EN 140401-2009 en Blank Detail Specification Fixed low power film surface mount (SMD) resistors《空白详细规范 表面安装固定低功率膜(SMD)电阻器》.pdf

《EN 140401-2009 en Blank Detail Specification Fixed low power film surface mount (SMD) resistors《空白详细规范 表面安装固定低功率膜(SMD)电阻器》.pdf》由会员分享，可在线阅读，更多相关《EN 140401-2009 en Blank Detail Specification Fixed low power film surface mount (SMD) resistors《空白详细规范 表面安装固定低功率膜(SMD)电阻器》.pdf（34页珍藏版）》请在麦多课文档分享上搜索。

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI British StandardsWB9423_BSI_StandardColCov_noK_AW:BSI FRONT COVERS 5/9/08 12:55 Page 1Blank Detail Specification: Fixedlow power film surface mount(SMD) resistorsBS EN 140401:2009National forewordThi

2、s British Standard is the UK implementation of EN 140401:2009. It super-sedes BS EN 140401:2002 which is withdrawn.The UK participation in its preparation was entrusted to Technical CommitteeEPL/40X, Capacitors and resistors for electronic equipment.A list of organizations represented on this commit

3、tee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2009ISBN 978 0 580 64032 2ICS 31.040.10Compliance with a British Standard cannot confer immunity fromlegal obl

4、igations.This British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 30 June 2009Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 140401:2009EUROPEAN STANDARD EN 140401 NORME EUROPENNE EUROPISCHE NORM April 2009 CENELEC

5、European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: avenue Marnix 17, B - 1000 Brussels 2009 CENELEC - All rights of exploitation in any form and by any means reserved worldwide

6、for CENELEC members. Ref. No. EN 140401:2009 E ICS 31.040.10 Supersedes EN 140401:2002English version Blank Detail Specification: Fixed low power film surface mount (SMD) resistors Spcification particulire cadre: Rsistances fixes couches et faible dissipation pour montage en surface (CMS) Vordruck f

7、r Bauartspezifikation: Oberflchenmontierbare (SMD) Schicht-Festwiderstande niedriger Belastbarkeit This European Standard was approved by CENELEC on 2009-03-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Stand

8、ard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, Fren

9、ch, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium,

10、Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 140401:20

11、09EN 140401:2009 2 Foreword This European Standard was prepared by the Technical Committee CENELEC TC 40XB, Resistors. The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN 140401 on 2009-03-01. This European Standard supersedes EN 140401:2002. Prec

12、eding documents on the subject covered by this specification have been EN 140401:1996, CECC 40 401:1989. Compared to the superseded standard, the following changes have been implemented: modification of the title; introduction of a test on the resistance to electrostatic discharge (ESD) in 1.6 and A

13、nnex A; introduction of description and test methods for lead-free soldering in 1.8, 1.10.3 and Annex A; introduction of code letters for the temperature coefficient (TCR) as in EN 60062:2005; revision of ordering information in 1.9.4; adoption of the IECQ rules of procedure, IEC QC 001002-3; revisi

14、on of the sample quantities and the sequence of tests in Annex A; editorial revision. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2010-03-01 latest date by which the natio

15、nal standards conflicting with the EN have to be withdrawn (dow) 2012-03-01 This specification supports the building of a series of documents describing fixed low power film resistors as follows: EN 60115-1 Fixed resistors for use in electronic equipment Part 1: Generic specification (IEC 60115-1, m

16、od.) EN 140400 Sectional specification: Fixed low power surface mount (SMD) resistors EN 140401-xxx Relevant detail specification(s) written on the basis of this blank detail specification _ BS EN 140401:2009 3 EN 140401:2009 Contents Introduction . 4 1 Characteristics and ratings . 5 1.1 Dimensions

17、 and ratings. 5 1.2 Derating curve . 6 1.3 Resistance range and tolerance on rated resistance . 7 1.3.1 Version A 7 1.3.2 Version E 7 1.4 Variation of resistance with temperature and temperature rise 8 1.5 Climatic categories 8 1.6 Limits for change of resistance at tests . 9 1.7 Non-linearity 9 1.8

18、 Tests related to soldering 10 1.8.1 Severities for solderability testing . 10 1.8.2 Severities for testing resistance to soldering heat . 11 1.9 Marking, packaging and ordering designation 11 1.9.1 Marking of the component 12 1.9.2 Packaging . 12 1.9.3 Marking of the packaging . 12 1.9.4 Ordering i

