SAE EIA-STD-656B-2006 I O Buffer Information Specification (IBIS) Version 4 2 (Formerly TechAmerica EIA-STD-656-B)《I O缓冲信息规格 (IBIS) 版本4 2》.pdf

《SAE EIA-STD-656B-2006 I O Buffer Information Specification (IBIS) Version 4 2 (Formerly TechAmerica EIA-STD-656-B)《I O缓冲信息规格 (IBIS) 版本4 2》.pdf》由会员分享，可在线阅读，更多相关《SAE EIA-STD-656B-2006 I O Buffer Information Specification (IBIS) Version 4 2 (Formerly TechAmerica EIA-STD-656-B)《I O缓冲信息规格 (IBIS) 版本4 2》.pdf（161页珍藏版）》请在麦多课文档分享上搜索。

1、_SAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirely voluntary, and its applicability and suitability for any particular use, including any patent infringement arising theref

2、rom, is the sole responsibility of the user.”SAE reviews each technical report at least every five years at which time it may be revised, reaffirmed, stabilized, or cancelled. SAE invites your written comments and suggestions.Copyright 2014 SAE InternationalAll rights reserved. No part of this publi

3、cation may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of SAE.TO PLACE A DOCUMENT ORDER: Tel: 877-606-7323 (inside USA and Canada)Tel: +1 724-776-4970 (out

4、side USA)Fax: 724-776-0790Email: CustomerServicesae.orgSAE WEB ADDRESS: http:/www.sae.orgSAE values your input. To provide feedbackon this Technical Report, please visithttp:/www.sae.org/technical/standards/EIASTD656BTECHNICAL REPORT EIA-STD-656 REV. BIssued 1995-12Revised 2006-09Reaffirmed 2016-10I

5、/O Buffer Information Specification(IBIS) Version 4.2NOTICEThis document has been taken directly from the original TechAmerica document and contains only minor editorial and format changes required to bring it into conformance with the publishing requirements of SAE Technical Standards. The release

6、of this document is intended to replace the original with the SAE International document. Any numbers established by the original document remain unchanged.The original document was adopted as an SAE publication under the provisions of the SAE Technical Standards Board (TSB) Rules and Regulations (T

7、SB 001) pertaining to accelerated adoption of specifications and standards. TSB rules provide for (a) the publication of portions of unrevised specifications and standards without consensus voting at the SAE committee level, and (b) the use of the existing specification or standard format.TechAmeric

8、a Standard I/O Buffer Information Specification (IBIS) Version 4.2EIA-STD-656-B (Revision of EIA-656-A) September 2006 EIA-656-B-2006 Approved: September 1, 2006 EIA-STD-656-BNOTICE TechAmerica Engineering Standards and Publications are designed to serve the public interest by eliminating misunderst

9、andings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect precl

10、ude any member or nonmember of TechAmerica from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than TechAmerica members, whether the standard is to be used eit

11、her domestically or internationally. Standards and Publications are adopted by TechAmerica in accordance with the American National Standards Institute (ANSI) patent policy. By such action, TechAmerica does not assume any liability to any patent owner, nor does it assume any obligation whatever to p

12、arties adopting the Standard or Publication. This TechAmerica Standard is considered to have International Standardization implications, but the ISO/IEC activity has not progressed to the point where a valid comparison between the TechAmerica Standard and the ISO/IEC document can be made. This Stand

13、ard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its us

14、e. (Formulated under the cognizance of the I/O Buffer Interchange Standard (IBIS) Committee).Published by 2010 TechAmerica Standards ? | | Other Notes: The Comment Char keyword can be used anywhere in the file, | as desired. |-Comment Char |_char |=| Keyword: File Name | Required: Yes | Description:

15、 Specifies the name of the IBIS file. | Usage Rules: The file name must conform to the rules in paragraph 3 of | Section 3, GENERAL SYNTAX RULES AND GUIDELINES. In addition, | the file name must use the extension “.ibs“, “.pkg“, or | or “.ebd“. The file name must be the actual name of the file. |-Fi

16、le Name ver4_1.ibs |=EIA-STD-656-B 13|=| Keyword: File Rev | Required: Yes | Description: Tracks the revision level of a particular .ibs file. | Usage Rules: Revision level is set at the discretion of the engineer | defining the file. The following guidelines are recommended: | 0.x silicon and file

17、in development | 1.x pre-silicon file data from silicon model only | 2.x file correlated to actual silicon measurements | 3.x mature product, no more changes likely |-File Rev 1.0 | Used for .ibs file variations |=| Keywords: Date, Source, Notes, Disclaimer, Copyright | Required: No | Description: O

18、ptionally clarifies the file. | Usage Rules: The keyword arguments can contain blanks, and be of any | format. The Date keyword argument is limited to a maximum | of 40 characters, and the month should be spelled out for | clarity. | Because IBIS model writers may consider the information in | these

19、 keywords essential to users, and sometimes legally | required, design automation tools should make this information | available. Derivative models should include this text | verbatim. Any text following the Copyright keyword must be | included in any derivative models verbatim. |-Date June 2, 2006

20、| The latest file revision date |Source Put originator and the source of information here. For example: From silicon level SPICE model at Intel. From lab measurement at IEI. Compiled from manufacturers data book at Quad Design, etc. |Notes Use this section for any special notes related to the file.

