DLA SMD-5962-88648 REV E-2002 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY QUADRUPLE DIFFERENTIAL LINE DRIVER MONOLITHIC SILICON《硅单片四倍差动线路驱动器低功率肖特基促进双极化数字微电路》.pdf

《DLA SMD-5962-88648 REV E-2002 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY QUADRUPLE DIFFERENTIAL LINE DRIVER MONOLITHIC SILICON《硅单片四倍差动线路驱动器低功率肖特基促进双极化数字微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-88648 REV E-2002 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY QUADRUPLE DIFFERENTIAL LINE DRIVER MONOLITHIC SILICON《硅单片四倍差动线路驱动器低功率肖特基促进双极化数字微电路》.pdf（14页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change footenote 1/ in 1.4. Change limits for ICC. Change conditions and limits for propagation delays and transition times. Change figures 3, 5, and 6 for load capacitance. Delete subgroups 10 and 11 from table I and table II. 92-02-10 M. A. Fry

2、e B Changes in accordance with NOR 5962-R039-95. 94-11-29 M. A. Frye C Changes in accordance with NOR 5962-R194-96 96-08-21 Raymond Monnin D Incorporate revisions B and C N.O.R.s. Update drawing to current requirements. Editorial changes throughout. - drw 01-08-10 Raymond Monnin E Sheet 2, change ge

3、neric part number. - drw 02-03-14 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED REV SHET REV SHET REV STATUS REV E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUI

4、T DRAWING CHECKED BY Ray Monnin COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY D. A. DiCenzo MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY, QUADRUPLE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-08-17 D

5、IFFERENTIAL LINE DRIVER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-88648 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E296-02 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitt

6、ed without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88648 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B micr

7、ocircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88648 01 E A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type. The device type identify t

8、he circuit function as follows: Device type Generic number Circuit function 01 55ALS194 Quadruple differential line driver with three-state outputs 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E

9、 GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat pack 2 CQCC1-N20 20 square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range -0.5 V dc minimum to +7.0 V dc maximum Input v

10、oltage range . -1.5 V dc at 18 mA to +5.5 V dc Maximum power dissipation (PD) 1/. 1380 mW Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ). +150C 1.4 Recommended operating conditions. Supply voltage range (VCC). 4.

11、5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH): Data inputs 2.0 V dc Enable TC= +25C 2.0 V dc Enable TC= -55C, +125C 2.1 V dc Maximum low level input voltage (VIL): TC= -55C, +25C 0.8 V TC= +125C 0.7 V Maximum high level output current (IOH). -20.0 mA Maximum low level out

12、put current (IOL): TC= +25C 48.0 mA TC= -55C, +125C 20.0 mA Case operating temperature range (TC) . -55C to +125C 1/ For operation above 25C free-air temperature, derate linearly at 11.0 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD

13、MICROCIRCUIT DRAWING SIZE A 5962-88648 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this dra

14、wing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-3853

15、5 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Draw

16、ings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of

17、a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual i

18、tem requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted trans

19、itional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requireme

20、nts herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, constructi

21、on, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on

22、 figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3. 3.2.5 Driver VODand VOC. The driver VODand VOCshall be as specified on figure 4. Provided by IHSNot for ResaleNo reproduction or networking per

23、mitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88648 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance charac

24、teristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking

25、 shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages where marking of the entire SMD PIN number is not feasible due to space l

26、imitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or

27、“QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certifi

28、cate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38

29、535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix A. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain

30、the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL

31、-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition B or

32、D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the

33、intent specified in test method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for

34、 ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88648 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions

35、-55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxHigh level output voltage VOHVCC= 4.5 V, VIL= see 1.4 herein, IOH= -20 mA, VIH= see 1.4 1, 2, 3 All 2.4 V Low level output voltage VOLIOL= maximum, see 1.4 VCC= 4.5 V, VIL= see 1.4 herein, VIH= see 1.4 1, 2, 3

