ARMY MIL-C-71043-1991 CIRCUIT CARD ASSEMBLY AMPLIFIER 11784526《 t电路板扩音器的组装 11784526》.pdf

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1、NIL-C-7L043 59 = 9999906 0509947 4 W INCH-POUND MILITARY SPECIFICATION CIRCUIT CARD ASSEMBLY, AMPLIFIER: 7 MIL-C-71043 (AR) 28 November 1991 4526 This specification is approved for use by the U.S. Army Armament, Munitions and Chemical Command, and is available for use by all Departments and Agencies

2、 of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the requirements and tests for the Amplifier Circuit Card Assembly, which is a component in the Electronic Control Unit (ECU). The ECU is a part of the Target Holding Mechanism/Tank Gunnery (THM/TG) (See 6.1). 2. APPLICABLE

3、 DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Depa

4、rtment of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (See 6.2). SPECIFICATIONS MILITARY MIL-F-13926 - Fire Control Materiel, Manufacture and Inspection, General Specification for MIL-1-45607 - Inspection Equipment, Acquisition, Maintenanc

5、e and Disposition of BeoeBcial comments (raximendatiorrs, additions, deletions) and my pertinent data which may be of use in improving this document should be addressed to: Commander, U.S. hy ARDEC, Al”: SMCAR-BAGS, Picatinny hd, New Jersey 78W5000 by using tbe self-addmxd Sandardizatioo Document Im

6、provement Proposai (DD Form 1426) appearing at the end of this document or by letter. AMSC NIA HC 5999 IRUTJON STATEMENT A, Approved for public release; distribution is unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-71043 59 W 99999

7、Ob 0509948 b W MIL-(2-71043 (AR) STANDARDS MIL I TARY MIL-STD-109 - Quality Assurance Terms and Definitions MIL-STD-810 - Environmental Test Methods and Engineering Guidelines MIL-STD-2000 - Standard Requirements for Soldered Electrical and Electronic Assemblies (Unless otherwise indicated, copies o

8、f federal and military specifications, standards, and handbooks are available from the Standardization Documents Order Desk, Bldg. 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.1.2 Other Government documents, drawinqs and publications. The following other Government documents, drawings, an

9、d publications form a part of this document to the extent specified herein. Unless otherwise specified, the issues are those cited in the solicitation, DRAWINGS (see 6.4) U.S. ARMY ARMAMENT RESEARCH, DEVELOPMENT AND ENGINEERING CENTER (ARDEC) 11784526 - Circuit Card Assembly, Amplifier 11784528 - Sc

10、hematic Diagram, Amplifier SPECIAL PACKAGING INSTRUCTIONS PS11784526 - Packaging of Amplifier Circuit Card Assembly (Copies of drawings, publications, and other Government documents required by contractors in connection with specific acquisition functions should be obtained from the contracting acti

11、vity or as directed by the contracting activity.) 2.2 Order of precedence. In the event of conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document however, supersedes applicable laws and regulations unless a spe

12、cific exemption has been obtained. 3. REQUIREMENTS 3.1 Materials. Materials shall be applicable drawings and specifications. in accordance with the 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- fi MIL-C-71043 59 m 99999b 0509947 m MIL-C-71043 (A

13、R) 3.2 Components and assemblies. The components and assemblies shall comply with all requirements specified on Drawing 11784526 and all associated drawings, and with all requirements specified in applicable specifications and standards. Where applicable, the Amplifier Circuit Card Assembly shall me

14、et the requirements of MIL- F-13926 as follows: a. Dimensions and tolerances b. Inorganic protective surface finishings c. Part identification and marking d. Workmanship 3.3 Environmental service conditions. 3.3.1 Vibration. The Amplifier Circuit Card Assembly shall not suffer damage and shall meet

15、the requirements of 3.4 and 3.7 after exposure to sinusoidal vibrations for 1 hour along the vertical axis within the frequency range of 10 to 40 hertz (Hz). The rate of change of frequency at each frequency range shall not exceed 1 Hz per second. Frequency Range Amp1 i tude 10 to 15 hertz 15 to 25

16、hertz 25 to 40 hertz 0.06 inches double amplitude 0.04 inches double amplitude 0.02 inches double amplitude The frequency of vibration shall be swept logarithmically. The cycling time shall be 60 minutes. The sweep rate shall be 3.75 minutes + 10%. The 10-40-10 hertz sweep time is 2 minutes 30 secon

