DLA DSCC-DWG-84035 REV D-2008 DELAY LINES PASSIVE 10-TAP DUAL-IN-LINE 16-PIN.pdf

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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Delete group C inspection. Add additional sources of supply. Change dimensioning method and dimension of standoff. Add additional terminal material and tolerances. Change attenuation and distortion. 21 Jan 1987 Randy Larson B Added additional sources of sup

2、ply. Changed MIL-D-23859 references to MIL-PRF-83531. Deleted requirement for group B inspection. Changed several requirements in section 3 and several attenuation measurements in table I. 12 Apr 1989 Randy Larson C Changed 3.8. Added note 4 to figure 1. Added vendor 16714. Deleted vendors 00213 and

3、 56289. Editorial changes throughout. 4 Jan 1993 D. Moore D Editorial changes and updates made throughout. 17 Jun 2008 Michael A. Radecki Prepared in accordance with ASME Y14.100 Source control drawing REV D D D D D D D D D D D D D REV STATUS OF PAGES PAGES 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PRE

4、PARED BY Dan McGrath DESIGN ACTIVITY DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OH 45444-5000 CHECKED BY Randy Larson APPROVED BY Ivan R. Jones TITLE DELAY LINES, PASSIVE, 10-TAP, DUAL-IN-LINE, 16-PINSIZE A CODE IDENT. NO. 14933 DWG NO. 84035 Original date of drawing 2 Jul 1984 REV D PAGE 1 OF 13 AMS

5、C N/A 5999-E218CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84035 DEFENSE ELECTRONICS SUPPLY CEN

6、TER DAYTON, OHIO SIZE A REV D SHEET 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a family of passive delay lines with 16 pins and 10 taps. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example: 84035 -01 Drawing number Dash number 2. A

7、PPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been m

8、ade to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following spe

9、cifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-DTL-31000 - Technical Data Packages. MIL-DTL-19491 -

10、Semiconductor Device, Packaging of. MIL-PRF-55681 - Capacitor, Chip, Multiple Layer, Fixed , Ceramic Dielectric, Established Reliability, and Non- Established Reliability General Specification for. MIL-PRF-83531 - Delay Lines, Passive, General Specification for. DEPARMENT OF DEFENSE STANDARDS MIL-ST

11、D-202 - Test Method Standard, Electronic and Electrical Component Parts. MIL-STD-1276 - Leads for Electronic Component Parts. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil/ or from the Standardization Document Order Desk, 700 R

12、obbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations u

13、nless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84035 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV D SHEET 3 NOTES: 1. Dimensions are in inches. 2. Metric equival

14、ents are given for general information only. 3. Pins 7, 9, and 10 are not connected. 4. Leads shall be free of case meniscus and other foreign material and shall be solderable for a minimum of .010 inch above the seating plane of the delay line. FIGURE 1. Design and dimensions. Inches mm .002 0.05 .

15、003 0.08 .010 0.25 .015 0.38 .018 0.46 .070 1.78 .075 1.90 .100 2.54 .125 3.18 .200 5.08 .280 7.11 .300 7.62 .310 7.87 .350 8.89 .700 17.78 .880 22.35 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84035 DEFENSE ELECTRON

16、ICS SUPPLY CENTER DAYTON, OHIO SIZE A REV D SHEET 4 3. REQUIREMENTS 3.1 Item requirements. This drawing shall be interpreted in accordance with MIL-DTL-31000. 3.2 Case material. Material shall be molded epoxy and shall be in accordance with MIL-PRF-83531. 3.3 Design and dimensions. See figure 1. 3.4

17、 Terminals. Terminal material and finish shall be in accordance with MIL-PRF-83531. 3.5 Temperature coefficient of delay. See table I. 3.6 Characteristic impedance. See table I. 3.7 Capacitors. Chip capacitors shall have been tested and supplied in accordance with MIL-PRF-55681. 3.8 Total delay time

