EN 123500-1992 en Sectional Specification Flexible Printed Boards with Through Connections (Incorporates Amendment A2 1995)《分规范 有贯通连接的柔性印制电路板 包含修改件A2-1995》.pdf

《EN 123500-1992 en Sectional Specification Flexible Printed Boards with Through Connections (Incorporates Amendment A2 1995)《分规范 有贯通连接的柔性印制电路板 包含修改件A2-1995》.pdf》由会员分享，可在线阅读，更多相关《EN 123500-1992 en Sectional Specification Flexible Printed Boards with Through Connections (Incorporates Amendment A2 1995)《分规范 有贯通连接的柔性印制电路板 包含修改件A2-1995》.pdf（43页珍藏版）》请在麦多课文档分享上搜索。

1、BRITISH STANDARD Harmonized system of quality assessment for electronic components Sectional specification: Flexible printed boards with through connections * * VI The European Standard EN 123500 : 1992 with the inclusion of amendment A2,1995 has the status of a British Standard ICs 31.180 BS EN 123

2、500 : 1992 Incorpomting Amendments Nos. 1 and 2 BS CECC 25500 : 1990 renumbered NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW BS EN 123500 : 1992 Issue 3, December 1997 National foreword This British Standard has been produced under the direction of the Electronics Component

3、s Standards Policy Committee. It is identical with CENELEC Electronic Components Committee (CECC) 23500 : 1985 Harmonized system of quality assessment for electronic components: Sectional specification: Flexible printed boards with through connections. This standard is a harmonized specification wit

4、hin the CECC system and should be read in conjunction with ES EN 123000. In 1992 the CENELEC Electronic Components Committee (CECC) accepted CECC 23500 : 1985 as European Standard EN 123500 : 1992. Amendment 1 to BS EN 123500 implemented amendment A2 : 1995 to EN 123500. Amendment 2 was issued by BS

5、I to correct errors in amendment 1. Il II Cross-references The British Standard which implements CECC O0100 is BS 9000 General requirements for a system for electronic components of assessed quality Part 2 Specification for national implementation of CECC basic rules and rules of procedure. Internat

6、ional standard Corresponding British Standard I CECC 23000 : 1985 BS EN 123000 : 1992 Harmonized system of quality assessment for electronic components: Generic specification : Printed boards (Identical) BS 201 1 Basic environmental testing procedures (Most Parts are identical) BS EN 60249 Base mate

7、rials for printed circuits (Most Parts are identical) BS 6221 : Printed wiring boards IEC 326-2 1976 Part 2 : Methods of test (Technically equivalent) IEC 326-8 : 1981 Part 8 : 1982 Method for specifying single and double sided flexible printed wiring boards with through connections (Identical) IEC

8、68 II IEC 249 There is no British Standard equivalent to CECC O0 010 : 1980, which comprises only a list of the tests in IEC 326-2 and its supplement IEC 326-2A. The Technical Committee has reviewed the provisions of IEC 194 : 1975, IEC 321 : 1970 and IEC 326-3 : 1980, to which reference is made in

9、the text, and has decided that they are acceptable for use in conjunction with this standard. Compliance with a British Standard does not of itself confer immunity from legal obligations. , O BSI 1997 I I STD-BSI BS EN 123500-ENGL L97Z Lb2LibbS Ob704b7 275 E Page Issue Front cover 3 Inside front cov

10、er 3 a 2 b blank EN title page 1 d 1 1 to 15 original Issue 2, December 1997 BS EN 123500 : 1992 Page 16 17 18 19 to 26 Inside back cover Back cover Summary of pages The following table identifes the current issue of each page. Issue 1 indicates that a page has been introduced for the first time by

11、amendment. Subsequent issue numbers indicate an updated page. Double vertical sidelining on replacement pages indicates the most recent changes (amendment, addition, deletion). Issue 3 3 3 original original 3 Wherever BS CECC 23500 : 1990 appears in this standard, it should beread as BS EN 123500 :

12、1992. Wherever CECC 23000 and CECC 23400 appear in this standard, they should be read as EN 23000 and EN 23400 respectively. * UI * O BSI 1997 a _ STD-BSI BS EN L23500-ENGL L992 D Lb24bb9 Ob704b8 1OL EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 123500 May 1992 + A2 August 1995 ICs 31.180 Des

13、criptors: Flexible printed boards, with through connections, capability test, quality conformance inspection, test patterns English version Sectional Specification : Flexible printed boards with through connections (includes amendment A2 : 1995) Spcification intermdiaire : Cartes imprimes souples av

14、ec connexions transversales (inclut lamendement A2 : 1995) Rahmenspezifikation : Flexible Leiterplatten mit Durchverbindungen (enthlt nderung A2 : 1995) This European Standard was approved by the CENELEC Electronic Components Committee (CECC) on 1995-07-04. CENELEC members are bound to comply with t