17、ds - + 10%. 3.3.2 Temperature. 3.3.2.1 Operatinq. The Amplifier Circuit Card Assembly shall meet the requirements of 3.4 and 3.7 when stabilized thermally at any temperature between -25 degrees F and + 125 degrees F. 3.3.2.2 Non-operatinq (storage). The Amplifier Circuit Card Assembly shall not suff

18、er permanent damage when subjected to the constant temperature extremes of -40 degrees F for a period of 4 hours and +160 degrees F for a period of 4 hours (after temperature stabilization), and shall meet the requirements of 3.4 and 3.7 when returned to room ambient. 3.4 Electrical. The electrical

19、characteristics and continuity of the Amplifier Circuit Card Assembly shall be as specified on the Amplifier-Schematic Diagram drawing 11784528. schematic diagram for the performance requirements of 3.7, and performance testing of 4.7.5. Refer-to this 3 Provided by IHSNot for ResaleNo reproduction o

20、r networking permitted without license from IHS-,-,- MIL-C-7L043 57 = 9777706 0507750 Li MIL-C-71043 (AR) 3.5 Soldering. The circuit board shall be soldered per the requirements of MIL-STD-2000. 3.6 Circuit identification. The contact fingers (Pins) on the circuit board shall have adequate permanent

21、 labeling for proper identification of pins in the circuitry. 3.7 Performance. 3.7.1 kxnctional description. The Amplifier Circuit Card Assemblv is the section of the circuitry in the Electronic Control _. Unit (ECU) that provides sensitivity response from the hit sensors. Up to four (4) hit sensors

22、 are attached to a simulated tank target, and are plugged into the ECU. The ECU has four (4) sensitivity settings from low to high based upon the type of ammunition used. The Amplifier Circuit Card Assembly provides hit impulses or hit sensor failure signals as required. 3.7.2 Supply voltaqe. The Am

23、plifier Circuit Card Assembly shall function when a +12 Volt direct current (Vdc) is connected to Pin S with return to ground contact Pin H. 3.7.3 Normal condition. With + 12 VDC applied at contact Pin S, the following voltage shall be present: Pin D +12 Vdc - + 0.1 Vdc 3.7.4 Open circuit. With + 12

24、 Vdc applied at contact Pin S and with the resistor disconnected from contact Pin c the following voltage shall be present: Pin D .O00 Vdc to 0.400 Vdc This voltage at contact Pin D is also required for inputs at Pin E, Pin J, and Pin L (See 4.7.5.1.3). 3.7.5 Short circuit. With t 12 Vdc applied at

25、contact Pin S, and with a short between contacts Pin C and Pin H the following voltage shall be present: Pin D .O00 to 0.400 Vdc This test is also required at contact Pin E, Pin J, and Pin L with respect to contact Pin H. voltages shall be present: Under these conditions the following Pin F 0.000 to

26、 0.400 Vdc Pin K 0.000 to 0.400 Vdc Pin M 0.000 to 0.400 Vdc 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-3% MIL-C-71043 59 999990b 0509953 b M MIL-C-71043 (AR) 3.7.6 Simulated hit sensor signal. Hit sensors 1 through 4 (Pin C, Pin J, Pin E and

27、Pin L) are required to register a hit pulse which occurs at Pin B. The hit pulse shall be +12 vdc (11.8 Vdc to 12.1 Vdc) in amplitude and of 10 microseconds minimum duration. Hit sensor signal sensitivity response shall comply with Table IV of 4.7.5.1.5. O 3.8 First article. When specified in the co

28、ntract or purchase order, sample shall be subjected to first article inspection in accordance with technical provisions herein (see 4.2). 4. QUALITY ASSURANCE PROVISIONS 4.1 Responsibility for inspection. Unless otherwise specified in the contract or purchase order, the contractor is responsible for

29、 the performance of all inspection requirements (examinations and tests) as specified herein. Except as otherwise specified in the contact or purchase order, the contractor may use his own or any other facilities suitable for the performance of the inspection requirements specified herein, unless di

30、sapproved by the Government. The Government reserves the right to perform any of the inspections set forth in this specification where such inspections are deemed necessary to ensure supplies and services conform to prescribed requirements. 4.1.1 Responsibility for compliance. All items must meet al

31、l 0 requirements of sections 3 and 5. The inspections set forth in this specification shall become a part of the contractors overall inspection system or quality program. The absence of any inspection requirements in the specification shall not relieve the contractor of the responsibility of ensurin

32、g that all products or supplies submitted to the Government for acceptance comply with all requirements of the contract. Sampling inspection, as part of manufacturing operations, is an acceptable practice to ascertain conformance to requirements, however, this does not authorize submission of known

