ASHRAE FUNDAMENTALS IP CH 25-2017 Heat Air and Moisture Control In Building Assemblies-Fundamentals.pdf
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1、25.1CHAPTER 25HEAT, AIR, AND MOISTURE CONTROL IN BUILDING ASSEMBLIESFUNDAMENTALSFUNDAMENTALS. 25.1Terminology and Symbols 25.1Hygrothermal Loads and Driving Forces. 25.2HEAT TRANSFER . 25.5Steady-State Thermal Response. 25.5Transient Thermal Response . 25.8AIRFLOW 25.9MOISTURE TRANSFER 25.10Moisture
2、 Storage in Building Materials 25.10Moisture Flow Mechanisms . 25.11COMBINED HEAT, AIR , AND MOISTURE TRANSFER. 25.14SIMPLIFIED HYGROTHERMAL DESIGN CALCULATIONS AND ANALYSES. 25.14Surface Humidity and Condensation . 25.14Interstitial Condensation and Drying 25.14TRANSIENT COMPUTATIONAL ANALYSIS . 25
3、.15Criteria to Evaluate Hygrothermal Simulation Results . 25.16ROPER design of space heating, cooling, and air-conditioningPsystems requires detailed knowledge of the building envelopesoverall heat, air, and moisture performance. This chapter discussesthe fundamentals of combined heat, air, and mois
4、ture movement asit relates to the analysis and design of envelope assemblies. Guid-ance for designing mechanical systems is found in other chapters ofthe ASHRAE Handbook.Because heat, air, and moisture transfer are coupled and interactclosely with each other, they should not be treated separately. F
5、orexample, improving a building envelopes energy performance maycause moisture-related problems. Conversely, evaporation of waterand removal of moisture by other means are processes that requireenergy. Only a sophisticated moisture control strategy can ensurehygienic conditions and adequate durabili
6、ty for modern, energy-efficient building assemblies. Effective moisture control design mustdeal with all hygrothermal (heat and humidity) loads acting on thebuilding envelope.1. FUNDAMENTALS1.1 TERMINOLOGY AND SYMBOLSThe following heat, air, and moisture definitions, properties, andsymbols are commo
7、nly used.A building envelope or building enclosure provides physicalseparation between the indoor space and the outdoor environment. Abuilding assembly is any part of the building envelope, such as awall, window, or roof assembly, that faces the interior and exterior ofthe building. A building compo
8、nent is any element, layer, or mate-rial within a building assembly.HeatSpecific heat capacity c is the change in heat (energy) of a unitmass of material for a unit change of temperature in Btu/lbF.Volumetric heat capacity c is the change in heat stored in a unitvolume of material for a unit change
9、of temperature, in Btu/ft3F.Heat flux q, a vector, is the time rate of heat transfer through a unitarea, in the direction perpendicular to that area, in Btu/hft2.Thermal conductivity k in Europe, the Greek letter (lambda) isused is a material property describing ability to conduct heat, and isdefine
10、d by Fouriers law of heat conduction. Thermal conductivity isthe property that describes heat flux through a unit thickness of a ma-terial in a direction perpendicular to the isothermal planes, inducedby a unit temperature difference. (ASTM Standard C168 defineshomogeneity.) Units are Btuin/hft2F (p
11、referred) or Btu/hftF.For anisotropic materials, the direction of heat flux in the materialmust be noted. Thermal conductivity must be evaluated for a specificmean temperature, thickness, age, and moisture content. Thermalconductivity is normally considered an intrinsic property of a homog-enous mat
12、erial. In porous materials, heat flow occurs by a combina-tion of conduction, convection, and radiation, and may depend onorientation, direction, or both. When nonconductive modes of heattransfer occur within the specimen or the test specimen is nonhomo-geneous, the measured property of such materia
13、ls is called apparentthermal conductivity. The specific test conditions (e.g., samplethickness, orientation, environment, environmental pressure, surfacetemperature, mean temperature, temperature difference, moisturedistribution) should be reported with the values of apparent thermalconductivity. Th
14、e symbol kapp(or app) is used to denote the absenceof pure conduction or to indicate that all values reported are apparent.Materials with a low apparent thermal conductivity are called insu-lation materials (see Chapter 26 for more detail).Thermal resistivity ruis the reciprocal of thermal conductiv
15、ity.Units are hft2F/Btuin.Thermal resistance R is an extrinsic property that describes theresistance of a material layer or assembly to heat transfer. It is deter-mined by the steady-state or time-averaged temperature difference(between two defined surfaces of a material layer within a buildingassem
16、bly) that induces a unit heat flux, in ft2hF/Btu. When thetwo defined surfaces have unequal areas, as with heat flux throughmaterial layers of nonuniform thickness, an appropriate mean areaand mean thickness must be given. Thermal resistance formulasinvolving materials that are not uniform slabs mus
17、t contain shapefactors to account for the area variation involved. When heat fluxoccurs by conduction alone, the thermal resistance of a layer of con-stant thickness may be obtained by dividing the materials thicknessby its thermal conductivity. When several modes of heat transfer areinvolved, the a
18、pparent thermal resistance may be obtained bydividing the materials thickness by its apparent thermal conductiv-ity. When air circulates within or passes through insulation, as mayhappen in low-density fibrous materials, the apparent thermal resis-tance is affected. Thermal resistances of common bui
19、lding and insu-lation materials are listed in Chapter 26.Thermal conductance C is the reciprocal of thermal resistance.Units are Btu/hft2F.Heat transfer or surface film coefficient h is the value that de-scribes the total heat flux by both convection and radiation betweena surface and the surroundin
20、g environment. It is defined as the heattransfer per unit time and unit area induced by a unit temperaturedifference between the surface and the reference temperature in thesurrounding environment. Units are Btu/hft2F. For convection toThe preparation of this chapter is assigned to TC 4.4, Building
21、Materialsand Building Envelope Performance.25.2 2017 ASHRAE HandbookFundamentals occur, the surrounding space must be filled with a fluid, usually air.If the space is evacuated, heat flow occurs by radiation only. In thecontext of this discussion, indoor or outdoor heat transfer or sur-face film coe
22、fficient hior horelates to an interior or exterior surfaceof a building envelope assembly. The heat transfer film coefficientis also commonly known as the surface film conductance.Thermal transmittance U is the quantity equal to the steady-state or time-averaged heat flux from the environment on the
23、 oneside of a body to the environment on the other side, per unit tem-perature difference between the two environments, in Btu/hft2F.Thermal transmittance is sometimes called the overall coefficientof heat transfer or U-factor. Average thermal transmittance differsfrom clear-wall transmittance, in t
24、hat the former considers all ther-mal bridge effects in the assembly.Thermal emissivity is the ratio of radiant flux emitted by a sur-face to that emitted by a black surface at the same temperature. Emis-sivity refers to intrinsic properties of a materials surface and isdefined only for a specimen o
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