15、he CENKENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat o

16、r to any CENELEC member. This European Standard exists in three oficial versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the offici

17、al versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical

18、 Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, 6-1050 Brussels Q 1995 Copyright reserved to CENELEC members Ref. No. EN 123500 : 1992/A2 : 1995 E STD-BSI BS EN L235-ENGL 1992 Lb24bb9 b704b9 O4

19、6 EN 123500 : 1992 Issue 1, September 1996 Foreword to amendment A2 This amendment was prepared by CLC/TC CECCMrG 23. 1 The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENELEC as amendment A2 to EN 123500 : 1992 on 1995-07-04. The following dates were fixed

20、: - latest date by which the amendment has to be implemented at national level by publication of an identical national standard I or by endorsement (dop) 1996-07-01 - latest date by which the national standards conflicting with the amendment have to be withdrawn (daw) 1996-07-01 d 0 BSI 1996 CONTENT

21、S Page 2 2 FOREWORD PREFACE Clause Introduction Scope and object Related documents 3 3 3 1 1.1 1.2 2 General 4 3 3.1 3.2 Test specimens Capability approval Quality conformance inspec tion 4 4 5 4 Relevant specification 5 5 Characteristics of printed boards Table I Table II 5 6 12 6 Capability test p

22、rogramme 14 * * m 7 Quality conformance inspection 16 8 8.1 Test patterns Application of test patterns Composite test pattern (CTP) Multiple arrangements of the CTP and test boards 19 19 20 21 8.2 8.3 Figure 2 Composite test pattern Figure 3 Examples of soldered holes Figure 4 Figure 5 Examples of d

23、elamination Examples related to access holes 22 24 25 26 1 CECC 23 500 Issue 1 _ _ STD.BS1 BS EN 123500-ENGL 1992 9 1b24bb9 Ob70471 7Tb m FOREWORD The CENELEC Electronic Components Committee (CECC) is composed of those member countries of the European Committee for Electrotechnical Standardization (

24、CENELEC) who wish to take part in a harmonized System for electronic components of assessed quality. The object of the System is to facilitate international trade by the harmonization of the specifications and quality assessment procedures for electronic components, and by the grant of an internatio

25、nal1y.recognized Mark, or Certificate, of Conformity. The components produced under the System are thereby accepted by all member countries without further testing. The specification has been formally approved by the CECC, and has been prepared for those countries taking part in the System who wish

26、to issue national harmonized SECTIONAL SPECIFICATIONS for FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS. It should be read in conjunction with the current regulations for the CECC System. At the date of printing of this document the member countries of the CECC are Austria, Belgium,. Denmark, Fln

27、land, France, Germany, Ireland, Italy, the Netherlands, Norway, Portugal, Spain, Sweden, Switzerland, and the United Kingdom. PREFACE This Sectional Specification was prepared by CECC Working Group 23: Circuits. Printed It is based on publications of the International Electrotechnical Commission (IE

28、C). The text of this specification was circulated to the CECC for voting in the document indicated below and was ratified by the President of the CECC for printing as a CECC Specification. Document Date of Voting .CECC(Secretariat)7627 March i985 Report on the Voting CECC(Secretariat)l729 SECRETARIA

29、T NOTE: DUE TO THE URGENT INDUSTRIAL NEED FOR THIS SPECIFICATION, TIIE PRESDENT OF THE CECC HAS RULED THAT IT BE FIELISHED WITHOUT THE FULL EDITORIAL PROCEDRE BEING APPLIED. USERS OF TE SP%CII?ICATION ARE ASKED TO REPORT TO IW3 CECC GEW SECRETUIAT ANY EIIRORS THEY FIND SO THAT AYENDINCi ACTION CAN B

30、E INI- TIATEI). The text is published initially version will follow as soon as it has been prepared. in English and German. The French CECC 23 500 Issue 1 2 STD.BS1 BS EN 123500-ENGL 1992 I Lb2i-lbb Ob70472 632 1. Introduction IEC 326-8 is the IEC-Standard for flexible printed boards with through co

31、nnections. The following document comprises this IEC-Standard and in accordance with the generic specification CECC 23 O00 the information additionally necessary for printed boards intended to be handled within the CENELEC system for Electronic Components of Assessed Quality. 1.1 Scope and Object Th

32、is document is a Sectional Specification (SS) relating to flexible printed boards with through connections irrespective of their method of manufacture, when they are ready for mounting of the components. It defines the characteristics to be assessed and the test methods to be used for capability app

33、roval testing and for quality conformance inspection (lot-by-lot and periodic inspection). 1.2 Related documents - Basic environmental testing procedures - Terms an efinitions for printed circuits - Metal-clad base materials for printed circuits - Guidance for the design and use of components . _ IE

