EN 60191-6-3-2000 en Mechanical Standardization of Semiconductor Devices - Part 6-3 General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Pa.pdf

《EN 60191-6-3-2000 en Mechanical Standardization of Semiconductor Devices - Part 6-3 General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Pa.pdf》由会员分享，可在线阅读，更多相关《EN 60191-6-3-2000 en Mechanical Standardization of Semiconductor Devices - Part 6-3 General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Pa.pdf（20页珍藏版）》请在麦多课文档分享上搜索。

1、Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) The European Standard EN 60191-6-3:2000 has the status of a Briti

2、sh Standard ICs 31.080.01; 31.240 BS EN IEC 60 1 9 1-6-3 : 2 O O 1 60191-6-3:ZOOO NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW STD-BSI BS EN bOLSL-b-3-ENGL 2001 Lb24bb9 0907023 248 BS EN 60191-6-3:2001 Amd. No. Date National foreword Comments This British Standard is the of

3、ficial English language version of EN 60191-6-3:2000. It is identical with IEC 60191-6-3:2000. The UKparticipation in its preparation was entrusted by Technical Committee EPL47, Mechanical standardization, to Subcommittee EPL147/4, Semiconductors, which has the responsibility to: - - aid enquirers t

4、o understand the text; present to the responsible internationallEuropean committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. - A list of organizations repres

5、ented on this subcommittee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system to the oth

6、er, publications may contain identifiers from both systems. Cross-references Attention is drawn to the fact that CEN and CENELEC Standards normally include an annex which lists normative references to international publications with their corresponding European publications. The British Standards wh

7、ich implement these international or European publications may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include

8、all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. This British Standard, having been prepared under the direction of the Electrotechnical

9、Sector Committee, was published under the authority of the Standards Committee and comes into effect on 15 May 2001 O BSI 05-2001 Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 17 and a back cover. The BSI copyright date displayed in this

10、 document indicates when the document was last issued. ISBN O 580 37243 X STD*BSI BS EN b019L-b-3-ENGL 2001 W Lb24bb9 0907022 384 EUROPEAN STANDARD EN 60191-6-3 NORME EUROPENNE EUROPISCHE NORM December 2000 ICs 31.080.01 English version Mechanical standardization of semiconductor devices Part 6-3: G

11、eneral rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (IEC 60191-6-3:2000) Normalisation mcanique des dispositifs semiconducteurs Halbleiterbauelemente Partie 6-3 : Rgles gnrales pour

12、la prparation des dessins dencombrement des dispositifs semiconducteurs montage en surface - plats quadrangulaires (QFP) Mechanische Normung von Teil 6-3: Allgemeine Regeln fr die Erstellung von Gehusezeichnungen von SMD-Halbleitegehusen - Meverfahren fr QFP-Gehusemae Mthodes de mesure pour les boit

13、iers (CE1 60191-6-312000) (IEC 60191-6-312000) This European Standard was approved by CENELEC on 2000-1 1-01. CENELEC members are bound to comply with the CENICENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any a

14、lteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made b

15、y translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany,

16、Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretar

17、iat: rue de Stassart 35, B - 1050 Brussels Q 2000 CENELEC - Ail rights of exploitation in any form and by any means resewed worldwide for CENELEC members. Ref. No. EN 60191-6-3:2000 E STD*BSI BS EN bOL71-6-3-ENGL 2001 - Lb24bb9 0907023 O10 Page 2 EN 60191-6-3:2000 Foreword The text of document 47D/3

18、70/FDIS, future edition 1 of IEC 60191-6-3, prepared by SC 47D, Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-3 on 2000-1 1-01. The following dates were fixed: - lates

19、t date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement - latest date by which the national standards conflicting with the EN have to be withdrawn Annexes designated “normative“ are part of the body of the standard. In this st

20、andard, annex ZA is normative. Annex i% has been added by CENELEC. Endorsement notice (dop) 2001-08-01 (dow) 2003-1 1-01 The text of the International Standard IEC 60191-6-3:2000 was approved by CENELEC as a European Standard without any modification. STDmBSI BS EN bOLqL-b-3-ENGL 2002 D Lb24bb9 0907