21、|Disclaimer This information is for modeling purposes only, and is not guaranteed. | May vary by component |Copyright Copyright 2006, XYZ Corp., All Rights Reserved |=|=EIA-STD-656-B14|=|=|Section 5 | C O M P O N E N T D E S C R I P T I O N |=|=| Keyword: Component | Required: Yes | Description: Mar

22、ks the beginning of the IBIS description of the integrated | circuit named after the keyword. | Sub-Params: Si_location, Timing_location | Usage Rules: If the .ibs file contains data for more than one component, | each section must begin with a new Component keyword. The | length of the component na

23、me must not exceed 40 characters, | and blank characters are allowed. | NOTE: Blank characters are not recommended due to usability | issues. | Si_location and Timing_location are optional and specify where | the Signal Integrity and Timing measurements are made for the | component. Allowed values f

24、or either subparameter are Die | or Pin. The default location is at the Pin. |-Component 7403398 MC452 |Si_location Pin | Optional subparameters to give measurement Timing_location Die | location positions|=| Keyword: Manufacturer | Required: Yes | Description: Specifies the name of the components m

25、anufacturer. | Usage Rules: The length of the manufacturers name must not exceed 40 | characters (blank characters are allowed, e.g., Texas | Instruments). In addition, each manufacturer must use a | consistent name in all .ibs files. |-Manufacturer Intel Corp. |=EIA-STD-656-B 15|=| Keyword: Package

26、 | Required: Yes | Description: Defines a range of values for the default packaging | resistance, inductance, and capacitance of the component pins. | Sub-Params: R_pkg, L_pkg, C_pkg | Usage Rules: The typical (typ) column must be specified. If data for the | other columns are not available, they mu

27、st be noted with “NA“. | Other Notes: If RLC parameters are available for individual pins, they can | be listed in columns 4-6 under keyword Pin. The values | listed in the Pin description section override the default | values defined here. Use the Package Model keyword for more | complex package de

28、scriptions. If defined, the Package Model | data overrides the values in the Package keyword. | Regardless, the data listed under the Package keyword must | still contain valid data. |-Package| variable typ min max R_pkg 250.0m 225.0m 275.0m L_pkg 15.0nH 12.0nH 18.0nH C_pkg 18.0pF 15.0pF 20.0pF |=|

29、Keyword: Pin | Required: Yes | Description: Associates the components I/O models to its various external | pin names and signal names. | Sub-Params: signal_name, model_name, R_pin, L_pin, C_pin | Usage Rules: All pins on a component must be specified. The first column | must contain the pin name. Th

30、e second column, signal_name, | gives the data book name for the signal on that pin. The | third column, model_name, maps a pin to a specific I/O buffer | model or model selector name. Each model_name must have a| corresponding model or model selector name listed in a Model| or Model Selector keywor

31、d below, unless it is a reserved | model name (POWER, GND, or NC). | The model_name column cannot be used for model or model | selector names that reference Series and Series_switch models. | Each line must contain either three or six columns. A pin | line with three columns only associates the pins

32、 signal and | model. Six columns can be used to override the default | package values (specified under Package) FOR THAT PIN ONLY. | When using six columns, the headers R_pin, L_pin, and C_pin | must be listed. If “NA“ is in columns 4 through 6, the | default packaging values must be used. The heade

33、rs R_pin, | L_pin, and C_pin may be listed in any order. | Column length limits are: | Pin 5 characters max | model_name 40 characters max | signal_name 40 characters max | R_pin 9 characters max | L_pin 9 characters max | C_pin 9 characters max EIA-STD-656-B16|-Pin signal_name model_name R_pin L_pi

34、n C_pin |1 RAS0# Buffer1 200.0m 5.0nH 2.0pF 2 RAS1# Buffer2 209.0m NA 2.5pF 3 EN1# Input1 NA 6.3nH NA 4 A0 3-state 5 D0 I/O1 6 RD# Input2 310.0m 3.0nH 2.0pF 7 WR# Input2 8 A1 I/O2 9 D1 I/O2 10 GND GND 297.0m 6.7nH 3.4pF 11 RDY# Input2 12 GND GND 270.0m 5.3nH 4.0pF | . | . | . 18 Vcc3 POWER 19 NC NC

35、20 Vcc5 POWER 226.0m NA 1.0pF 21 BAD1 Series_switch1 | Illegal assignment 22 BAD2 Series_selector1 | Illegal assignment |=| Keyword: Package Model | Required: No | Description: Indicates the name of the package model to be used for the | component. | Usage Rules: The package model name is limited to

36、 40 characters. Spaces | are allowed in the name. The name should include the company | name or initials to help ensure uniqueness. The EDA tool | will search for a matching package model name as an argument | to a Define Package Model keyword in the current IBIS file | first. If a match is not foun

37、d, the EDA tool will next look | for a match in an external .pkg file. If the matching package | model is in an external .pkg file, it must be located in the | same directory as the .ibs file. The file names of .pkg files | must follow the rules for file names given in Section 3, | GENERAL SYNTAX RU

38、LES AND GUIDELINES. | Other Notes: Use the Package Model keyword within a Component to | indicate which package model should be used for that | component. The specification permits .ibs files to contain | Define Package Model keywords as well. These are described | in the “Package Modeling“ section

39、near the end of this | specification. When package model definitions occur within a | .ibs file, their scope is “local“, i.e., they are known only| within that .ibs file and no other. In addition, within that | .ibs file, they override any globally defined package models | that have the same name. |-Package Model QS-SMT-cer-8-pin-pkgs |=EIA-STD-656-B 17|=| Keywords: Alternate P