused by contamination on the solder ball surface 28 Figure C.3 Defective soldering as a result of a solder ball drop 29 Figure D.1 Standard land shapes of th

47、e test substrate . 32 Figure F.1 Measuring methods for pull strength . 37 BS EN 62137-4:2014 7 IEC 62137-4:2014 IEC 2014 Figure G.1 Example of printed conditions of solder paste . 40 Figure G.2 Temperature measurement of the specimen using thermocouples 41 Table 1 Test conditions of temperature cycl

48、ing test 15 Table A.1 Example of test results of the acceleration factor (Sn63Pb37 solder alloy) 19 Table A.2 Example test results of the acceleration factor (Sn96,5Ag3Cu,5 solder alloy) 21 Table A.3 Material constant and inelastic strain range calculated by FEA for FBGA package devices as shown in

49、Figure A.1 (Sn96,5Ag3Cu,5 solder alloy) 22 Table D.1 Types classification of the test substrate 31 Table D.2 Standard layers configuration of test substrates 32 Table G.1 Stencil design standard for packages 39 Table H.1 Mechanical stresses to mounted area array type packages 4 BS EN 62137-4:20142 8 IEC 62137-4:2014 IEC 2014 ELECTRONICS ASSEMBLY TECHNOLOGY Part 4: Endurance test methods for solder joint of area array type package surface mount devices 1 Scope This par