21、024 T57 Page 3 EN 60191-6-3:2000 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) 1 Scope This part of IEC 60191 s

22、tipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC 60191. For dated references, subsequent ame

23、ndments to, or revisions of, any of these publications do not apply. However, parties to agreements based on this part of IEC 60191 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest editio

24、n of the normative document referred to applies. Members of IEC and IS0 maintain registers of currently valid International Standards. IEC 601 91 -6:1990, Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconduc

25、tor device packages 3 Definitions For the purpose of this part of IEC 60191, the definitions of IEC 60191-6 apply. 4 Measuring methods 4.1 The measuring methods described in this standard are for dimension values a) In general, measuring the dimensions shall be made with the semiconductor packages m

26、ounted on printed circuit-board as the guarantee is made to user. b) In general, measurement may be made either by hand or automatically. c) If a specified dimension is difficult to measure, the best alternative measuring method is defined as the formal measuring method. d) The dimensions that canno

27、t be measured unless the package is destroyed may be calculated from other dimensions or replaced by representative values. guaranteed to users on the basis of the following items. Q BSI 05-2001 4.2 Reference characters and drawing a Figure 1 IEC 1671/2000 8 BSI 05-2001 STD-BSI BS EN bOLSL-b-3-ENGL

28、2001 1b24bb9 070702b 82T Page 5 EN 60191-6-3:2000 /- a Seating plane b IEC 1672/2000 Figure 2 O BSI 05-2001 STDmBSI BS EN 60291-b-3-ENGL 2002 2b24bb7 0707027 766 Page 6 EN 60191-6-3:2000 4.3 Datum The datum shall be defined as follows. r IEC 167W2000 Figure 3 Centres of opposite sides of a package,

29、which are defined below, shall be connected together. An angle subtended by the two crossing lines shall be obtained. A difference 190“ - I of the angle from 90“ shall be equally distributed to the sides to obtain rectangular axes. The rectangular axes are depicted as datum lines A and B of the pack

30、age. Description of the centres of sides Even number of leads on a package side Odd number of leads on a package side C 1674/2000 I A centre of facing sides of adjacent leads at a position 0.1 mm inside the top of the leads The centre of leads at a position 0,l mm inside the top of the leads Figure

31、4 O BSI 05-2001 STD-BSI BS EN bLSL-b-3-ENGL 2001 Lb24669 0907028 bT2 Page 7 EN 60191-6-3:2000 4.4 4.4.1 Description a) As to the overall width and overall length, all lead tops should be located within the range t centring on the position which is at a theoretically correct distance of m2 or m2 from

32、 the datum A or B. b) As to the package width and length, the package end-face should be located within the range f centring on the position which is at a theoretically correct distance of m2 or B2 from the datum A or B. Overall width / overall length / Package width D / package length E x4 I I 1 Fi

33、gure 5 /fC 1676/2000 O BSI 05-2001 .- - - STD-BSI BS EN bOlSI-b-3-ENGL 200% lb24bb9 0907029 539 Page 8 EN 60191-6-3:2000 IEC 1677/2000 Figure 6 4.4.2 Measuring method a) HEIHD 1) Put the package on the surface plate to establish the datum reference S. 2) Make the datum A and B coincide with the meas

34、uring reference. 3) Find the logically precise distances HD/2 and HE/2 from the datum A and B. Then check if the tip of every lead on each package side is within the tolerance t (range) specified as the centre. 1) Put the package on the surface plate to establish the datum reference S. 2) Make the d

35、atum A and B coincide with the measuring reference. 3) Find the theoretically precise distances D/2 and E/2 from the datum A and B. Then check if the package edge on each package side is within the tolerance f (range) specified as the centre. b) E/D 4.5 Mounting height A 4.5.1 Description Let the he

36、ight of a package from the seating plane to the top of the package be denoted as the mounting height. The mounting height therefore includes inclination and warping of the package. STD*BSI BS EN bOLSL-b-3-ENGL 2001 Lb24bbS 0907030 250 W Page 9 EN 60191-6-3:2000 IA Figure 7 IEC 167W2000 4.5.2 Measuri

