EN 61249-3-4-1999 en Materials for Printed Boards and Other Interconnecting Structures Part 3-4 Sectional Specification Set for Unreinforced Base Materials Clad and Unclad (Intende.pdf

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1、BRITISH STANDARD Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film The European Standard EN 6124M1999 has the stat

2、us of a British Stanard ICs 31.180 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW BS EN 61249441999 IEC 61249-3-4: 1999 BS EN 61249341999 been prepared under the direction of the Electrokchnicai Amd. No. Da Sector Committee, was published under the authority of the Standards

3、Committee and comes into effect on 15 June 1999 O BSI OE-1999 ISBN O 680 32630 X National foreword Comments This British Standard is the Enghh language version of EN 61249-341999. It is identical with IEC 61MW 1999. The UK participation in its preparation was entrusted to Technical Committee EPY501,

4、 Electronic assembly technology, which has the responsibility to: - aid enquirem to understand the text; - present to the responsible internationalEuropean committee any enquiries on the interpretation, or proposals for change, and keep the UK interests - monitor related international and European d

5、evelopments and promulgate informed, themintheuK. A list of organizations represented on this committee can be obtained on request to its sectaqy. Rom 1 January 1997, all IEC publications have the number 6 added to the old number. For instance, iEC 27-1 has been renumbered as IEC 60027-1. For a peri

6、od of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references Attention is dram to the fact that CEN and CENELEC Standards normally include an annex which lists normative references to international publications wit

7、h their corresponding European publications. The British Standards which implement these international or European publications may be found in the BSI Standards Catalogue under the section entitled htemational Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Ele

8、ctronic Catalogue. A British Standard does not purport to include all the necessary provisions of a conirad. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This d

9、ocument comprises a front cover, an inside front cover, the EN title page, pages 2 to 15 and a back cover. EUROPEAN STANDARD NORM EUROPENNE EUROPISCHE NORM EN 61 249-3-4 April 1999 ICs 31.1 80 English version Materials for printed boards and other interconnecting structures Part 3-4: Sectional speci

10、fication set for unreinforced base materials, clad and unclad (intended for flexible printed boards) Adhesive coated flexible polyimide film (IEC 61 249-3-4:1999) Matriaux pour circuits imprims et autres structures dinterconnexion Partie 3-4: Collection de spcifications intermdiaires pour les matria

11、ux de base non renforcs, recouverts ou non (prvus pour les circuits imprims flexibles) - Film flexible de polyimide recouvert de colle (CE1 61 249-3-4:1999) Materialien fr Leiterplatten und andere Verbindungsstrukturen Teil 3-4: Rahmenspezifikation fr unverstrkte, kaschierte und unkaschierte Basisma

12、terialien (fr flexible Leiterplatten) Kie berbeschic htete flexi bie Polyimidfolien (IEC 61 249-3-4:1999) This European Standard was approved by CENELEC on 1999-04-01. CENELEC members are bound to comply with the CENICENELEC Internal Regulations which stipulate the conditions for giving this Europea

13、n Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (Englis

14、h, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Be

15、lgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europis

16、ches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 1999 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61 249-3-4:1999 E Page 2 EN 61249-3-4: 1999 Foreword The text of document 52

17、/773/FDIS, future edition 1 of IEC 61249-3-4, prepared by IEC TC 52, Printed circuits, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61 249-3-4 on 1999-04-01. The following dates were fixed: - latest date by which the EN has to be implemented at national level by p

18、ublication of an identical national standard or by endorsement (dop) 2000-01 -0 1 - latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2002-0 1 -0 1 Annexes designated “normative“ are part of the body of the standard. Annexes designated “informative“ are g

19、iven for information only. In this standard, annex ZA is normative and annex A is informative. Annex ZA has been added by CENELEC. Endorsement notice The text of the International Standard IEC 61 249-3-4:1999 was approved by CENELEC as a European Standard without any modification. CONTENTS Clause Pa

20、ge Scope 4 Normative reference . 4 Materials and construction 4 Internal marking . 5 Properties of adhesive coated polyimide films . 6 Dimensions and tolerances 9 Packaging and marking 9 Designation 6 Acceptance testing . 1 0 Annex A (informative) Conversion table for test method reference numbers .