36、All 0.5 V Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA 1, 2, 3 All -1.5 V Output voltage VOUTVCC= 4.5 V to 5.5 V, IOUT= 0.0 mA 1, 2, 3 All 0 6 V Differential output voltage (absolute magnitude) |VOD1| VCC= 4.5 V to 5.5 V, IOUT= 0.0 mA 1, 2, 3 All 2 6 V |VOD2| VCC= 4.5 V to 5.5 V, 1/ RL= 100, IOUT=

37、 0.0 mA 1, 2, 3 All 2 V Change in magnitude of differential output voltage (absolute magnitude) |VOD| 1, 2, 3 All 0.4 V Common-mode output voltage VOC1, 2, 3 All 3.0 V Change in magnitude of common-mode output voltage (absolute magnitude) |VOC| VCC= 4.5 V to 5.5 V, 2/ RL= 100, IOUT= 0.0 mA, See figu

38、re 4 1, 2, 3 All 0.4 V Output current with power off IO VOUT= 6.0 V, VCC= 0.0 V 1, 2, 3 All 100 A VOUT= -0.25 V, VCC= 0.0 V -100 Output current, high impedance state IOZVOUT= 2.7 V 1, 2, 3 All 100 A VCC= 5.0 V, Output enables = 0.8 V VOUT= 0.5 V -100 High level input current IIH1VIN= 5.5 V, VCC= 5.5

39、 V 1, 2, 3 All 100 A IIH2VIN= 2.7 V, VCC= 5.5 V 50 Low level input current IILVIN= 0.5 V, VCC= 5.5 V 1, 2, 3 All -200 A Short circuit output current IOSVIN= 2.0 V, VCC= 5.5 V, VOUT= 0.0 V 3/ 1, 2, 3 All -40 -140 mA Supply current (all drivers) ICCAll outputs disabled VCC= 5.5 V 1, 2, 3 All 45 mA Fun

40、ctional tests See 4.3.1c 7, 8 All See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88648 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 6 DSCC FO

41、RM 2234 APR 97 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxPropagation delay time, tPLH9 All 14 nsInput to output tPHL 9 All 22 ns Output-to-output skew tSK VCC= 5.0 V, C

42、L= 50 pF 4/ RL= 200, TC= +25C, See figure 6 9 All 6 ns Differential output transition time tTDVCC= 5.0 V, CL= 50 pF 4/ RL= 100, TC= +25C, See figure 5 9 All 22 ns Output enable time, tPZH9 All 15 nsInput to output tPZLAll 21 nsOutput disable time, tPHZ9 All 17 ns Input to output tPLZVCC= 5.0 V, CL=

43、50 pF 4/ RL= 200, TC= +25C, See figure 6 9 All 19 ns 1/ |VOD2| = |VOD1|, but cannot be 2 V. 2/ |VOD| and |VOC| are the changes in magnitude of VODand VOC, respectively, that occur when the input is changed from a high level to a low level. 3/ Not more than one output should be shorted at one time, a

44、nd the duration of the short circuit condition shall not exceed one second. 4/ Propagation delay time testing may be performed using either CL= 15 pF or CL= 50 pF. However, the manufacturers must certify and guarantee that the microcircuit meets the switching test limits specified for 50 pF load. Pr

45、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88648 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines E and F 2 Terminal numb

46、er Terminal symbol 1 1A NC 2 1Y 1A 3 1Z 1Y 4 1, 2EN 1Z 5 2Z 1, 2EN 6 2Y NC 7 2A 2Z 8 GND 2Y 9 3A 2A 10 3Y GND 11 3Z NC 12 3, 4EN 3A 13 4Z 3Y 14 4Y 3Z 15 4A 3, 4EN 16 VCCNC 17 - - - 4Z 18 - - - 4Y 19 - - - 4A 20 - - - VCCNC = No connection FIGURE 1. Terminal connections. Outputs Input Output enable Y

47、 Z H H H L L H L H X L High impedance High impedance H = TTL high level, L = TTL low level, X = irrelevant FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88648 DEFENSE SUPPLY CENTER CO

48、LUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. FIGURE 4. Driver VODand VOC. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88648 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 9 DSCC FORM 2234 APR 97 Test circuit NOTE: CLincludes probe and stray capacitance. Voltage waveforms FIGURE 5. Differential output transition times. Provided by IHSNot for ResaleNo reproduction or networking permitted wit