37、ng method a) Put the package on the surface plate to establish the seating plane. From the side or the top, measure the distance to a highest point. b) Let the distance be denoted as the mounting height. O ES1 05-2001 STDeBSI BS EN bOLSL-b-3-ENGL 2001 Lb24bbS 090703L 197 = Page 10 EN 60191-6-3:2000

38、4.6 Stand-off Al 4.6.1 Description Let a distance from the seating plane to the lowest point of a package be denoted as the stand-off. r I t * JEC 1679/2000 Figure 8 4.6.2 Measuring method a) Put the package on the surface plate to establish the reference surface (seating plane). b) Measure a distan

39、ce from the reference surface to the lowest point of the package. 8 BSI 05-2001 STD-BSI BS EN bOL71-6-3-ENGL 2OOL 9 3624663 0707032 023 Pagell EN 60191-6-3:2000 4.7 Body thickness A2 4.7.1 Description The body thickness is defined as a distance between two parallel planes, tangent to the highest and

40、 lowest points of the body. i” ?” IEC 1680/2000 Figure 9 4.7.2 Measuring method a) Put the package which is accurately dimensioned between surface plates which are larger than the package vertically in parallel. Never touch the leads. b) Measure the total thickness including the surface plates with

41、a micrometer and subtract the thickness of surface plates from the total thickness so as to obtain the thickness of the package. 0 BSI 05-2001 STD-BSI BS EN b0171-6-3-ENGL 2OOL 1b24bb7 O707033 TbT Page 12 EN 60191-6-3:ZOOO 4.8 Lead widths b and bl, lead thickness c and ci 4.8.1 Description The outmo

42、st width and outmost thickness in a range of 0,l to 0,25 mm from the tip of the stable shape of the lead having little burrs and crushing shall be defined as the lead width and lead thickness. The lead width and lead thickness, as shown in the right-hand figure, include burrs, crushing, and sagging.

43、 In this case, the outmost width and outmost thickness after surface plating shall be defined as b and c, and the outmost width and outmost thickness plating shall be defined as bl and cl respectively. Figure 10 Section X-X IEC 1681/2000 4.8.2 Measuring method a) Lead widths b and bl 1) Put the pack

44、age on the surface plate. 2) Make the lead centre intersect perpendicularly to the measuring reference. 3) Measure the lead width (shown above) from the upper surface. b) Lead thickness c and cl 1) Put the package on the surface plate. 2) Measure the lead thickness (shown above) from the side. bl an

45、d cl may be measured before plating. 4.8.3 Remarks a) bl and ci may be measured before the lead is processed. If this occurs, after processing, b) The lead thickness may be measured at eight points on the four corners of the package as measure bl and CI at the position within the above range. repres

46、entative values. 8 BSI 05-2001 STD-BSI BS EN 60191-6-3-ENGL 2OOL Lb24bb7 0707034 7Tb Page 13 EN 60191-6-3:2000 4.9 Soldered portion length Lp 4.9.1 Description The distance in a mounting direction from a cross-point (a) of a plane A3from, and in parallel with, the seating plane with an inside surfac

47、e of a descending portion of the lead to a tip (b) of the lead. IEC 1882/2000 Figure 11 4.9.2 Measuring method a) Put the package on the surface plate to establish the datum reference S (seating plane). b) Make the datum parallel with the measuring reference. c) Observe the lead toward the package s

48、ide (in the seating plane direction). Measure positions of points (a) and (b) in the seating plane direction. 4.9.3 Remarks As this measuring method can be done from the side, the values of the leads observable from the side are allowed as representative values. 8 BSI 05-2001 4.10 Positional toleran

49、ce of terminal tips 4.10.1 Description a) Obtain positions of tips of leads at points of 0,l mm inside the tips. b) Obtain differences from the theoretical positions. c) The differences are defined as the positional tolerance of terminal tips. d) The positional tolerance depends on the terminal width. e) The positional tolerance value = (b max. - b nom. + x) /2 n - /fC 1683/2000 Figure 12 I Figure 13 8 BSI 06-2001 . Page 15 STD=BSI BS EN bOLqL-h-3-ENGL 2001 Lb2Ybbq 090703b 779 EN 60191-6-3:2000 4.10.2 Measuring method a)