ASHRAE FUNDAMENTALS IP CH 25-2013 Heat Air and Moisture Control In Building Assemblies-Fundamentals.pdf
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1、25.1CHAPTER 25HEAT, AIR, AND MOISTURE CONTROL IN BUILDING ASSEMBLIESFUNDAMENTALSTerminology and Symbols . 25.1Environmental Hygrothermal Loads and Driving Forces . 25.2HEAT TRANSFER . 25.5Steady-State Thermal Response 25.5Transient Thermal Response . 25.8AIRFLOW . 25.9MOISTURE TRANSFER . 25.10Moistu
2、re Storage in Building Materials . 25.10Moisture Flow Mechanisms 25.12COMBINED HEAT, AIR, AND MOISTURE TRANSFER 25.14SIMPLIFIED HYGROTHERMAL DESIGN CALCULATIONS AND ANALYSES 25.15Surface Humidity and Condensation 25.15Interstitial Condensation and Drying . 25.15TRANSIENT COMPUTATIONAL ANALYSIS 25.16
3、Criteria to Evaluate Hygrothermal Simulation Results 25.16ROPER design of space heating, cooling, and air-conditioningPsystems requires detailed knowledge of the building envelopesoverall heat, air, and moisture performance. This chapter discussesthe fundamentals of combined heat, air, and moisture
4、movement asit relates to the analysis and design of envelope assemblies. Guid-ance for designing mechanical systems is found in other chapters ofthe ASHRAE Handbook.Because heat, air, and moisture transfer are coupled and closelyinteract with each other, they should not be treated separately. Infact
5、, improving a building envelopes energy performance maycause moisture-related problems. Evaporation of water and removalof moisture by other means are processes that may require energy.Only a sophisticated moisture control strategy can ensure hygienicconditions and adequate durability for modern, en
6、ergy-efficientbuilding assemblies. Effective moisture control design must dealwith all hygrothermal loads (heat and humidity) acting on thebuilding envelope.TERMINOLOGY AND SYMBOLSThe following heat, air, and moisture definitions and symbols arecommonly used.A building envelope or building enclosure
7、 provides physicalseparation between the indoor and outdoor environments. A build-ing assembly is any part of the building envelope, such as wallassembly, window assembly, or roof assembly, that has boundaryconditions at the interior and the exterior of the building. A buildingcomponent is any eleme
8、nt or material within a building assembly.HeatSpecific heat capacity c is the change in heat (energy) of unitmass of material for unit change of temperature in Btu/lbF.Volumetric heat capacity c is the change in heat stored in unitvolume of material for unit change of temperature, in Btu/ft3F.Heat f
9、lux q, a vector, is the time rate of heat transfer through a unitarea, in Btu/hft2.Thermal conductivity k in Europe, the Greek letter (lambda)is used is a material property defined by Fouriers law of heat con-duction. Thermal conductivity is the parameter that describes heatflux through a unit thick
10、ness of a material in a direction perpendic-ular to the isothermal planes, induced by a unit temperature differ-ence. (ASTM Standard C168 defines homogeneity.) Units areBtuin/hft2F (preferred) or Btu/hftF. Materials can be isotropicor anisotropic. For anisotropic materials, the direction of heat flo
11、wthrough the material must be noted. Thermal conductivity must beevaluated for a specific mean temperature, thickness, age, and mois-ture content. Thermal conductivity is normally considered an intrin-sic property of a homogenous material. In porous materials, heatflow occurs by a combination of con
12、duction, convection, radiation,and latent heat exchange processes and may depend on orientation,direction, or both. When nonconductive modes of heat transfer occurwithin the specimen or the test specimen is nonhomogeneous, themeasured property of such materials is called apparent thermalconductivity
13、. The specific test conditions (i.e., sample thickness,orientation, environment, environmental pressure, surface tempera-ture, mean temperature, temperature difference, moisture distribu-tion) should be reported with the values of apparent thermalconductivity. The symbol kapp(or app) is used to deno
14、te the lack ofpure conduction or to indicate that all values reported are apparent.Materials with a low apparent thermal conductivity are called insu-lation materials (see Chapter 26 for more detail).Thermal resistivity ruis the reciprocal of thermal conductivity.Units are hft2F/Btuin.Thermal resist
15、ance R is an extrinsic property of a material orbuilding component determined by the steady-state or time-averagedtemperature difference between two defined surfaces of the materialor component that induces a unit heat flux, in ft2hF/Btu. When thetwo defined surfaces have unequal areas, as with heat
16、 flux throughmaterials of nonuniform thickness, an appropriate mean area andmean thickness must be given. Thermal resistance formulas involv-ing materials that are not uniform slabs must contain shape factors toaccount for the area variation involved. When heat flux occurs byconduction alone, the th
17、ermal resistance of a layer of constant thick-ness may be obtained by dividing the materials thickness by its ther-mal conductivity. When several modes of heat transfer are involved,the apparent thermal resistance may be obtained by dividing thematerials thickness by its apparent thermal conductivit
18、y. When aircirculates within or passes through insulation, as may happen in low-density fibrous materials, the apparent thermal resistance is affected.Thermal resistances of common building and insulation materialsare listed in Chapter 26.Thermal conductance C is the reciprocal of thermal resistance
19、.Units are Btu/hft2F.Heat transfer or surface film coefficient h is the proportionalityfactor that describes the total heat flux by both convection and radi-ation between a surface and the surrounding environment. It is theheat transfer per unit time and unit area induced by a unit tempera-ture diff
20、erence between the surface and reference temperature in thesurrounding environment. Units are Btu/hft2F. For convection tooccur, the surrounding space must be filled with air or another fluid.If the space is evacuated, heat flow occurs by radiation only. In thecontext of this discussion, indoor or o
21、utdoor heat transfer or sur-face film coefficient hior hodenotes an interior or exterior surfaceThe preparation of this chapter is assigned to TC 4.4, Building Materialsand Building Envelope Performance.25.2 2013 ASHRAE HandbookFundamentalsof a building envelope assembly. The heat transfer film coef
22、ficientis also commonly known as the surface film conductance.Thermal transmittance U is the quantity equal to the steady-state or time-averaged heat flux from the environment on the oneside of a body to the environment on the other side, per unit temper-ature difference between the two environments
23、, in Btu/hft2F.Thermal transmittance is sometimes called the overall coefficientof heat transfer or U-factor. Thermal transmittance includes ther-mal bridge effects and the surface heat transfer at both sides of theassembly.Thermal emissivity is the ratio of radiant flux emitted by a sur-face to tha
24、t emitted by a black surface at the same temperature.Emissivity refers to intrinsic properties of a material. Emissivity isdefined only for a specimen of the material that is thick enough to becompletely opaque and has an optically smooth surface.Effective emittance E refers to the properties of a p
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