DLA DESC-DWG-88027 REV E-2011 RESISTOR CHIP FIXED FILM STYLE 0504 [Use ARMY MIL-PRF-55342 2 J (2) ARMY MIL-PRF-55342 2J (1) ARMY MIL-PRF-55342 2J ARMY MIL-PRF-55342 2H (1) ARMY MIL.pdf

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1、 REVISIONS LT DESCRIPTION DATE APPROVED A Add new paragraph on resistance. Dimensional changes. Editorial changes throughout 7 JUL 89 D. Moore B Eliminate characteristic H. Add characteristic M. Change resistance range for characteristic K. Reword paragraph 4.8a. Change vendor PIN. Editorial changes

2、 throughout 1 OCT 93 D. Moore C Add vendor. Editorial changes throughout. 27 JAN 00 K. Cottongim D Add vendor, and expand resistance range for characteristics K and M. Editorial changes throughout. 8 SEP 05 K. Cottongim E Inactivation for new design. 11 MAR 11 M. Radecki Notice of Inactivation for N

3、ew Design DLA Land and Maritime drawing 88027 is inactive for new design and is no longer used, except for replacement purposes. Use MIL-PRF-55342/2. DRAFT Prepared in accordance with ASME Y14.100 Source control drawing REV STATUS OF PAGES REV E E E E E E E PAGES 1 2 3 4 5 6 7 PMIC N/A PREPARED BY A

4、llen R. Knox DESIGN ACTIVITY: DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO 45444-5000 Original date of drawing CHECKED BY David E. Moore TITLE RESISTOR, CHIP, FIXED, FILM, STYLE 0504 13 June 1988 APPROVED BY David E. Moore SIZE A CODE IDENT. NO. 14933 DWG NO. 88027 REV E PAGE 1 OF 7 AMSC N/A 5905-E

5、748 CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88027

6、REV E PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a fixed, film, chip, resistor, style 0504. 1.2 Part or Identifying Number (PIN). The complete PIN is as follows, and is available in a wrap around termination: 88027 - * * Drawing number Characteristic (3.3.6) Resistance (3

7、.3.1) 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort

8、has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The fol

9、lowing specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-55342 - Resistors, Chip, Fixed, Film, N

10、onestablished Reliability, Established Reliability, Space Level, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Method Standard, Electronic and Electrical Component Parts. MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified Produc

11、ts List (QPL) Systems for Electrical, Electronic and Fiber Optic Parts Specifications. MIL-STD-1285 - Marking of Electrical and Electronic Parts. * (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins

12、Avenue, Building 4D, Philadelphia, PA 19111-5094.) * 2.2 Order of precedence. Unless otherwise noted herein or in the event of a conflict between the text of this document and the references cited herein (except for related specification sheets), the text of this document takes precedence. Nothing i

13、n this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55342 and as specified herein. 3.2 Interface and physical dimensions. The re

14、sistor shall meet the interface, and physical dimensions as specified in MIL-PRF-55342 and herein (see figure 1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88027

15、REV E PAGE 3 ABCDETERMINAL BANDDimensions Inches Millimeters Min Max Min Max A .045 .060 1.14 1.40 B .035 .045 0.89 1.14 C .025 0.51 D .005 .017 0.18 0.43 E .004 .017 0.10 0.43 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. The pictorial view of

16、the styles above is given as representative of the envelope of the item. Slight deviations from the outline shown, which are contained within the envelope, and do not alter the functional aspects of the devices are acceptable. FIGURE 1. Chip resistor style RM0504. 3.3 Electrical characteristics. 3.3

17、.1 Resistance. The nominal resistance expressed in ohms is identified by four digits; the first three digits represent significant figures and the last digit specifies the number of zeros to follow. When the value of resistance is less than 100 ohms, or when fractional values of an ohm are required,

18、 the letter “R” shall be substituted for one of the significant figures. The resistance value designations are shown in table I. Minimum and maximum resistance values shall be as specified in 3.3.2. Resistance values not listed in “10 to 100” decade table of MIL-PRF-55342 for the appropriate resista

19、nce tolerance shall be considered as not conforming to the specification. The standard values for every decade shall follow the sequence demonstrated for the “10 to 100” decade table specified in MIL-PRF-55342. 3.3.2 Resistance range. The resistance range for characteristic “K” and “M” shall be 1 oh

20、m to 22 megohms. 3.3.3 Resistance tolerance. The resistance tolerance for chip resistors shall be (F) 1 percent. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88027 R

21、EV E PAGE 4 TABLE I. Resistance value designations. Designation Resistance ohms 1R00 to 9R76 10R0 to 97R6 1000 to 9760 1001 to 9761 1002 to 9762 1003 to 9763 1004 to 9764 1005 to 2205 1 to 9.76 10 to 97.6 100 to 976 1,000 to 9,760 10,000 to 97,600 100,000 to 976,000 1,000,000 to 9,760,000 10,000,000

22、 to 22,000,000 3.3.4 Power rating. The power rating for chip resistors shall be 0.125 watts at 70C derated to zero power at 150C (see figure 2). FIGURE 2. Derating curve. 3.3.5 Voltage rating. The maximum continuous working voltage shall not exceed 40 volts. 3.3.6 Resistance temperature coefficient

23、(RTC). The RTC shall not exceed 100 ppm/C for characteristic “K” and 300 ppm/C for characteristic “M”. 3.3.7 Termination. Termination material shall be in accordance with MIL-PRF-55342, code letter “B”. 3.3.8 DC resistance. When resistors are tested as specified in 4.6, the dc resistance shall be wi

