ECA RS-448-2-1980 Test Standard for Electromechanical Components Environmental Effects of Machine Soldering (Addendum 2 to RS-448)《机械钎焊的机电组件环境影响的测试标准 RS-448标准附录2》.pdf

《ECA RS-448-2-1980 Test Standard for Electromechanical Components Environmental Effects of Machine Soldering (Addendum 2 to RS-448)《机械钎焊的机电组件环境影响的测试标准 RS-448标准附录2》.pdf》由会员分享，可在线阅读，更多相关《ECA RS-448-2-1980 Test Standard for Electromechanical Components Environmental Effects of Machine Soldering (Addendum 2 to RS-448)《机械钎焊的机电组件环境影响的测试标准 RS-448标准附录2》.pdf（9页珍藏版）》请在麦多课文档分享上搜索。

1、.-. - 1 ANSI/EIA RS-448-2 - 1980 APPROVED MARCH 14, 1980 EIA STANDARD TEST STANDARD I FOR ELECTROMECHANICAL COMPONENTS ENVIRONMENTAL EFFECTS 61 S-44 8 - 2 OF MACHINE SOLDERING 1 (Addendum No. 2 to RS-448) MARCH 1980 Engneering Department ELECTRONIC INDUSTRI8S ASSOCIATION EIA 448-2 0 3234600 O069056

2、9 c. i. NOTICE EIA Engineering standards are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, faci- litating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the

3、proper product for his particular need. Existence of such standards shall not in any respect preclude any member or non-member of EIA from manufacturing or selling products not conforming to such standards, nor shall the existence of such standards preclude their voluntary use by those other than EI

4、A members, whether the standard is to be used either domestically or internationally. Recommended standards are adopted by EIA without regard to whether or not their adoption may involve patents on articles, materials, or processes. By such action. EIA does not assume any liaibility to any patent ow

5、ner, nor does it assume any obligation whatever to parties adopting the recommended standard. This EIA Recommended Standard is considered to have. international stan- dardization implications, but the IEC (or 150) activity has not progressed to the point where a valid comparison between the EIA Reco

6、mmended Standard and the IEC (or ISO) Recommendation can be made. O Electronic Inclustrieu Aseoclatiofr rlghtr reser e.g., wave soldering. 2.5 Cleaninq - The removal of flux and other residue from the printed wiring board assembly using chemical and/or aqueous solvent systems. R S -448 -2 Addendum 2

7、 Page 2 3. 3.1 3.2 3.2.1 3.2.2 3.2.3 3.3 4. 4.1 4.2 4.2.1 4.2.2 4.2.3 4.2.4 4.2.5 ELA 448-2 80 W 3234b00 OObObO O EQUIPMENT A conventional wave soldering machine with provisions for fluxing and preheating shall be used. Production equipment outlined in RS-445 may be used. However, in the case of con

8、flict, this standard shall take precedence, Optional Equipment - In lieu of a wave soldering machine, the following may be used, with all steps intended to simulate the operation of a wave soldering machine as much as possible. . Fluxinq System - A controlled foam fluxing system capable of producing

9、 the fluxing action required, Preheating - A suitable means to elevate the printed wiring board assembly temperature as specified. Solderinq - A solder pot of sufficient size to both allow dipping of the printed wiring board and contain sufficient volume of molten solder to insure uniform temperatur

10、e of the solder when the printed wiring board is dipped. Cleaninq - Suitable containers for the specified cleaning solutions and means to implement the vapor and/or spray portions of the test. MATERIALS Solder - To be composition SN60B or SN63B per ANSI/ASTM 832-76. Printed Wirinq Board - The printe

11、d wiring board shall conform to the following details unless otherwise Specified. Printed Wirinq Board Material - G10 epoxy glass or FR-4 base material with 1 OZ. copper. Physical Size & Confiquration - The physical size and configuration shall be such that the desired fluxing action shall be achiev

12、ed. Mountinq Hole Diameter - The mounting hole diameter shall be the minimum diameter sgecified by the manufacturer. In the absence of a specified hole diameter, the followhg formula may be used: Min, Hole Dia. = Max, Lead Dia. (Max. dimension across corners for rectangular leads) -t Min. Drill Tole

13、rance. (Adjust to next larger standard drill size.) t Pad (Foil) Size - Unless otherwise specified, the pad should completely surround and abut on the mounting hole. The minimum annular ring surrounding the terminal hole shall be 0,015“ for unsupported holes and 0.00511 for plated through holes. Pri

14、nted Wirinq Board Preparations - The printed wiring board shall be prepared in such a manner as to insure a clean and readily solderable surface at the time the test is performed. 6 O o EIA 448-2 80 = 3234600 00690bL 2 = Flux Type Activated Resin (RA) Organic Acid a Applicable Spec if ication MIL-S-

15、14256 (None) RS-448-2 Addendum 2 Page 3 4.3 Fluxes - Per Table I. 5. TABLE I 1 TEST CONDITIONS The test conditions shall be derived from Table II with the specified options indicated for type of flux, fluxing, solder time, and cleaning method (see component de tail spec if ication). TABLE II I. II.