19、nformation. 12 1.10 Additional information (not for inspection purpose) 13 1.10.1 Storage . 13 1.10.2 Mounting . 13 1.10.3 Soldering process . 13 1.10.4 Use of cleaning solvents 13 2 Quality assessment procedures . 13 2.1 General 13 2.1.1 Zero defect approach . 13 2.1.2 100 % Test . 14 2.1.3 0 Resis

20、tors 14 2.1.4 Certificate of Conformity (CoC) 14 2.1.5 Certified test records 14 2.1.6 Failure rate level . 15 2.2 Qualification approval 15 2.2.1 Version A 15 2.2.2 Version E 15 2.3 Quality conformance inspection 15 2.3.1 Qualification approval according to IEC QC 001002-3:2005, Clause 3 . 15 2.3.2

21、 Technology approval according to IEC QC 001002-3:2005, Clause 6 15 2.3.3 Non-conforming items 16 Annex A (normative) Fixed sample size Qualification Approval and Quality Conformance . Inspection test schedule for fixed low power film resistors 17 Annex B (informative) Letter symbols and abbreviatio

22、ns 27 Bibliography 29 BS EN 140401:2009EN 140401:2009 4 Introduction Blank detail specification A blank detail specification is a supplementary document to the sectional specification and contains requirements for style and layout and minimum content of detail specifications. Detail specifications n

23、ot complying with these requirements shall not be considered as being in accordance with European standards nor shall they be so described. In the preparation of the detail specification the content of EN 140400:2003, 1.2 shall be taken into account. The detail specification should be written by usi

24、ng the preferred values given in EN 140400. The detail specification should contain a table of contents prior the first page of the actual specification. For the use of SI units refer to ISO 1000, for the use of letter symbols to be used in electrical technology, refer to EN 60027-1. Notes in this d

25、ocument shall be considered as guidance and are not part of the detail specification itself. Identification of the detail specification and the component The first page of the detail specification should have the layout recommended on page 5. The numbers in square brackets correspond to the indicati

26、ons to be completed thereunder: 1 the name of the Standardisation Organisation under whose authority the detail specification is published and if applicable, the organisation from whom the detail specification is available; 2 the CECC symbol and the number allocated to the detail specification by th

27、e CENELEC General Secretariat; 3 the number and issue number of the EN generic and sectional specification as relevant; also national reference if different; 4 the national number of the detail specification, date of issue and any further information required by the national system, together with an

28、y amendment numbers, if different from the EN number; 5 a brief description of the component or range of components; 6 information on typical construction (where applicable); 7 an outline drawing with the main dimensions which are of importance for interchangeability and/or reference to the appropri

29、ate national or international document for outlines. Alternatively, this drawing may be given in an annex to the detail specification; 8 the level of quality assessment covered by the detail specification. For 5 and 6 the text to be given in the detail specification should be suitable for an entry i

30、n a register of approvals and the “CENELEC Catalogue of European Standards”. BS EN 140401:2009 5 EN 140401:2009 Specification available from: 1EN 140401- (Specification number) 2Electronic components of assessed quality in accordance with: 3 EN 60115-1:2001 + A1:2001 + A11:2007 EN 140400:2003 Issue

31、4(Month) (Year) 7 Other shapes are permitted within the given dimensions. Figure 1 Outline and dimensions (see Table 1) Fixed low power film surface mount (SMD) resistors, Style 5(Description of the component) 6Assessment level EZ a8Version A: with 100 %-test Version E: with failure rate level and 1

32、00 %-test Stability classes aFor explanation on assessment level EZ see 2.1.1 NOTE Version E is optional. 1 Characteristics and ratings Various parameters of this component are precisely defined in this specification. Unspecified parameters may vary from one component to another. 1.1 Dimensions and

33、ratings Table 1 Style and dimensions Style Length L mm mm mm mm Mass amg metric x min. max. min. max. min. max. min. max. max. aFor information only. xOptional column for additional information (e.g. size code). NOTE See EN 140400:2003, 1.2 a). Information about manufacturers who have components qua

34、lified to this detail specification is available in the approvals section of the website http:/www.iecq.org. BS EN 140401:2009EN 140401:2009 6 Table 2a Ratings Style x Rated dissipation P70 mW Limiting element voltaged.c. or a.c. (r.m.s.) UmaxV Insulation voltage d.c. or a.c. (peak) UinsV 1 min cont