34、C 68 IEC 194 IEC 249 IEC 321 intended for mounting cn printed boards. IEC 326-2 IEC 326-3 IEC 326-8 CECC 00 O10 - Printed boards - test methods - Printed boards - test methods - Design and use of printed boards - Specification for flexible printed bards with through connections CECC 23 O00 - Generic

35、 Specification Printed boards of assessed quality. 3 CECC 23 500 Issue 1 2. STD.BS1 BS EN 123500-ENGL 1792 S Lb24bb Ob70473 577 General This Sectional Specification ($3) applies to flexible printed boards with through connections and is intended as a basis for the preparation of - Capability Detail

36、Specification Cap OS) applying to specific materials, e.g. according to 1% 249-2, and to be used for capability approval procedures. It may be necessary to have a Cap DS for each type of material. A Cap DS may be prepared by an international or a national body or Dy a manufacturer (see also CECC O0

37、111). - Customer Detail Specification (CDS) for the custom built printed boards, according to 5 of CECC 23 000. The CDS will normally be written by the customer and allocated a number within his own system. Further details are also given in CECC 23 O00 and in CECC O0 107 Part III. Table I contains t

38、he basic characteristics that will normally be important for flexible printed boards with through connections and makes reference to the appropriate tests to verify these characteristics. Table II contains the additional characteristics that may be important for certain flexible printed boards with

39、through connections and/or certain applications and makes reference to the appropriate tests to verify these characteristics. Where necessary, the relevant specification may quote characteristics and tests from this Table II. Where additional details for a test have to be specified in the relevant s

40、pecification, this is indicated by an asterisk in the relevant column. These details shall then be specified in accordance with CECC O0 010 (IEC 326-2). Table III contains the capability test programme. A specified composite test pattern (CTP) is used as capability qualifying component. Table IV con

41、tains the information for the quality conformance inspec tion. The tables are not intended to prescribe a test sequence, the tests may be carried out in any sequence, unless otherwise specified. 3. Test specimens 3.1 Capability Approval 3.1 .1 Basic Capability The test shall be carried out on the co

42、mposite test pattern given in 8. 3.7.2 Additional Capability 3.5.3 of CECC 23 O00 shall apply. For multiple arrangements see also 8. CECC 23 500 Issue 1 4 3.1.3 Maintenance of Capability Approval 3.8 of CECC 23 O00 shall apply. 3.2 Quality conformance inspection Unless otherwise specified production

43、 boards and/or specially designed test patterns may be used for carrying out tests for the lot-by-lot and the periodic inspection. Where specially designed test patterns shall Se used they may be included in the panel. They may be based on the appropriate pattern of the composite test pattern clause

44、 8. Consultation between manufacturer .and customer will usually be necessary. 4. Relevant specification The term “Relevant Specification“ means a product specification for an actual printed board, i .e. a CDS as well as a-Cap DS applied to -a specific material and technique, as agplicable. The rele

45、vant specification shall contain all information necessary to define the printed board clearly and completely. The recommendations given in IEC 326-3 shall preferably be followed. Care should be taken to avoid unnecessary prescriptions. Permissible deviations shall be stated where necessary, nominal

46、 values without tolerances or simple maxima or minima shall be given where sufficient. Where tolerances are necessary for certain areas or parts . of the printed bard only, they shall be applied and restricted to those areas or parts. -. If there are several possibilities of presentation, of toleran

47、ce classes etc., the selections given in IEC 326-3 shall preferably be applied. In case of discrepancy between the CDS and any other pertinent specification (e.g. BS, GS, or SS), the CDS shall prevail. 5. Characteristics of printed boards -. Basic characteristics of flexible printed boards with thro

48、ugh connections are given in Table I. Additional characteristics of flexible printed boards with through connections are given in Table II. 5 CECC 23 500 Issue 1 STD.BSI BS EN L23500-ENGL 1992 Lb24bb9 b70475 341 S TABLE 1 Basic characteristics Characicristics General eramination Vhi examination Conf

49、ormity and idm. tifiation Appcuuia and workmanship Piaid-througb hola Eyclas Bonding conductor ia Sumrate I 1. * See 2. CECC 23 500 Issue 1 Requiriments Pattern, marking, identifition and materia) finishes shall comply with the relevant spccifmtion. “bere shall be no apparent defects Pht b) Mukings reduced but Iegibie. Re*: a) Mukings iikgibk or destroyed; b) Mukinp doubcfulfy kpiie, Le. por- o%lc misulrinp of rimilu cburaai ruch .S R-P-B. E-F. Ca. Remarks AUVWJ nu (0.26) IL rpccitiCd in sub- ciause .6.6.2 IEC Public