33、defective material, either indicated or actual, nor does it commit the Government to accept defective material. 4.1.2 General provisions. The component and subassembly inspection requirements of MIL-F-13926 form a part of the quality assurance provisions of this specification. Reference shall be mad

34、e to MIL-STD-109 to define quality assurance terms used herein. 4.2 Classification of inspections. The inspection requirements specified herein are classified as follows: a. First article inspection (see 4.3). b. Quality conformance inspection (see 4.4). c. Special sampling inspection (see 4.5). 5 P

35、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-3L043 59 9999706 0509952 8 MIL-C-71043 (AR) 4.2.1 Inspection conditions. unless otherwise specified, all examinations and tests shall be conducted at the following standard ambient conditions: a. T

36、emperature b. Relative humidity c. Pressure +60 deg to +90 deg F. 90% RH Max. 28 to 32 inches of Hg. 4.3 First article inspection. 4.3.1 First article submission. The contractor shall submit a first article sample as designated by the contracting officer consisting of three (3) Amplifier Circuit Car

37、d Assemblies for inspection in accordance with 4.3.2. 4.3.2 Inspections to be performed. First article assemblies, components and test specimens may be subjected by the Government to any or all of the examinations and tests specified in Table I (Functional test) and Table II (Special Sampling) herei

38、n and to any or all requirements of the applicable drawings. 4.3.3 Rejection. If any assembly, component or test specimen fails to comply with any of the applicable requirements, the first article sample shall be rejected. The Government reserves the right to terminate its inspection upon any failur

39、e of any assembly, component or test specimen to comply with any of the requirements. 4.4 Quality conformance inspection. 4.4.1 Inspection lot formation. The term Ilinspection lot! is defined as a homogeneous collection of units of product from which a representative sample is drawn or which is insp

40、ected 100 percent to determine conformance with applicable requirements. Units of product selected for inspection shall represent only the inspection lot from which they are drawn and shall not be construed to represent any prior or subsequent quantities presented for inspection. inspection lot has

41、been produced by one manufacturer, in one unchanged process, using the same materials and methods, in accordance with the same drawings, same drawing revisions, same specifications and same specification revisions. submitted for inspection in accordance with this specification shall comply with the

42、homogeneity criteria specified herein, regardless of the type of inspection procedure which is being applied to determine conformance with requirements. Homogeneity shall be considered to exist provided the All material 6 Provided by IHSNot for ResaleNo reproduction or networking permitted without l

43、icense from IHS-,-,-MIL-C-71043 59 999990b 0509953 T MIL-C-71043 (AR) 4.4.2 Examinations and tests. 4.4.2.1 Components, assemblies and subassemblies. a. The contractors quality program or detailed inspection plan shall provide assurance of compliance of all characteristics with the applicable drawin

44、gs and specifications utilizing as a minimum the conformance criteria specified in this document and the Quality Assurance Provisions (QAP) listed in the Technical Data Package (TDP). In the absence of QAPs, the applicable quality assurance provisions of MIL-F-13926 shall apply. b. Alternative inspe

45、ction procedures, methods or equipment, such as statistical process control, tool control, other types of sampling procedures, etc., may be used by the contractor when they provide, as a minimum, the level of quality assurance required by the provisions specified herein. Prior to applying such alter

46、native procedures, methods, or equipment, the contractor shall describe them in a written proposal submitted to the procuring contracting officer for evaluation and approval by the Government. When required the contractor shall demonstrate that the effectiveness of the proposed alternative(s) is equ

47、al to or better than the specified quality assurance provisions herein. In cases of dispute as to whether the contractors proposed alternative(s) provide equal assurance, the provisions of this specification shall apply. All approved alternative inspection provisions shall be specifically incorporat

48、ed into the contractor s quality program plan or detailed inspection system, as applicable. 0 4.4.2.2 Final acceptance inspection. Subsequent to first article approval, examinations and tests related to Section 3 shall be performed as specified in 4.4.2.3 and 4.5. 7 Provided by IHSNot for ResaleNo r

49、eproduction or networking permitted without license from IHS-,-,-MIL-C-71043 59 9999906 0509954 19 I I MIL-C-71043 (AR) 4.4.2.3 Functional tests. The tests in Table I shall be performed on a 100% basis. TABLE I. Functional tests (100% Inspection) CHARACTERISTIC Critical: Mai or : REQUIREMENT TEST PROCEDURE None N/A 101. Electrical 3.4 102 Soldering 3.5 103. Performance 3.7 104. Workmanship 3.2d Minor: 201. Identification 3.6 4.7.2 4