18、. See table I. 3.9 Attenuation. See table I. 3.10 Rise time. Rise time shall be 20 percent of nominal total delay time, maximum. 3.11 Distortion. 10 percent maximum at output. 3.12 Thermal shock. Method 107, MIL-STD-202, test condition B, 5 minutes at temperature extremes and in accordance with MIL-

19、PRF-83531. 3.13 Dielectric withstanding voltage. Method 105 of MIL-STD-202, test condition C, 50 V dc in accordance with MIL-PRF-83531. 3.14 Insulation resistance. Method 302, test condition A, MIL-STD-202, 100 megohms minimum and in accordance with MIL-PRF-83531. 3.15 Seal. As specified in MIL-PRF-

20、83531. 3.16 Terminal strength. Method 211, MIL-STD-202, test condition C, and in accordance with MIL-PRF-83531, applied force five pounds. 3.17 Vibration. Method 214, MIL-STD-202, test condition IK, 15 minutes, and in accordance with MIL-PRF-83531. 3.18 Shock. Method 213, MIL-STD-202, test condition

21、 I, and in accordance with MIL-PRF-83531. 3.19 Immersion. Method 104, test condition A, MIL-STD-202. Measurement - insulation resistance. 3.20 Moisture resistance. As specified in MIL-PRF-83531. 3.21 Solderability. As specified in MIL-PRF-83531. 3.22 Resistance to solvents. As specified in MIL-PRF-8

22、3531. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84035 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV D SHEET 5 3.23 Operating temperature. -55C to +125C. 3.24 Storage temperature. -65C to +130C. 3.25 Recy

23、cled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible, provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life

24、cycle costs. 3.26 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-83531 Qualified Product List for at least one part, or perform the Group A inspection specified herein on a sample of parts agreed upon by the manufac

25、turer and DSCC-VA. 3.27 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be an approved source of supply. 3.28 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin shall be alloyed w

26、ith a minimum of 3 percent lead, by mass (see 6.3). 3.29 Marking. Marking shall be in accordance with MIL-PRF-83531 except the PIN shall be in accordance with 1.2 herein. The “M83531/XX-XXX“ PIN and the “JAN“ or “J“ marking shall not apply. 3.30 Workmanship. Parts shall be free of flash pits, voids,

27、 and excessive mold marks. Visible parting line is acceptable. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84035 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV D SHEET 6 TABLE I. PINs and electrical charact

28、eristics. DESC PIN 1/ 84035- Total delay (ns) 5 percent Impedance () 5 percent Resistance () Max Attenuation (percent) max Temperature coefficient of delay (ppm) max 01 02 03 04 05 20 25 30 40 45 50 50 50 50 50 1.5 1.5 1.5 2.0 2.0 3.0 3.0 3.0 4.0 5.0 100 100 100 100 100 06 07 08 09 10 50 60 75 100 1

29、0 50 50 50 50 100 1.5 1.5 1.8 2.0 1.5 5.0 5.0 5.0 5.0 3.0 100 100 100 100 100 11 12 13 14 15 20 30 40 50 60 100 100 100 100 100 1.5 1.5 1.8 2.0 3.0 3.0 3.0 5.0 5.0 5.0 100 100 100 100 100 16 17 18 19 20 80 90 100 120 150 100 100 100 100 100 3.5 3.5 4.0 4.0 5.0 5.0 5.0 5.0 10.0 10.0 100 100 100 100 1

30、00 21 22 23 24 25 26 200 250 20 40 60 80 100 100 200 200 200 200 6.0 7.0 3.0 4.0 4.5 5.5 10.0 10.0 5.0 5.0 5.0 5.0 100 100 100 100 100 100 27 28 29 30 31 100 120 160 180 200 200 200 200 200 200 6.0 6.5 7.0 8.5 9.0 5.0 10.0 10.0 10.0 10.0 100 100 100 100 100 32 33 34 35 36 240 300 400 50 75 200 200 2

31、00 250 250 9.5 16.0 16.0 5.5 6.0 10.0 10.0 10.0 5.0 5.0 100 100 100 100 100 See footnote at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84035 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV D S

32、HEET 7 TABLE I. PINs and electrical characteristics - Continued. DESC PIN 84035- 1/ 2/ Total delay (ns) 5 percent Impedance () 10 percent Resistance () max Attenuation (percent) max Temperature coefficient of delay (ppm) max 37 38 39 40 41 100 125 150 200 225 250 250 250 250 250 7.0 8.0 8.5 10.0 11.

