DLA SMD-5962-92284-1993 MICROCIRCUIT DIGITAL CMOS 32-BIT RISC MICROPROCESSOR MONOLITHIC SILICON《硅单片 精简指令集电脑微处理器 氧化物半导体数字微型电路》.pdf
《DLA SMD-5962-92284-1993 MICROCIRCUIT DIGITAL CMOS 32-BIT RISC MICROPROCESSOR MONOLITHIC SILICON《硅单片 精简指令集电脑微处理器 氧化物半导体数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-92284-1993 MICROCIRCUIT DIGITAL CMOS 32-BIT RISC MICROPROCESSOR MONOLITHIC SILICON《硅单片 精简指令集电脑微处理器 氧化物半导体数字微型电路》.pdf(27页珍藏版)》请在麦多课文档分享上搜索。
1、LTR DESCRIPTION DATE (YR-MO-DA) APPROVED MICROCIRCUIT, DIGITAL, CMOS, 32-BIT RISC MICROPROCESSOR, MONOLITHIC SILICON APPROVED BY “Onica L. Oelking a LI A .-a. .-. - DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE PMIC N/A - STANDARDIZED MILITARY UKAWlN AttKUVAL UAlt
2、DEPARTMENT OF DEFENSE I 93-03-18 I I I PREPARED BY Thomas M. Hess DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 CHECKED BY Thomas M. Hess AMSC NIA SIZE A REVISION LEVEL 5962-92284 CAGE CODE 67268 SHEET 1 OF 26 SC FORM 193 5962-E067-93 JUL 91 Provided by IHSNot for ResaleNo reproduction or net
3、working permitted without license from IHS-,-,-I 1. SCOPE 1.1 Scope. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device class
4、es S and VI, and a choice of case outlines and lead finishes are available and are reftected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAW class 6 microcircuits in accordance with 1.2.1 of MIL-STD-3, “Provisions for the use of MIL-STD-883 in conjunction with
5、 compliant non-JAN devices“. available, a choice of Radiation Hardness Assurance (RHA) Levels are reflected in the PIN. When 1.2 Qi. The PIN shall be as shown in the following example: - X X 1 - M - o1 5962 92284 - I I I I I I I I I l I Lead Case L Devi ce 1 Device II Federal RHA stock class designa
6、tor type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) I (see 1.2.3) I Drawing number 1.2.1 RHA desiqnator. Device classes M, 8, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designat
7、or. the MIL-1-38535 specified RHA levels and shall be marked with the appropriate RHA designator. non-RHA device. Device classes Q and V RHA marked devices shall meet A dash (-1 indicates a 1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic n
8、umber circuit function Speed o1 29000 32 Bit streamlined instruction processor 20 MHz 02 29000 32 Bit streamlined instruction processor 16 MHz STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 1.2.3 Device class desiqnator. The device class designator shall be a sin
9、gle letter identifying the product assurance level as follows: Device class Device requirements documentation SIZE 5962-92284 A REVISION LEVEL SHEET M Vendor self-certification to the requirements for non-JAN class 6 microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Q or V Certification a
10、nd qualification to MIL-M-38510 Certification and qualification to MIL-1-38535 1.2.4 Case outline(s). The case outline(s1 shall be as designated in MIL-STD-1835 and as follows: Packaqe style Outline letter Descriptive desianator Terminals 2 CMGA9-PI69 169 Pin grid array 1 1.2.5 Lead finish. The lead
11、 finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-1-38535 for classes Q and V. Finish letter “X“ shall not be marked on the microcircuit or its packaging. for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preferen
12、ce. The “X“ designation is i I DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-92284 m 999999b O039656 T94 m STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 c SIZE 5962-92284 A REVISIO
13、N LEVEL SEIEET 3 1.3 Absolute maximum ratings. A/ Supply voltage range. . Input voltage range -0.5 to Vc +0.5 V dc Storage temperature range . Lead temperature (soldering, 10 seconds). . 3WoC Thermal resistance, junction-to-case (8,): Junction temperature (TJ) . 131.6OC +4.5 V dc to +5.5 V dc -65OC
14、to +$5OoC Maximum power dissipation (PD) (2/) . 3.3 W Case 2. . See MIL-STD-1835 1.4 Recommended operatinq conditions. Supply voltage (V c . Minimum high-levef input voltage (VI 1. Maximum low-level input voltage (VIL? . Case operating temperature range (TC) . Maximum low-level SYSCLK input voltage
15、+4.5 V dc to +5.5 V dc 2.0 V dc 0.8 V dc -55OC to +12SoC . +0.8 V dc (VIHSYSCLK) . Vcc - 0.8 V dc 1.5 Digital laic testinq for device classes P and V. Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) XX percent I/ - - I/ Stresses above the absolute maximum rati
16、ng may cause permanent damage to the device. maximum levels may degrade performance and affect reliability. - 2/ Must withstand the added PD due to short circuit test (Ios) - 3/ Values will be added when they become available. Extended operation at the I I I DESC FORM 193A JUL 91 Provided by IHSNot
17、for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-92284 = 999999b 0039657 920 = 2. APPLICABLE DOCUMENTS 2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified, the following specifications, standards, bulletin, and handbook
18、of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATIONS MILITARY MIL-M-38510 - Microcircuits, General Specification for. MIL-1-38535 - Integrated Cir
19、cuits, Nanufacturing, General Specification for. STANDARDS MILITARY I MIL-STO-480 - Configuration Control-Engineering Changes, Deviations and Waivers. MIL-STD-883 - Test Methods and Procedures for Microelectronics. 1 MIL-STD-1835 - Microcircuit Case Outlines. BULLETIN MILITARY MIL-BUL-103 - List of
20、Standardized Military Drawings (SMDIS). HANDBOOK MILITARY I MIL-HDBK-780 - Standardized Military Drawings. (Copies of the specifications, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or
21、as directed by the contracting activity.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device class M s
22、hall be in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and as specified herein. The individual item requirements for device classes B and S shall be in accordance with MIL-M-38510 and as specified herein. included in thi
23、s SMD. MIL-1-38535, the device manufacturers Quality Management (QM) plan, and as specified herein. For device classes B and S, a full electrical characterization table for each device type shall be The individual item requirements for device classes Q and V shall be in accordance with 3.2 Desiqn, c
24、onstruction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-M-38510 for device classes H, 8, and S and MIL-1-38535 for device classes Q and V and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.
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