21、 11 Annex ZA (normative) Normative references to international publications with their corresponding European publications 15 O BSI 06-1 999 Page 4 EN 61249-3-4:1999 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - Part 3-4: Sectional specification set for unreinforced base materi

22、als, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film 1 Scope This part of IEC 61249 gives requirements for flexible polyimide films coated on one side or both sides with acrylic or epoxide type adhesive for use in the fabrication of flexible printed w

23、iring. Films coated on only one side are used as a coverlay or Covercoat in the fabrication of flexible printed wiring. This coverlay or Covercoat is also used to provide local support to areas subjected to mechanical or environmental stress. Films coated on both sides are used as bonding films in t

24、he fabrication of printed boards. 2 Normative reference The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC 61249. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply

25、. However, parties to agreements based on this pari of IEC 61249 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. Members of IEC and

26、 IS0 maintain registers of currently valid International Standards. IEC 61 189-2:1997, Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures 3 Materials and construction The material consists of an insulat

27、ing flexible film base of polyimide coated with an adhesive on one side or both sides. 3.1 Insulating film Polyimide films of preferred thicknesses and permitted tolerances are given in table 1 when measured by the method 2001 of IEC 61 189-2, provided that the micrometer used is capable of resolvin

28、g 0,002 mm or better. Other thicknesses may be used by agreement between purchaser and supplier. The maximum permitted tolerances of such thicknesses shall be those of the nearest greater thickness stated in table 1. Table 1 - Preferred thicknesses and maximum permitted tolerances Nomlnal thickness

29、(wlthout ad herlve) wn 12,5 25 50 75 125 Maximum tolerance at any measured point % i 30 f 20 I 15 I10 f 10 3.2 Adhesive The adhesive shall be compatible with the copper-clad polyimide film. Relevant adhesives are B-staged adhesives based on acrylic or epoxy resin. The thickness of the adhesive is de

30、fined as follows: TB = Tc - Tf where Ta Tc fi is the thickness of the adhesive; is the average value of the total thickness of the adhesive coated film under test; is the average value of the thicknesses of the insulation film under test without adhesive. Thickness values Tc and Tf shall be measured

31、 as described in 3.1. The thickness of the adhesive shall be between 12,5 pm and 75 pm with a permissible tolerance of 120 YO. Preferred thicknesses are 20 pm, 25 pm, 38 pm, 50 pm, and 75 prn. 4 Internal marking Not applicable. Page 6 EN 61249-3-4:1999 5 Designation The following code shall be used

32、to designate adhesive coated polyimide films according to this specification: Example: PI-IEC-61249-3-4 - A - 25 - 50 - O - FV1 type of adhesive (A = acrylic, E = epoxide, P = polyester) adhesive thickness on side 1 (mm) film thickness (mm) adhesive thickness on side 2 (mm) Flammability rating (see

33、table 4) If there is no risk of confusion, the designation may be abbreviated to read (the same example as above): PI-IEC-A-25-50-0-FV1. 6 Properties of adhesive coated polyimide films 6.1 A pparance The adhesive coated film shall be free from blisters and wrinkles. There shall be no imperfections w

34、hich will be detrimental to the material properties or to their intended use. The film shall be uniform in colour and free from foreign inclusions. Colour degradation shall not occur when the film is processed in accordance with the manufacturers instructions. The adhesive shall be protected by a po

35、lymeric release film or release paper which shall adhere until lamination. For polyimide films with adhesive on both sides, one adhesive layer or both shall be protected with such release materials. The appearance of the adhesive coated film shall only be inspected with the release material present

36、in cases where the release material is transparent. Where foreign inclusions appear to be imbedded in the adhesive and/or between the adhesive and the polyester film, the release material shall be removed and the coated film shall be re-inspected. 6.2 Properties of adhesive coated polyimide films af

