DLA SMD-5962-89722 REV A-2010 MICROCIRCUIT DIGITAL ADVANCED SCHOTTKY TTL OCTAL 30-OHM TRANSMISSION LINE DRIVER BACKPLANE TRANSCEIVERS NINV (OPEN COLLECTOR WITH ENABLE WITH THREE ST.pdf
《DLA SMD-5962-89722 REV A-2010 MICROCIRCUIT DIGITAL ADVANCED SCHOTTKY TTL OCTAL 30-OHM TRANSMISSION LINE DRIVER BACKPLANE TRANSCEIVERS NINV (OPEN COLLECTOR WITH ENABLE WITH THREE ST.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89722 REV A-2010 MICROCIRCUIT DIGITAL ADVANCED SCHOTTKY TTL OCTAL 30-OHM TRANSMISSION LINE DRIVER BACKPLANE TRANSCEIVERS NINV (OPEN COLLECTOR WITH ENABLE WITH THREE ST.pdf(12页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements . Editorial changes throughout. - gap 10-02-10 Charles F. Saffle The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6
2、 7 8 9 10 11 PMIC N/A PREPARED BY Tim H. Noh DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Tim H. Noh APPROVED BY William K. Heckm
3、an MICROCIRCUIT, DIGITAL, ADVANCED SCHOTTKY, TTL, OCTAL 30-OHM TRANSMISSION LINE DRIVER/BACKPLANE TRANSCEIVERS NINV, (OPEN COLLECTOR WITH ENABLE WITH THREE STATE), MONOLITHIC SILICON DRAWING APPROVAL DATE 89-08-11 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-89722 SHEET 1 OF 11 DSCC FORM 22
4、33 APR 97 5962-E487-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89722 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This dr
5、awing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89722 01 K X Drawing number Device type (see 1.2.1) Case
6、outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54F30245 Octal 30 transmission line/backplane transceivers, noninverting (open collector with enable with three state) 1.2.2 Case
7、 outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 dual-in-line package L GDIP3-T24 or CDIP4-T24 24 flat package 3 CQCC1-N28 28 square chip carrier 1.2.3 Lead finish. The lead fi
8、nish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range -0.5 V dc minimum to +7.0 V dc maximum Input voltage range . -0.5 V dc to +7.0 V dc Input current range -30 mA to +5.0 mA Voltage applied to output in HIGH output state . -0.5 V to +VCCCurrent appli
9、ed to output in LOW output state: B0-B7 +260 mA A0-A7 40 mA Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Maximum power dissipation (PD) 1/ . +743 mW Junction temperature (TJ) . +150C 1.4 Recommen
10、ded operating conditions. Minimum high level input voltage (VIH) 2.0 V dc Case operating temperature range (TC) -55C to +125C Maximum low level input voltage (VIL) . 0.8 V dc Supply voltage (VCC) . +4.5 V dc minimum to +5.5 V dc maximum _ 1/ Maximum power dissipation is defined as VCCx ICC, and must
11、 withstand the added PDdue to short circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89722 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2
12、234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation o
13、r contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE
14、 HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia,
15、PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained
16、. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified
17、manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Man
18、agement (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify
19、 when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal conne
20、ctions. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Test circuit and switching waveforms. Test circuit and switching waveforms shall be as specified on figure 3. 3.3 Electrical performance characteristics. Un
21、less otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical test
22、s for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89722 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3.5
23、Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacture
24、r has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in
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