ARMY MIL-STD-252 B-1970 WIRED EQUIPMENT CLASSIFICATION OF VISUAL AND MECHANICAL DEFECTS《分类的视觉和机械缺陷有线设备》.pdf
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1、MILITARY STANDARD . CLASSIFICATICN OF VISUAL AND MECHANICAL DEFECTS Fa EQIJIPMENT, ELECTRONIC, WIRED, AM OTHER DEVICES Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1. This sttm
2、dard has been approved ky the Electronics Cod, Department of the Am, and ia nmdatorg for use by activities within the Department of the m. N other militav activities are required to employ this 8Wrd where mitable. 2. Recarmnnded corrections, additions or deletions should be addressed to Headquarters
3、, US m Electronics Material Support Agency, Fort however, defects may be grouped into other classes or into sub-classes within these classes. Other defects not classified herein of lesser import than nminorf1, having no effect upon functioning, assembly, maintenance or me (formerly classified as con
4、trol defects) pay be tolerated to the extent established by the Government, not to exceed lo$* Such defects are considered within the purview of workmnship only. When the rate of occurrence exceeds lo$, it may indicate a general degradation trend in workmanship and for control purposes such defects
5、may be classified as 1 Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-4.2 Coding of Defects. The defects listed in Sectiun 5 have been given key rimuber8 to siplpllFy the prepart
6、ion sad maintenance of inspection m- Cord80 Recording the key movement of wire or solder upon pick or spadger application. U7. Rosin joint. - Presence of rosin; relative movement of wire or solder upon pick application. US. Insulation in tenninal hole. - Solder over insulation; no ap U. Minor Defect
7、. pearance of visible wire contour. lB1. Improper map. - l/4 turn or more, but less than l/2 turn; or more than 3/4 turn. lB2. Wire end - Projecting more than 1/16 inch from surface. Note: When wire end8 project to the axtent that a possible short circuit could occur, the defect Shall be evaluated i
8、n accordance with Tspe 6. 2 P Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-#IZrSTD-252B(EL) 19 Januarg 1970 5.2 SouERING DEFECTS PECULIAR TO PRINTED KIRII?G ASEiEbw 5.2.1 Class
9、ifying Defects for Solder Connections in Printed Wiring Boards . A deteminaticm of whether more than one defect will be applied to a single connection in a grinted wiring board #ill depend upon the soldering process used in fabriation and appllcstion of components to a printed niring bard. When the
10、process used applies 8older to both eides of the board during one operation, missing or poor solder on either or both sides can om be ChS8ified a8 one defect, When the process used requires two separate 8ppl.i- cations of solder (one on each side of the board), missing or poor solder on both sides o
11、f the board wUI. be classified as defects. U. Major Defects UlO, Any printed wiring solder joint that is not a cqlete con- centric void-free fillet of sQlder wetting both the flange of the part (eye- let terminal post, etc.) or the component lead and the terminal area. Ull. Clearance - Any buildup o
12、f solder or protruding of leads greatel than 3/32 inch above the control laminate on the side opposite the component. 1A12, Charred Area - Any charred area between laminates. M3. Lead Terminations - Leads through termination holes not with- in specified dimensional tolerances. 5.3 TYPE - SOLDERLESS
13、CONNECTCPiS 2A. Va3or Defects U?, Incorrect terminal size for a given wire gauge. 2A8. Cracked metal part, affecting use. 2B Minor Defect 2B3. Be-insulation broken, but no potential short circuit hasard. 2B6. Improper crimp (evidenced by round shape of basic wire edge) . 3 * Copyright Communications
14、 - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-252B MI m 77777LL 0077553 I m 2B6. Cracked metal part, not affecting use. 5.4 TPPE 3 - CABLING AND WIRING S, Major Defects 3AL Broken or nicked str
15、ands - More than 20% of wire, except: a. In less than 7 strand wire, 1 broken or nicked strand. b, In 7.atrand wire, 2 broken or nicked strands. 1 33. for example, a poly- styene lead dressed against a power tube. Copyright Communications - Electronics Command Provided by IHS under license with CRAI
16、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-252B MI M 9799711 0077554 3 m I u* Halor Defects: See Table I. me four subdivisions respectively refer, for example, to one fastener missing where one wad intended, one fastener missing where two were intended
17、, one fastener missing where three or mre were intended, and two fasteners missing where three or more were intended. Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I MIL-STD-252
18、B MI m 7799733 0077555 5 m i 5 - FCfBIQ? 03JECTS Ma30r Defects L l m meUc foreign object, not finaly attached, uhich could circuit, an electrical contact failure, or mechanical failure. i Two or metallic foreign objects. non-metalllc foreign object, auch as insubtion, dirt phenoc chips, or cede cps,
19、 that could cause jnnan.t.ng of a mechanism, Wge to gear teeth or driving mechanism, or prevent electrical contact. 1 I 4 s. Minor Defects: 5Bl. Foreign objects that cannot be dislodged the application of i P roaml+b with a pick or spudger 8hall be considered to be firmly attached. Such objects, if
20、becaming loosened due to environmental conditions in service, would not likely cause failures such as cited in 5A3). (Small size objects) /1 Pwsence of any foreign objects either firmly or not firmly attached is very undesireable and is considered poor worhanshp. Under environmental conditions, (sho
21、ck, vibration, temperature) . Firmly attached objects at factory inspection may become loosened and became dislodged in 8ervice, due to change in the adhesive, properties of the substance holding the foreign object . (Substances such as rosin flux, varnish, paint, etc. are in this category). Foreign
22、 objects such as screws, washers, chips of naterial, etc, which are inadvertently clantped between wires, camponents or component and chassis or other elements may become loosened or dislodged due to vibration during field use, which my cause failures such as cited in W, 92 and 5A3. 5.7 TIE 6 - POTE
23、NTIAL SHORT CIRCUIT 5.7.1 Amlicablity: The potential short classification covers instances there there are bare conducting members inadequately separated due to irregularities of worlananship during the manufacturing process, e.g., missing, frayed, or damged insulation, excess solder, projecting wir
24、e ends, improper assembly, improper placement of uninsulated conductors, etc. Com- ponent leads and other conductors which are uninsulated and wbich are adja- cent to each other must be separated sufficiently to prevent short circuits resulting from flsshover or from low resistance leakage paths due
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