DLA SMD-5962-90863 REV C-2002 MICROCIRCUIT LINEAR ANALOG INTERFACE CIRCUIT MONOLITHIC SILICON《硅单块 模拟界面电路 直线式微型电路》.pdf

《DLA SMD-5962-90863 REV C-2002 MICROCIRCUIT LINEAR ANALOG INTERFACE CIRCUIT MONOLITHIC SILICON《硅单块 模拟界面电路 直线式微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-90863 REV C-2002 MICROCIRCUIT LINEAR ANALOG INTERFACE CIRCUIT MONOLITHIC SILICON《硅单块 模拟界面电路 直线式微型电路》.pdf（35页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 03. Editorial changes throughout. 93-09-27 Michael A. Frye B Changes in accordance with NOR 5962-R120-94. 94-03-16 Michael A. Frye C Drawing updated to reflect current requirements. - lgt 02-05-07 Raymond Monnin THE ORIGINAL FIRST

2、 SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV C C C C C C C C C C C C C C C C C C C C SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Rick C. Officer DEFENSE SU

3、PPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, ANALOG INTERFACE CIRCUIT, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTME

4、NT OF DEFENSE DRAWING APPROVAL DATE 91-02-06 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-90863 SHEET 1 OF 34 DSCC FORM 2233 APR 97 5962-E358-02 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permit

5、ted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90863 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (devic

6、e classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown

7、 in the following example: 5962 - 90863 01 M X X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2) Device class designator Caseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices mee

8、t the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The

9、device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 TLC32040M Analog interface circuit 02 TLC32044M Voice-band analog interface circuit 03 TLC32046M Wide-band analog interface circuit 1.2.3 Device class designator. The device class designator is a

10、single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualif

11、ication to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDIP1-T28 OR CDIP2-T28 28 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier 1.2.5 Lead finish. The lead finish

12、is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90863 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

13、 43216-5000 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Positive analog supply voltage (VCC+) 2/ -0.3 V to 15 V Digital supply voltage (VDD). -0.3 V to 15 V Output voltage (VOUT) -0.3 V to 15 V Input voltage (VIN) . -0.3 V to 15 V Digital ground voltage. -0.3 V to

14、 15 V Storage temperature range. -65C to +150C Power dissipation (PD) 4 W Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +150C Lead temperature soldering 1.6 mm (1/16 inch) from case for 60 seconds . +300C 1.4 Recommended operating conditions. Positive analo

15、g supply voltage (VCC+) 3/ 4.75 V minimum to 5.25 V maximum Negative analog supply voltage (VCC-) 3/. -4.75 V minimum to -5.25 V maximum Digital supply voltage (VDD) 3/ 4.75 V minimum to 5.25 V maximum Digital ground voltage with respect to ANLG GND, DGTL GND. 0 V nominal High-level input voltage (V

16、IH) +2.0 V minimum Low-level input voltage (VIL) . +0.8 V maximum Load resistance at OUT+ and/or OUT- (RL) . 300 minimum Master clock (MCLK) frequency 4/. 10.368 MHz maximum Load capacitance at OUT+ and/or OUT- (CL). 100 pF maximum A/D or D/A conversion rate . 16 kHz maximum Conversion rate 20 kHz A

17、mbient operating temperature range, (TA) -55C to +125C Analog input amplifier common mode input voltage 5/ 1.5 V maximum 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/

18、 Voltage values for maximum ratings are with respect to VCC-. 3/ Voltages at analog inputs and outputs, REF, VCC+, and VCC-, are with respect to the ANLG GND terminal. Voltages at digital inputs and outputs and VDDare with respect to the DGTL GND terminal. 4/ For device types 01 and 02, the band-pas

19、s and low-pass switched-capacitor filter response specifications apply only when the switched-capacitor clock frequency is 288 kHz. For switched-capacitor filter clocks at frequencies other than 288 kHz, the filter response is shifted by the ratio of the switched-capacitor filter clock frequency to

20、288 kHz. For device type 03, the band-pass switched-capacitor filter (SCF) specifications apply only when the low-pass section SCF clock is 288 kHz and the high-pass section SCF clock is 16 kHz. If the low-pass SCF clock is shifted from 288 kHz, the low-pass roll-off frequency shifts by the ratio of

21、 the low-pass SCF clock to 288 kHz. If the high-pass SCF clock is shifted from 16 kHz, the high-pass roll-off frequency shifts by the ratio of the high-pass SCF clock to 16 kHz. Similarly, the low-pass switched-capacitor filter (SCF) specifications apply only when the SCF clock is 288 kHz. If the SC

22、F clock is shifted from 288 kHz, the low-pass roll-off frequency shifts by the ratio of the SCF clock to 288 kHz. 5/ This range applies when (IN+ - IN-) or (AUX IN+ - AUX IN-) equals 6 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICRO

23、CIRCUIT DRAWING SIZE A 5962-90863 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing

24、to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - I

25、ntegrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings.

26、 MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a con

27、flict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item r

28、equirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requi

29、rements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for devic

30、e classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Block diagram(s). The block diagram(s) shall be a

31、s specified on figure 2. 3.2.4 Internal timing configuration(s). Internal timing configuration(s) shall be as specified on figure 3. 3.2.5 Data word format. Data word format shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless oth

32、erwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified

33、in table II. The electrical tests for each subgroup are defined in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90863 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEE

34、T 5 DSCC FORM 2234 APR 97 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has t

35、he option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certi

36、fication/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate o

37、f compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (

38、see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements

39、of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notificatio

40、n of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A. 3.9 Verification and review for device class M. For device class M, DSCC, D

41、SCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices cov

42、ered by this drawing shall be in microcircuit group number 77 (see MIL-PRF-38535, appendix A). 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufactur

43、ers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall

44、be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection

45、. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition B or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The

46、test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. Provided by IHSNot for ResaleNo

47、 reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90863 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C T

48、A+125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max High level output voltage VOHVDD= 4.75 V, IOH= -300 A 1, 2, 3 All 2.4 V Low level output voltage VOLVDD= 4.75 V, IOL= 2 mA 1, 2, 3 All 0.4 V Supply current from VCC+ICC+1, 2, 3 01, 02 40 mA 03 45 Supply current from

49、VCC-ICC-1, 2, 3 01, 02 -40 mA 03 -45 Supply current from VDDIDD1, 2, 3 01, 03 7 mA 02 8 Internal reference output voltage VREF1, 2, 3 All 2.9 3.3 V Input current II1, 2, 3 01, 02 10 A A/D converter offset error (filters bypassed), receive amplifier input OEB1, 2, 3 01 65 mV A/D converter offset error (filters in), receive amplifier input OEI1, 2, 3 01 65 mV 02 85 03 70 Common mode re