35、inuous xOptional column for additional information (e.g. stability class, rated dissipation at other ambient temperature than 70 C) NOTE 1 See EN 140400:2003, 1.2 g), h), i). NOTE 2 Should it be necessary to control further parameters, a more detailed specification should be used. Then the additiona

36、l test method(s) shall be fully described and appropriate limits and inspection levels (IL) shall be specified. Table 2b Ratings for 0 resistors Style Maximum current Imax A Maximum resistance Rres maxm Insulation voltage d.c. or a.c. (peak) UinsV 1 min continuous NOTE Table 2b is optional. 1.2 Dera

37、ting curve Resistors covered by this specification are derated according to the following diagram: Ambient temperature aPercentage ofrated dissipation0 %60 %40 %20 %100 %80 %70 CLower category temperature (LCT) Upper category temperature (UCT)Figure 2 Derating curve NOTE 1 See EN 140400:2003, 1.2 g)

38、. NOTE 2 A larger area of operation may be given in the detail specification, provided it includes all the area given above. BS EN 140401:2009 7 EN 140401:2009 1.3 Resistance range and tolerance on rated resistance 1.3.1 Version A The following combinations of temperature coefficient and tolerance o

39、n rated resistance may be approved only. Products from this extent shall be used for the qualification approval according to 2.2.1 and for the quality conformance inspection according to 2.3. Resistance values of an E-series according to IEC 60063 shall be used. The qualification of resistance value

40、s below or beyond the specified resistance values is permitted if they fulfil the requirements of the closest stability class (e.g. Style shall fulfil the requirements of stability class ). Table 3a Resistance range and tolerance on rated resistance for version A Style Tolerance on rated resistance

41、Temperature coefficient 10-6/K Resistance range Stability class b% Code a0 resistors according to Table 2b for styles aCode letters according to EN 60062:2005. bFor the category temperatures of stability classes refer to Table 6. 1.3.2 Version E The following combinations of temperature coefficient,

42、 tolerance on rated resistance, resistance range and E-series according to IEC 60063 are permitted only. Products from this extent shall be used for the qualification approval according to 2.2.2 and for the quality conformance inspection according to 2.3 and are permitted only: Table 3b Resistance r

43、ange and tolerance on rated resistance for version E Style Tolerance on rated resistance Temperature coefficient 10-6/K Resistance range Stability class bE series % Code a0 resistors according to Table 2b for styles aCode letters according to EN 60062:2005. bFor the category temperatures of stabilit

44、y classes, refer to Table 6. NOTE Table 3b is only required for version E and should be a subset of Table 3a. BS EN 140401:2009EN 140401:2009 8 1.4 Variation of resistance with temperature and temperature rise Table 4 Temperature coefficients and permissible change of resistance Temperature coeffici

45、ent Limit of resistance change R/R % 10-6/K CodeaCodebLCT / Reference temperatureC Reference temperature / UCTC - / 20 - / 20 20 / 20 / aCode letters according to EN 60062:2005. bHistorical code letters according to , for information only. NOTE 1 Second code column with historical reference is optio

46、nal. NOTE 2 See EN 140400:2003, 1.2 f). Table 5 Limit of temperature rise Stability class Limit of temperature rise at rated dissipation Tr Tr 1.5 Climatic categories NOTE See EN 140400:2003, 1.2 b). Table 6 Climatic categories Stability class Climatic category LCT / UCT / Duration / / / / BS EN 140

47、401:2009 9 EN 140401:2009 1.6 Limits for change of resistance at tests NOTE See EN 140400:2003, 1.2 c). Table 7a Limits for change of resistance at tests Stability class Limit of resistance change R/R EN 60115-1a4.23 Climatic sequence4.24 Damp heat, steady state4.25.3 Endurance at upper categorytemp

48、erature EN 60115-1a4.25.1 Endurance at 70 C EN 60115-1a4.13 Overload 4.18 Resistance to soldering heat 4.19 Rapid change of temperature, 5 cycles 4.22 Vibration 4.33 Substrate bending 1 000 h Extended, 8 000 h aEN 60115-1:2001 + A1:2001 + A11:2007. Table 7b Limits for change of resistance at tests S

49、tability class Limit of resistance change R/R EN 60115-1a4.19 Rapid change of temperature, 100 cycles EN 60115-1a4.27 Single pulse high voltage overload test EN 60115-1a4.27 Periodic electric overload EN 60115-1a4.40 Electrostatic discharge baEN 60115-1:2001 + A1:2001 + A11:2007. bHuman body model (HBM) according to EN 61340-3-1, 3 positive + 3 negative discharges.