DLA DSCC-VID-V62 09646-2010 MICROCIRCUIT LINEAR FAIL SAFE RS-485 RS-422 TRANSCEIVER MONOLITHIC SILICON.pdf

《DLA DSCC-VID-V62 09646-2010 MICROCIRCUIT LINEAR FAIL SAFE RS-485 RS-422 TRANSCEIVER MONOLITHIC SILICON.pdf》由会员分享，可在线阅读，更多相关《DLA DSCC-VID-V62 09646-2010 MICROCIRCUIT LINEAR FAIL SAFE RS-485 RS-422 TRANSCEIVER MONOLITHIC SILICON.pdf（14页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONSLTR DESCRIPTION DATE APPROVEDPrepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY-MM

2、-DD CHECKED BY RAJESH PITHADIA TITLE MICROCIRCUIT, LINEAR, FAIL SAFE, RS-485/RS-422 TRANSCEIVER, MONOLITHIC SILICON 10-01-26 APPROVED BY CHARLES F. SAFFLE SIZE A CODE IDENT. NO. 16236 DWG NO. V62/09646 REV PAGE 1 OF 14 AMSC N/A 5962-V003-10 Provided by IHSNot for ResaleNo reproduction or networking

3、permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09646 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a +3.3 V, fail safe, RS-485/RS-422 transceiver microcircuit, with an operating tempera

4、ture range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/09646 - 01 X B Drawing Device t

5、ype Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 1/ MAX3077EMSA/PR +3.3 V fail safe RS-485 / RS-422 transceiver 02 2/ MAX3077EMSA/PR2 +3.3 V fail safe RS-485 / RS-422 transceiver 1.2.2 Case outline(s). The case outl

6、ine(s) are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 8 MS-012-AA Plastic small outline1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-le

7、ad plateC Gold plateD PalladiumE Gold flash palladium Z Other _ 1/ Device type 01 100% burn-in and 100% testing at room, hot, and cold temperatures. 2/ Device type 02, 100% testing at room, hot, and cold temperatures. Provided by IHSNot for ResaleNo reproduction or networking permitted without licen

8、se from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09646 REV PAGE 3 1.3 Absolute maximum ratings. 3/ 4/ Supply voltage (VCC) . +6 V Driver input voltage (DI) . -0.3 V to +6 V Driver output voltage (Z, Y) -8 V to +13 V Receiver input voltage (A, B)

9、-8 V to +13 V Receiver output voltage (RO) . -0.3 V to (VCC+ 0.3 V) Driver output current 250 mA Junction temperature (TJ) +150C Storage temperature range (TSTG) -65C to +150C Lead temperature (soldering, 10 seconds) . +300C 1.4 Recommended operating conditions. 5/ Supply voltage range (VCC) . +3.3

10、V 10% Operating free-air temperature range (TA) . -55C to +125C 1.5 Thermal data table. Case outline letter X X Unit PC board Single layer Multi-layer 6/ Power dissipation (PD), maximum at +70C 471 606 mW Power dissipation (PD) derating above +70C 5.9 7.6 mW/C Thermal resistance, junction to case (J

11、C) 40 38 C/W Thermal resistance, junction to ambient (JA) 170 132 C/W 3/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicate

12、d under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 4/ All voltages referenced to GND. 5/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk.

13、 The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. 6/ Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal consi

14、derations, refer to www.maxim- Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09646 REV PAGE 4 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlin

15、es for Semiconductor Devices JEDEC JESD51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIR

16、EMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the

17、manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The

18、design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Truth table. The truth table shall be as shown

19、in figure 3. 3.5.4 Driver DC test load. The driver DC test load shall be as shown in figure 4. 3.5.5 Driver timing test circuit. The driver timing test circuit shall be as shown in figure 5. 3.5.6 Driver propagation delay waveforms. The driver propagation delay waveform shall be as shown in figure 6

20、. 3.5.7 Receiver timing test circuit. The receiver timing test circuit shall be as shown in figure 7. 3.5.8 Receiver propagation delay waveforms. The receiver propagation delay waveforms shall be as shown in figure 8. Provided by IHSNot for ResaleNo reproduction or networking permitted without licen

21、se from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09646 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions 2/ VCC= 3.3 V 10% unless otherwise specifiedTemperature, TA Device type Limits Unit Min Max Driver sectio

22、n. Differential driver output VODRL= 100 (RS422), see figure 4 -55C to +125C 01, 02 2 VCCV RL= 54 (RS485), see figure 4 1.5 VCCNo load VCCChange in magnitude of differential output voltage VODRL= 100 or 54 , 3/ see figure 4 -55C to +125C 01, 02 0.2 V Driver common mode output voltage VOCRL= 100 or 5

23、4 , see figure 4 -55C to +125C 01, 02 3 V Change in magnitude of common mode voltage VOCRL= 100 or 54 , 3/ see figure 4 -55C to +125C 01, 02 0.2 V Input high voltage VIHDI -55C to +125C 01, 02 2 V Input low voltage VILDI -55C to +125C 01, 02 0.8 V Input hysteresis VHYSDI, VCC= 3.3 V +25C 01, 02 100

24、typical mV Input current IIN1DI -55C to +125C 01, 02 1 A Driver short circuit output current IOSD0 V VOUT 12 V 4/ -55C to +125C 01, 02 40 250 mA -7 V VOUT VCC4/ -250 -40 Driver short-circuit foldback output current IOSDF(VCC 1 V) VOUT 12 V 4/ -55C to +125C 01, 02 20 mA -7 V VOUT 1 V 4/ -20 Thermal-s