33、0 5.0 10.0 10.0 10.0 10.0 100 100 100 100 100 42 43 44 45 46 300 375 500 30 60 250 250 250 300 300 17.0 20.0 24.0 5.0 6.0 10.0 10.0 10.0 5.0 5.0 100 100 100 100 100 47 48 49 50 51 52 90 125 150 180 240 270 300 300 300 300 300 300 7.0 8.0 9.0 11.0 16.0 18.0 5.0 10.0 10.0 10.0 10.0 10.0 100 100 100 10

34、0 100 100 53 54 55 56 57 360 450 600 40 80 300 300 300 400 400 21.0 25.0 40.0 8.5 9.0 10.0 10.0 10.0 5.0 5.0 100 100 100 100 100 58 59 60 61 62 120 160 200 240 320 400 400 400 400 400 9.0 16.0 18.0 20.0 26.0 10.0 10.0 10.0 10.0 10.0 100 100 100 100 100 63 64 65 66 67 360 480 600 800 50 400 400 400 4

35、00 500 28.0 38.0 45.0 40.0 6.0 6.0 9.0 10.0 10.0 5.0 100 100 100 100 100 See footnote at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84035 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV D SHEE

36、T 8 TABLE I. PINs and electrical characteristics - Continued. DESC PIN 84035- 1/ 2/ Total delay (ns) 5 percent Impedance () 10 percent Resistance () max Attenuation (percent) max Temperature coefficient of delay (ppm) max 68 69 70 71 72 100 150 200 250 300 500 500 500 500 500 10.0 16.0 30.0 18.0 26.

37、0 7.0 8.0 8.0 8.0 9.0 100 100 100 100 100 73 74 75 76 77 78 400 450 500 600 750 1000 500 500 500 500 500 500 42.0 45.0 55.0 58.0 50.0 65.0 10.0 10.0 10.0 10.0 10.0 11.0 100 100 100 100 100 200 1/ Delay between successive taps shall be 10 percent of the total delay time (nonaccumulative). 2/ The dela

38、y time referenced from the input shall have a tolerance of 1 ns or 5 percent, whichever is greater. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Unless otherwise specified, sampling and inspection procedures shall be performed in accordance with the group A inspection of MIL-PRF-8353

39、1. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in shall be in accordance with the provisions specified for semiconductor devices in MIL-DTL-19491, as well as the contract or order (see 6.2). When packaging of materiel is to be performed by D

40、oD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the militar

41、y services system commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES 6.1 Intended use. Devices conforming to this drawing are intended for

42、use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM application. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery of one c

43、opy of the conformance inspection data or certificate of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84035 DEFE

44、NSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV D SHEET 9 c. Requirements for packaging and packing. 6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day

45、 to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of t

46、in whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.4 Users of record. Coordination of this document for future revisions is coordinated only with the approved source(s) of supply and the users of record of this

47、document. Requests to be added as a recorded user of this drawing may be achieved online at mailto:relaydla.mil or if in writing to: Defense Supply Center, Columbus, ATTN: DSCC/VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-4481 or DSN 850-4481. 6.5 Approved source(s) o

48、f supply. Approved source(s) of supply are listed herein. Additional sources will be added as they become available. Assistance in the use of this drawing may be obtained online at mailto:relaydla.mil, or by contacting Defense Supply Center, Columbus, ATTN: DSCC-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-4481 or DSN 850-4481. Similar vendor PIN 1/ DESC PIN 84035- CAGE 22519 CAGE 00222 CAGE 16714 01 1519-Z435-1 22A08-1 SP035-01 02 1519-Z435-2 22A08-2 SP035-02 03 1519-Z435-3 22A08-3 SP035-03 04