DLA MIL-STD-1580 B CHANGE 3-2013 DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC ELECTROMAGNETIC AND ELECTROMECHANICAL PARTS.pdf
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1、 AMSC N/A FSC 59GP DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. MIL-STD-l580B w/CHANGE 3 DRAFTSUPERSEDING MIL-STD-l580B CHANGE 2 15 November 2013 DEPARTMENT OF DEFENSE TEST METHOD STANDARD DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTRO
2、MECHANICAL PARTS METRIC Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1580B w/CHANGE 3 ii FOREWORD 1. This standard is approved for use by all Departments and Agencies of the Department of Defense. 2. To ensure the required high quality of
3、parts used in the designs of space and launch vehicles, stringent in-process controls are imposed and a comprehensive test program is conducted on the completed parts. A key ingredient of the test program is the assessment of part lot quality based on the destructive examination of samples randomly
4、selected from each production lot. The destructive physical analysis (DPA) is used to inspect and verify the internal design, materials, construction, and workmanship of the part. It can also be used to monitor processes, for failure analysis, or to suggest corrective actions. The information derive
5、d from the DPA may be used: a. To preclude installation of parts having patent or latent defects; b. To aid in dispositioning parts that exhibit anomalies; c. To aid in defining improvement changes in design, materials, or processes; d. To evaluate supplier production trends. 3. Beneficial comments
6、(recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: DLA Land And Maritime ATTN: DLA Land and Maritime-VAT P.O. Box 3990 Columbus, Ohio 43218-3990 Since contact information can change, you may want to verify the currenc
7、y of this address information using the ASSIST Online database at https:/assist.dla.mil. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1580B w/CHANGE 3 iii SUMMARY OF CHANGE 3 MODIFICATIONS 1. Changed http:/assist.daps.dla.mil to https:/ass
8、ist.dla.mil. 2 Changed http:/assist.daps.dla.mil/quicksearch to http:/quicksearch.dla.mil. 3 Changed paragraph 18.5 to include Thick and Thin Film 4 Changed paragraph 18.5.1.1 to include defects called out in paragraph 18.5.3. 5 Add new paragraph 18.5.1.2, Sample Preparation. 6 Modified paragraph 18
9、.5.3 to be in accordance with MIL-PRF-55342. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1580B w/CHANGE 3 iv CONTENTS PARAGRAPH PAGE 1. SCOPE. 1 1.1 Purpose 1 1.2 Application of the standard. 1 2. APPLICABLE DOCUMENTS 1 2.1 General . 1 2.
10、2 Government documents 1 2.2.1 Specifications, standards, and handbooks. 1 2.2.2 Government documents, drawings, and publications. 3 2.3 Non-Government publications. 4 2.4 Order of precedence 4 3. DEFINITIONS 4 3.1 Contracting officer 4 3.2 Defect. 4 3.3 Destructive physical analysis. 4 3.4 Lot-rela
11、ted defect 4 3.5 Production lot (electronic parts). 4 3.6 Screenable defect . 4 3.7 Calibration 4 3.8 Acronyms. 5 3.9 Recycled, recovered, or environmentally preferable materials 5 4. GENERAL REQUIREMENTS 5 4.1 Sample size 5 4.1.1 DPA for a lot conformance test. 5 4.1.1.1 DPA sample criteria. 5 4.1.
12、1.2 Parallel tests 5 4.1.1.3 Combined samples 5 4.1.1.4 Utilization of rejects 5 4.1.2 Resampling . 5 4.2 DPA procedures. 6 4.2.1 Baseline sketch. 6 4.2.2 DPA data records 6 4.2.3 Test and inspection methods 6 4.2.3.1 External visual 6 4.2.4 Evaluation criteria 6 4.3 Radiography. 8 4.4 Disassembly a
13、nd sample preparation 8 4.4.1 Delidding. 8 4.4.2 Sectioned samples 8 4.4.3 Scanning Electron Microscopy samples. 8 4.5 Photographs/imagery 8 4.6 DPA residues/samples. 8 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1580B w/CHANGE 3 v PARAGR
14、APH PAGE 5. DETAILED REQUIREMENTS. 10 5.1 Detailed requirements 10 6. NOTES 10 6.1 Intended use 10 6.2 Tailored application 10 6.3 Documentation. 10 6.4 Subject term (key word) listing. 10 6.5 Changes from the previous issue. 10 FIGURE PAGE 4-1 Sample DPA summary sheet. 7 4-2 Example of flat pack de
15、lidding vise 9 REQUIREMENT 9 Detail requirements for prohibited materials analysis and incoming inspection of external package plating materials using X-ray fluorescence spectrometry or scanning electron microscopy with energy dispersive spectroscopy. 10 Detailed requirements for capacitors. 11 Deta
16、iled requirements for connectors. 12 Detailed requirements for quartz crystals. 13 Detailed requirements for diodes. 14 Detailed requirements for feed-through filters. 15 Detailed requirements for magnetic devices (inductors, transformers, and coils). 16 Detailed requirements for microcircuits (mono
17、lithic, hybrid, optocoupler, and multichip module). 17 Detailed requirements for relays. 18 Detailed requirements for resistors. 19 Detailed requirements for switches. 20 Detailed requirements for thermistors. 21 Detailed requirements for transistors. 22 Detailed requirements for selected RF devices
18、. 23 Detailed requirements for fuses. 24 Detailed requirements for heaters. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1580B w/CHANGE 3 1 1. SCOPE 1.1 Scope. This standard describes the general requirements for performance of destructive
19、 physical analysis (DPA) on samples of parts. In addition to the requirements for the analysis procedures, the general criteria for interpreting results, such as for the acceptance or rejection of associated production lots, is included for typical electronic, electromagnetic, and electromechanical
20、parts. 1.2 Application of the standard. This standard; is intended to be referenced, in detailed part specifications; or in other documents where DPA requirements are imposed, to assure that the practices, procedures, and criteria contained herein are uniformly applied. The requirements are intended
21、 to provide the general framework and basis for detailed DPA procedures for specific part types. 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, and 5 of this standard. This section does not include documents cited in other sections of this s
22、tandard or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements documents cited in sections 3, 4, and 5 of this standard, whether or not they are li
23、sted. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Departmen
24、t of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATIONS DEPARTMENT OF DEFENSE MIL-PRF-20 - Capacitor, Fixed, Ceramic Dielectric (Temperature Compensating), Established Reliability and Non-Established Reliability, General
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