16、III. IV. Fluxing (See Table I A. B. Preheat Soldering 1. 2 Seconds 2. 4 Seconds 3. 6 Seconds 4. 8 Seconds 5. 10 Seconds Cleaning A. Immersion B. Spray C. Vapor and Spray Flux touches component body (See 6.2, A) Flux does not touch component body (See 6.2, B) EIA 448-2 80 m 3234b00 00b70b2 4 m RS-448

17、-2 Addendum 2 Page 4 TEST PROCEDURE Unless otherwise specified, parts shall be checked in an “as received“ condition from the supplier, and care shall be exercised to prevent contamination of the surfaces to be tested by grease, perspirants, etc, Under all soldering test conditions, it is assumed th

18、at a clean, fully solderable test board is used. 6.1 Component Mountinq - Components shall be mounted in such a manner as to achieve the fluxing action required under 6.2. More than one and/or different styles of test component may be mounted to a single printed wiring board, 6.2 Fluxinq A, Printed

19、wiring board with the test components mounted shall be fluxed in such a manner that the foam will contact both the bottom surface of the printed wiring board and the bottom surface of the test component within the Immediate are8 of its terminals. B. Printed wiring board with the test components moun

20、ted shall be fluxed in such a manner that the foam will evenly contact the bottom surface of the printed wiring board but does not come in contact with the body of the component being tested. 6.3 Preheat - The printed wiring board assembly shall be subjected to an evenly dis tribute d preheating, Pr

21、eheat temperature shall be determined by measuring the to komponent period of 30-60 seconds immediately prior to soldering or entering the solder wave, side) side of the printed wiring board and be meintained at 93 1: B s C for a 6.4 Soldering - The soldering of the printed wiring board assembly sha

22、ll be perfoormed immediately after preheating with a soldering temperature of 260 C. Component terminal soldering time shall be chosen from Table II, Time of soldering is defined as the time required in the molten solder for each terminal on the component, 6.5 Cleaninq Solution - The following clean

23、ing solutions shall be used: A. 111 Trichlorethane B. Freont1 TF or TE C, Isopropyl Alcohol D. Applicable to Activated Resin Fluges I * Deionized Water/Detergent - Applicable to Organic Acid Fluxes 1. 90% Deionized Water, 10% Alkaline Detergent (45% Butyl Cellosolve, 45% Monoethanolamine, 10% Water)

24、 by volume 2. Deionized Water Rinse Jt Du Ponts Registered Trademark * I e O e 7. 8. 8.1 8.2 8.3 8.4 8.5 8.6 9. 7 EIA 448-2 80 I 3234600 00b9Bb3 b I RS-448-2 Addendum 2 Page 5 The method of cleaning shall be chosen from Table II and shall be done in such a manner as to remove all visible flux and ot

25、her soldering residue from the printed wiring board and test component. One test board assembly per cleaning solution shall be used. EVALUATION The printed wiring board and the components to be tested shall be fluxed, preheated, machine soldered, and cleaned as specified. Defects such as pin holes,

26、dewetted areas, or uticoated base metal on the component terminal shall not constitute more than 10% of the circumference (dia.) of said terminal(s). Solderability examination shall be limited to the interface of the terminal and soldered side of the printed wiring board. The component part shall no

27、t exhibit any loose or deformed parts. All markings shall still be readily visible, and the component shall meet all operating characteristics as defined in the detail specification. Additional evaluation shall be performed as outlined in the detail spec i fi cat i on. SUMMARY The following details

28、shall be specified in the detailed specification: Number of Test Samples - As specified in the detailed specification. Fluxing - Method A or Method B must be specified (See 6.2). Solderin Time - 2, 4, 6, 8, or 10 seconds (Methods 1, 2, 3, 4, or 5) must be -6.4). Cleaninq - Method A, 8, or C (Immersi

29、on, Spray, or Vapor and Spray) must be specified. All four solutions must be used in each method, unless otherwise specified (See 6.5). Evaluation Means or Criteria - As specified in the detailed specification. Aqinq - Special environmental conditions which may deteriorate the solderability of compo

30、nents should be considered and specified as required. NOTES The use of certain msterials listed in this Stmdard, such as leed contained in solder, 111 Trichlorethane and the Freon family are, or may be, controlled or regulated through actions of OSHA or EPA. This standard does not contain details or requirements of such regulation or control.