37、ter curing 6.2.1 Preparation of laminated specimens In order to determine the properties listed in 6.2.2 and 6.2.3, laminated specimens shall be prepared as follows. 6.2.1.1 Specimens from cover sheets Test specimens shall comply with the requirements of IEC 61 189-2 (see annex A). They shall be cut

38、 from a set of samples prepared by laminating copper foil to the film material under test. Laminating conditions should be agreed upon between purchaser and supplier, and should comply with the material manufacturers recommendations regarding pressure, temperature and pressing duration. The copper f

39、oil, as used in the fabrication of copper-clad laminates, shall have a thickness of 35 pm (305 g/m2) and shall be applied with the untreated (shiny) side to the adhesive layer. L , 2E04 I 1 O4 MQm min. If any argument arises in relation to the laminating conditions, it is desirable to apply the stan

40、dard procedures and conditions in the relevant test method specification (see IEC 61 189-2) by agreement between purchaser and supplier. NOTE - When the release or protective materials are peeled off from coverlay films with punched holes andior slits for further fabrication processes, careful atten

41、tion should be paid in order to avoid deformation of the film due to any excessive peeling force. 6.2.1.2 Specimens from bonding films The required test specimens according to the relevant clauses of IEC 61189-2 shall be cut from a set of samples prepared by laminating copper foils to both sides of

42、the film material under test as described in 6.2.1.1, except for peel strength and heat shock testing. Tort method 2E2 2E03 2E04 (IEC 81189-2) For peel strength and heat shock testing the samples shall be prepared by laminating a single- sided copper-clad epoxide/glass laminate on one side of the ad

43、hesive coated bonding film, and an unclad epoxide/glass laminate with a thickness not less than 0.5 mm on the other side, as described in 6.2.1.1. Two sets of samples shall be prepared: one with the copper foil facing side 1 of the bonding film, one with the copper foil facing side 2 of the bonding

44、film. 6.2.2 Electrical properties Table 2 - Electrical properties Roq u I rament 103 MQ min. IO4 MQ min. 103 Mnm min. Property Dielectric dissipation factor after damp heat and recovery (optional) Electrical strength Surface resistance after damp heat while in the humidity chamber (optional) Surface

45、 resistance after damp heat and recovery Volume resistivity after damp heat while in the humidity chamber (optional) Volume resistivity after damp heat and recovery 2E10 0,05 max. 2E11 60 kVlmm min. Surface corrosion r I NO visible corrosion products in the gap 43 max. I 2Ei0 I Relative permittivity

46、 after damp heat and I recovery foptlonal) 6.2.3 Non-electrical properties Peel strength as received Peel strength after thermal shock of 1 O s Peel strength after dry heat at 125 OC (optional) 6.2.3. Properties related to the copper foil bond Table 3 - Properties related to the copper foil bond 2M1

47、3 2M14 2M15 Not less than 0,7 Nimm Not less than 0,6 Nimm Not less than 0,35 N/mm Property I Blistering after 1 O s thermal shock I 2C05 I Requirement No blistering or delamination Property Test method Requirement (IEC 61189-2) 6.2.3.2 Flammability 2x02 (process step 2 only) Table 4 - Flammability 3

48、,O pm/mm max. in either direction Property I Adhesive thickness Irm 20 25 38 50 75 Any I Req u I remont I Test method 1 (IEC 61189-2) Requlrement mm 0,20 0,20 0,25 0,30 035 No void shall remain In the testing areas of test specimens Flammability of films 50 pm thick or greater when used in combinati

49、on with material specified in IEC 61249-3-2 1) supplier and purchaser or that the flammability rating of the base material (61249-3-2) is not 6.2.3.3 Water absorption Not specified. I 2x02 13 pm/mm max. I in either direction I peeling off of release/protective materials I Dimensional change due to careful Dimensional change due to heating at (150 t2) “C 6.3.2 Adherive flow during lamination Table 6 - Adhesive flow Property Adhesive flow Clearance filling with adhesive Test method (IEC 61 189-2) (Under consideration) (Under consideration) l) Un