24、thin the specific tolerance of the nominal resistance. 3.3.9 Thermal shock. When resistors are tested as specified in 4.7, there shall be no evidence of mechanical damage. 3.3.10 Power conditioning. When resistors are tested as specified in 4.8, there shall be no evidence of mechanical damage. The c

25、hange in resistance between the initial and final measurements shall not exceed (0.5 percent +0.01 ohm). 3.3.11 Solderability. When resistors are tested as specified in 4.9, they shall meet the criteria for surface mount leadless components in the test method. * 3.4 Pure tin. The use of pure tin, as

26、 an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.5 Marking. Marking of the individual chip resistors is not requ

27、ired; however, each unit package shall be marked in accordance with MIL-STD-1285 and include the PIN as specified herein (see 1.2), the manufacturers name or Commercial and Government Entity (CAGE) code, and date lot codes. Provided by IHSNot for ResaleNo reproduction or networking permitted without

28、 license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88027 REV E PAGE 5 3.6 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible prov

29、ided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. * 3.7 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-55342 Qualified Pro

30、ducts List for at least one part, or perform the group A and group B inspections specified herein on a sample agreed upon by the manufacturer and DLA Land and Maritime-VAT. * 3.7.1 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be listed as

31、an approved source of supply. 3.8 Workmanship. Resistors shall be uniform in quality and free from defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in accordance with M

32、IL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.3 Product level qualification. The product level qualification specified in MIL-PRF-55342 is not applicable to this document. 4.4 Conformance inspection. 4.4.1

33、Inspection of product for delivery. Inspection of product for delivery shall consist of group A inspection and group B inspection. 4.4.1.1 Group A inspection. Group A inspection shall consist of the inspections specified in table II, and shall be made on the same set of sample units, in the order sh

34、own. 4.4.1.1.1 Subgroup 1. Subgroup 1 tests shall be performed on a production lot basis on 100 percent of the product supplied under this document. Resistors that are out of resistance tolerance, or which experience a change in resistance greater than that permitted for the tests of this subgroup s

35、hall be removed from the lot. Lots having more than 5 percent total rejects, due to exceeding the specified resistance tolerance change limit shall not be furnished on contracts. 4.4.1.1.2 Subgroup 2. Subgroup 2 tests shall be performed on an inspection lot basis. A sample of 13 parts shall be rando

36、mly selected; if one or more defects are found, the lot shall be rescreened and defects removed. A new sample of 13 parts shall then be randomly selected. If one or more defects are found in this second sample, the lot shall be rejected and shall not be supplied against the document. 4.4.1.1.3 Subgr

37、oup 3. Subgroup 3 tests shall be performed as specified in MIL-PRF-55342. TABLE II. Group A inspection. Inspection Requirement Method Sampling procedure Subgroup 1 DC resistance Thermal shock Power conditioning DC resistance 3.3.8 3.3.9 3.3.10 3.3.8 4.6 4.7 4.8 4.6 100 percent Subgroup 2 Visual insp

38、ection 3.2, 3.4, 3.8 4.5 13 samples, 0 failures Subgroup 3 Solderability 3.3.11 4.9 See 4.4.1.1.3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88027 REV E PAGE 6 4.4

39、.2 Group B inspection. Group B inspection shall be in accordance with MIL-PRF-55342. 4.4.2.1 Certification. The acquiring activity, at its discretion, may accept a certificate of compliance with group B requirements in lieu of performing group B tests (see 6.2d). 4.5 Visual and mechanical examinatio

40、n. Resistors shall be examined to verify that the materials, design, construction, physical dimensions, marking, and workmanship are in accordance with the applicable requirements of MIL-PRF-55342. 4.6 DC resistance. DC resistance shall be tested in accordance with MIL-PRF-55342. 4.7 Thermal shock.

41、Thermal shock shall be tested in accordance with MIL-PRF-55342. 4.8 Power conditioning. Resistors shall be tested in accordance with method 108 of MIL-STD-202. The following details and exceptions shall apply: a. Method of mounting: Chip resistor sample units shall be loaded in a test fixture. b. Te

42、st temperature: +70C 5C. c. Initial resistance measurement of mounted resistors: Initial dc resistance measurement shall be measured at 25C. d. Operating conditions: Rated dc continuous working voltage or filtered full wave rectified ac voltage shall be applied intermittently, 1.5 hours “on”, and 0.

43、5 hour “off”, for the applicable number of hours and applicable test temperature. “On time” shall be three quarters of the total elapsed time. During the “on” cycle, the voltage shall be regulated and controlled to maintain 5 percent of the rated continuous working voltage. e. Duration: 100 hours 4

44、hours. f. Stabilization and final dc resistance measurement: Resistors shall be removed from chambers for a minimum of 45 minutes and stabilized prior to final resistance measurement. g. Examination after test: Resistors shall be examined for evidence of mechanical damage. 4.9 Solderability. Soldera

45、bility shall be tested in accordance with MIL-PRF-55342. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel n

46、eed to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Packaging data retrieval i

47、s available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intend

48、ed use. Chip resistors are intended for use in thick or thin film circuits where microcircuitry is intended, also in most surface mount applications. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery: One copy of t

49、he conformance inspection data or certification of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Requirements for packaging and packing. d. Whether the manufacturer performs the group B tests or provides certification of compliance with group B requirements (see 4.4.2.1). Provided by IHSNot for ResaleNo reproduction