DLA SMD-5962-77033 REV D-2008 MICROCIRCUIT LINEAR CMOS OPERATIONAL AMPLIFIER MONOLITHIC SILICON《单片硅运算放大器CMOS线性微电路》.pdf
《DLA SMD-5962-77033 REV D-2008 MICROCIRCUIT LINEAR CMOS OPERATIONAL AMPLIFIER MONOLITHIC SILICON《单片硅运算放大器CMOS线性微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-77033 REV D-2008 MICROCIRCUIT LINEAR CMOS OPERATIONAL AMPLIFIER MONOLITHIC SILICON《单片硅运算放大器CMOS线性微电路》.pdf(8页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Page 2: Corrected thermal resistance. Page 4: Corrected table I. Page 7: Corrected table II. Page 9: Corrected P/N suffix. 79-01-23 N. A. HAUCK B Page 9: Device 01 inactive. No approved source of supply. 86-06-25 D. A. DiCENZO C Changes in accord
2、ance with NOR 5962-R171-96. 96-07-10 M. A. FRYE D Drawing updated to reflect current requirements. Redrawn. -rrp 08-03-25 R. HEBER THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 PMIC N/A
3、PREPARED BY A. J. FOLEY DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY C. R. JACKSON COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. HAUCK MICROCIRCUIT, LINEAR, CMOS, OPERATIONAL AMPLIFIER, MONOLITHIC SI
4、LICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 77-09-26 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 14933 77033 SHEET 1 OF 7 DSCC FORM 2233 APR 97 5962-E041-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUI
5、T DRAWING SIZE A 77033 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1
6、.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 77033 01 G X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number
7、Circuit function 01 CA3130BT Operational amplifier 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style G MACY1-X8 8 Can 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix
8、 A. 1.3 Absolute maximum ratings. Supply voltage range between V+ and V-. +16 V dc maximum Input voltage, differential-mode . 8 V dc Storage temperature range. -65C to +150C Power dissipation, PD630 mW 1/ 2/ Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) .
9、 40C/W Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Ambient operating temperature range (TA) -55C to +125C 1/ Must withstand the added PDdue to short-circuit test (e.g., IOS). 2/ No heat sink. Derate linearly 6.67 mW/C for TA 55C. Provided by IHSNot for ResaleNo reproducti
10、on or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77033 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following spe
11、cification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General
12、Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawi
13、ngs. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the
14、text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall
15、be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification t
16、o MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modif
17、ications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimens
18、ions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections and functional diagram. The terminal connections and functional diagram sha
19、ll be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical te
20、st requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN ma
21、y also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identif
22、y when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77033 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.6 Certificate of
23、compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturer
24、s product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Not
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