25、hutdown threshold TTSVCC= 3.3 V +25C 01, 02 175 typical C Thermal-shutdown hysteresis TTSHVCC= 3.3 V +25C 01, 02 15 typical C See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHI

26、O SIZE A CODE IDENT NO. 16236 DWG NO. V62/09646 REV PAGE 6 TABLE I. Electrical performance characteristics Continued. 1/ Test Symbol Conditions 2/ VCC= 3.3 V 10% unless otherwise specifiedTemperature, TA Device type Limits Unit Min Max Receiver section. Receiver differential threshold voltage VTH-7

27、V VCM 12 V -55C to +125C 01, 02 -200 -50 mV Receiver input hysteresis VTHVA+ VB= 0 V, VCC= 3.3 V +25C 01, 02 15 typical mV Receiver output (RO) high voltage VOHIO= -1 mA -55C to +125C 01, 02 VCC 0.6 V Receiver output (RO) low voltage VOLIO= 1 mA -55C to +125C 01, 02 0.4 V Receiver input resistance R

28、IN-7 V VCM 12 V -55C to +125C 01, 02 96 k Receiver output short-circuit current IOSR0 V VRO VCC-55C to +125C 01, 02 80 mA Supply current section. Supply current ICCNo load -55C to +125C 01, 02 1.5 mA Electrostatic discharge (ESD) protection section. ESD protection for Y, Z, A, and B Human body model

29、, VCC= 3.3 V +25C 01, 02 15 typical kV Driver switching characteristics section. Driver propagation delay tDPLHCL= 50 pF, RL= 54 , -55C to +125C 01, 02 50 ns tDPHLsee figures 5 and 6 50 Driver differential output rise or fall time tDR, tDFCL= 50 pF, RL= 54 , see figures 5 and 6 -55C to +125C 01, 02

30、15 ns Differential driver output skew | tDPLH tDPHL| tDSKEWCL= 50 pF, RL= 54 , see figures 5 and 6 -55C to +125C 01, 02 8 ns Maximum data rate -55C to +125C 01, 02 16 Mbps See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,

31、-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09646 REV PAGE 7 TABLE I. Electrical performance characteristics Continued. 1/ Test Symbol Conditions 2/ VCC= 3.3 V 10% unless otherwise specifiedTemperature, TA Device type Limits Unit Min Max Receiver switching

32、 characteristics section. Receiver propagation delay tRPLHCL= 15 pF, see figures 7 and 8 -55C to +125C 01, 02 75 ns tRPHL75Receiver output skew | tRPLH tRPHL| tRSKEWCL= 15 pF, see figures 7 and 8 -55C to +125C 01, 02 8 ns Maximum data rate -55C to +125C 01, 02 16 Mbps 1/ Testing and other quality co

33、ntrol techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific parametric testing, produc

34、t performance is assured by characterization and/or design. 2/ All currents into the device are positive. All currents out of the device are negative. All voltages are referred to device ground, unless otherwise noted. 3/ VODand VOCare the changes in VODand VOC, respectively, when the driver input (

35、DI) changes state. 4/ The short-circuit output current applies to peak current just prior to foldback current limiting. The short-circuit foldback output current applies during current limiting to allow a recovery from bus contention. Provided by IHSNot for ResaleNo reproduction or networking permit

36、ted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09646 REV PAGE 8 Case X FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS CO

37、LUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09646 REV PAGE 9 Case X continued. Symbol Dimensions Inches Millimeters Min Max Min Max A 0.053 0.069 1.35 1.75 A1 0.004 0.010 0.10 0.25 b 0.014 0.019 0.35 0.49 c 0.007 0.010 0.19 0.25 D 0.189 0.197 4.80 5.00 E 0.150 0.157 3.80 4.00 E1 0.228 0.244

38、 5.80 6.20 e 0.050 BSC 1.27 BSC L 0.016 0.050 0.40 1.27 n 8 8 NOTES: 1. Controlling dimensions are millimeters, inch dimensions are given for reference only. 2. Dimensions D and E do not include mold flash. 3. Mold flash or protrusion not to exceed 0.15 mm (0.006 inch). 4. Leads to be coplanar withi

39、n 0.10 mm (0.004 inch). 5. Falls within reference to JEDEC MS-012-AA. FIGURE 1. Case outline - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09646 REV

40、 PAGE 10 Device types 01 and 02 Case outline X Terminal number Terminal symbol Function 1 VCCPositive supply VCC= 3.3 V 10%. Bypass VCCto GND with a 0.1 F capacitor. 2 RO Receiver output. If (A B) -50 mV, RO is high; if (A B) 200 mV, RO is low. 3 DI Driver input . A low on DI forces the noninverting

41、 output low and the inverting output high. Similarly, a high on DI forces the noninverting output high and the inverting output low. 4 GND Ground. 5 Y Noninverting driver output. 6 Z Inverting driver output. 7 B Inverting receiver input. 8 A Noninverting receiver input. FIGURE 2. Terminal connection

42、s. Transmitting Input Outputs DI Z Y 1 0 1 0 1 0 Receiving Inputs Output A, B RO -50 mV 1 -200 mV 0 Open/shorted 1 FIGURE 3. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT

43、 NO. 16236 DWG NO. V62/09646 REV PAGE 11 FIGURE 4. Driver dc test load. FIGURE 5. Driver timing test circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09646

44、 REV PAGE 12 FIGURE 6. Driver propagation delay waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09646 REV PAGE 13 FIGURE 7. Receiver timing test circuit

45、. FIGURE 8. Receiver propagation delay waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09646 REV PAGE 14 4. VERIFICATION 4.1 Product assurance requireme

46、nts. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicab

47、le. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturers standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based