ASTM F487-2013 Standard Specification for Fine Aluminum&x2013 1&x2009 % Silicon Wire for Semiconductor Lead-Bonding《1%纯铝的标准规范半导体引线焊接用硅线》.pdf
《ASTM F487-2013 Standard Specification for Fine Aluminum&x2013 1&x2009 % Silicon Wire for Semiconductor Lead-Bonding《1%纯铝的标准规范半导体引线焊接用硅线》.pdf》由会员分享,可在线阅读,更多相关《ASTM F487-2013 Standard Specification for Fine Aluminum&x2013 1&x2009 % Silicon Wire for Semiconductor Lead-Bonding《1%纯铝的标准规范半导体引线焊接用硅线》.pdf(4页珍藏版)》请在麦多课文档分享上搜索。
1、Designation: F487 13Standard Specification forFine Aluminum1 % Silicon Wire for Semiconductor Lead-Bonding1This standard is issued under the fixed designation F487; the number immediately following the designation indicates the year of originaladoption or, in the case of revision, the year of last r
2、evision. A number in parentheses indicates the year of last reapproval. A superscriptepsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This specification covers aluminum1 % silicon alloywire for internal connections in semiconductor devices and islimited to w
3、ire of diameter up to and including 76 m (0.003in.). For diameters larger than 76 m (0.003 in.), the specifi-cations are to be agreed upon between the purchaser and thesupplier.1.2 The values stated in SI units are to be regarded as thestandard, regardless of whether they appear first or second in a
4、table. Values given in parentheses are for information only.2. Referenced Documents2.1 ASTM Standards:2F16 Test Methods for Measuring Diameter or Thickness ofWire and Ribbon for Electronic Devices and LampsF219 Test Methods of Testing Fine Round and Flat Wire forElectron Devices and Lamps2.2 Militar
5、y Standard:3MIL-STD-105 Sampling Procedures and Tables for Inspec-tion by Attributes3. Ordering Information3.1 Orders for material under this specification shall includethe following information:3.1.1 Quantity,3.1.2 Size (see Section 5),3.1.3 Breaking load and elongation (see Section 4),3.1.4 Packag
6、ing and marking (see Section 11), and3.1.5 Special requirements, such as for certificate of com-pliance (see Section 10).4. Physical Requirements4.1 Elongation and breaking-load ranges for the wire shallbe specified by the purchaser. The maximum ranges of thesemechanical properties are listed in Tab
7、le 1.4.2 Mechanical property requirements in ranges smallerthan those listed in Table 1 may be specified upon agreementbetween the purchaser and the supplier.NOTE 1The nature of aluminum1 % silicon alloy is such that themechanical properties of both as-drawn and annealed wires overlapconsiderably. I
8、t is also possible to alter the properties of hard wire byvarying the manufacturing parameters and procedures. For these reasons,no distinction is made between the two types of wire in this specification.5. Dimensions, Weights, and Permissible Variations5.1 Wire size shall be expressed in terms of w
9、ire diameter indecimal fractions of millimetres (inches). Tolerances for vari-ous size ranges are specified in Table 2.5.2 When wire size is expressed in terms of weight, thefollowing values shall be used:5.2.1 Density of Aluminum1 % Silicon2.7 g/cm3.5.2.2 Weight of a 200-mm Length of Wire 25.4 m in
10、Diameter0.274 mg.6. Surface Finish6.1 The wire surface shall be clean and free of finger oils,lubricant residues, stains, and particulate matter.6.2 Mechanical damage to the wire surface, such as nicks,scratches, and kinks, shall be held to a minimum.6.3 The inspection shall be carried out by electr
11、onic, optical,or other inspection method is agreed upon between thepurchaser and the supplier. The nature and extent of defectspermitted to be present on the surface of the wire shall beagreed upon between the purchaser and the supplier.7. Chemical Requirements7.1 The alloy composition shall be 1.00
12、 6 0.15 % silicon,and between 98.84 and 99.15 % aluminum. All other elementsare considered impurities.7.2 No single impurity shall exceed 0.0050 % and the totalof all detectable impurities shall not exceed 0.01 %.1This specification is under the jurisdiction of ASTM Committee F01 onElectronics and i
13、s the direct responsibility of Subcommittee F01.07 on WireBonding, Flip Chip, and Tape Automated Bonding.Current edition approved Jan. 1, 2013. Published January 2013. Originallyapproved in 1977. Last previous edition approved in 2006 as F487 88 (2006).DOI: 10.1520/F0487-13.2For referenced ASTM stan
14、dards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700Robbins Av
15、e., Philadelphia, PA 19111-5094, Attn: NPODS.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States17.3 Any lower or higher impurity content shall be as agreedupon between the purchaser and the supplier as part of thepurchase contract.7.4 La
16、rger aluminum wire diameters often include nickel orother impurities or both to minimize corrosion in plasticpackages. Such wire is not covered by this specification.8. Sampling8.1 Unless otherwise agreed upon by the purchaser and thesupplier, conformance with Section 4 shall be determined byMIL-STD
17、-105.9. Test Methods9.1 Elongation and Breaking Load Determine elongationand breaking load in accordance with Test Methods F219.9.2 Dimensional MeasurementDetermine the wire diam-eter by one of the following methods:9.2.1 Measure the diameter directly in accordance with TestMethods F16.9.2.2 Measure
18、 the diameter by optical means agreed uponbetween the purchaser and the supplier.NOTE 2Optical methods for measuring wire diameter are underdevelopment by Committee F-1 on Electronics.9.3 Chemical AnalysisVerify that the chemical require-ments are satisfied by means of spectrographic analysis orothe
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